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CWFA205: WiFi+BT (2011.11.25)
CWFA205 provides a complete 2.4GHz WLAN solution in an ultra compact package. Also, this chip is designed for ease of use; all the critical matching and harmonic filters are embedded. In addition, the antenna port is set at 50Ω for most of typical antenna |
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GPS SiP Module (2011.11.25)
CGPA104 is a complete navigation system built on a new SiRFstarIV and other specifications of key components for deriving highest performance in GPS application. These combinations are resulted in higher sensitivity, faster first fix, system stability in outdoor environment |
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CGPA10x: GPS SiP (2011.11.24)
CGPA10x is a complete navigation system built on a new SiRFstarIV and other specifications of key components for deriving highest performance in GPS application. These combinations are resulted in higher sensitivity, faster first fix, system stability in outdoor environment |
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CWFC10x：Mobile AP/Router (2011.06.20)
CWFC10x is an IEEE802.11b/g/n AP/Router, which features compact size with 2 fast Ethernet ports. It provides a powerful high-speed wireless connection for wireless-enabled devices to roam and connect easily and freely. |
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CT49 Memory SiP NAND + DDR3 (2011.06.17)
CT49 Memory SiP is a Multi Chip Package Memory (MCP) that integrated NAND Flash and DDR3 SDRAM by advanced SiP (System-in-a-Package) technology. CT49 Memory SiP offers space saving advantage that could miniaturize your portable device |
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CT84 Memory SiP DDR3 Stack (2011.06.17)
CT84 Memory SiP is a Multi Chip Package Memory (MCP) that integrated DDR3 SDRAM- stacked by advanced SiP (System-in-a-Package) technology. CT84 Memory SiP offers space saving advantage that could miniaturize your portable device |
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CT92 Memory SiP Mobile DDR Stack (2011.06.17)
CT92 Memory SiP is a Multi Chip Package Memory (MCP) that integrated Mobile DDR SDRAM-stacked by advanced SiP (System-in-a-Package) technology. CT92 Memory SiP offers space saving advantage that could miniaturize your portable device |
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鉅景科技推出9x9mm Memory MCP產品 (2008.04.15)
鉅景科技(ChipSiP)因應市場產品微型化需求，於四月中將推出更小包裝Memory MCP(9x9x1.2mm)應用於超薄型及多功能數位相機(DSC)市場。擁有豐富的SiP與Memory MCP研發經驗與技術，鉅景10x13mm MCP在2006年開始導入台灣數位相機ODM大廠，並Design Win至知名日系相機品牌，2007出貨量達300萬顆 |
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鉅景 (2008.03.11)
著眼於科技隨身化的潮流，鉅景科技於2002年以”Chip of SiP”構建元件微型化的品牌核心價值，以全方位系統解決方案，運用封裝技術，創造最小、最易於整合之記憶體、邏輯、無線通訊的SiP元件，充分滿足未來輕薄短小的隨身化需求 |
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鉅景推出全系列手機MCP整合方案 (2007.10.05)
針對手機市場不同記憶體容量組合、低耗能與體積小之需求，鉅景科技於十月份陸續推出CT71系列 Memory MCP產品，供客戶作平台測試與驗證。其整合NOR Flash與pSRAM記憶體，提供多種容量組合包括32/64/128Mb NOR Flash搭配4/8/16/32Mb pSRAM，並具有1.8V與3V不同電壓之產品，符合客戶不同產品需求 |
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因應市場需求 鉅景進軍手機MCP市場 (2007.03.29)
根據Portelligent最近發佈的一項報告，目前手機、數位相機和MP3播放器等可攜式多媒體產品，採用Memory MCP（多晶片封裝記憶體整合元件）的比例幾乎已達到巔峰。其中手機採用MCP的比例在2004年就達到了90%，現正朝著採用2個或更多MCP方向發展，以達到產品薄型化與多功能化之目標 |
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台北國際電腦展後報導 (2006.07.06)
已經穩居全球第二大電腦展的台北國際電腦展（Computex），2006年於6月6日～6月9日舉辦，參展廠商家數達1312家、使用攤位2907個，都創下新高。國外買主人數達3.02萬人，較去年成長7.8%，加上專業人士及開放民眾入場參觀，總計參觀人數13萬人，也略高於原先預期 |
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鉅景科技Memory MCP 適合薄型化產品設計 (2006.02.10)
鉅景科技(Chipsip)宣布該公司的CT47568566X-G產品，成功導入多家國內一線數位相機大廠設計，並將於今年三月份試產，預計第二季開始量產；去年受到日本數位相機薄型化設計的需求風潮，國內將提升薄型的出貨比例至30%以上，鉅景的CT47568566X-G為提供給薄型數位相機使用的Memory MCP，符合歐盟RoHS規範，被廣泛應用在數位相機等多媒體產品上 |
