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Q1 2017 Taiwan IC Revenue Decline 11.3% On-quarter (2017.05.19)
The TSIA survey showed that Q1 2017 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled NT$571.4 billion(US$18.3B) (11.3% decline on-quarter and up 5.0% on-year).
Separately, with NT$139 |
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Global Silicon Wafer Area Shipments Increases 12.6% YoY (2017.05.17)
Worldwide silicon wafer area shipments increased during the first quarter 2017 when compared to fourth quarter 2016 area shipments according to the SEMI Silicon Manufacturers Group (SMG).
Total silicon wafer area shipments were 2,858 million square inches during the most recent quarter, a 3 |
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Worldwide Semiconductor Revenue Grew 2.6% in 2016 (2017.05.16)
Worldwide semiconductor revenue totaled $343.5 billion in 2016, a 2.6 percent increase from 2015 revenue of $334.9 billion, according to final results by Gartner, Inc. The top 25 semiconductor vendors' combined revenue increased 10 |
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TSMC’s Net Revenues for April 2017 Decreases of 33.8% from March (2017.05.11)
TAIPEI, Taiwan - TSMC yesterday announced its net revenues for April 2017, were approximately NT$56.87 billion, a decrease of 33.8 percent from March 2017 and a decrease of 14.9 percent from April 2016. However, its revenues for January through April 2017 totaled NT$290 |
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Samsung Poised to Become World’s Largest Semi Supplier in 2Q17, IC Insight Says (2017.05.02)
IC Insight reported that if memory market prices continue to hold or increase through 2Q17 and the balance of this year, Samsung could charge into the top spot and displace Intel, which has held the #1 ranking since 1993.
Using the mid range sales guidance set by Intel for 2Q17, and a modest, yet typical, 2Q sales increase of 7 |
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Samsung Completes Qualification of Its 2nd Generation 10nm Process Technology (2017.04.19)
Samsung Electronics announced today that its second generation 10-nanometer (nm) FinFET process technology, 10LPP (Low Power Plus), has been qualified and is ready for production. With further enhancement in 3D FinFET structure, 10LPP allows up to 10-percent higher performance or 15-percent lower power consumption compared to the first generation 10LPE (Low-Power Early) process with the same area scaling |
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Foreign Fabs in China to Compel Country’s Domestic Foundries to Expedite Their 28nm Production (2017.04.10)
According to the global market intelligence firm TrendForce, Semiconductor Manufacturing International Corporation (SMIC) and Shanghai Huali Microelectronics Corporation (HMLC) are the two leaders among Chinese foundries in the development of the 28nm processing |
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Combined Sales for Optoelectronics, Sensors and Actuators, Discrete ICs Increase 2% in 2016 (2017.04.06)
Combined sales for optoelectronics, sensors and actuators, and discrete semiconductors increased 2% in 2016 to reach a seventh consecutive record-high level of $67.9 billion, but growth rates in the three market segments were all over the map last year |
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Global Semiconductor Materials Market Increases 2.4% in 2016 (2017.04.04)
SEMI announced that the global semiconductor materials market increased 2.4 percent in 2016 compared to 2015 while worldwide semiconductor revenues increased 1.1 percent.
According to the SEMI Material Market Data Subscription, total wafer fabrication materials and packaging materials were $24 |
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U.S. Companies Still Hold Largest Share of Fabless Company IC Sales (2017.03.17)
According to IC Insights that fabless IC suppliers represented 30% of the world’s IC sales in 2016 (up from only 18% ten years earlier in 2006). As the name implies, fabless IC companies do not have an IC fabrication facility of their own |
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UMC and Synopsys Collaboration Speeds 14-nm Custom Design (2017.03.15)
HSINCHU, Taiwan - United Microelectronics Corporation (UMC) and Synopsys today announced that the two companies have worked together to enable Synopsys Custom Compiler and Laker custom design tools to be used with UMC's 14-nanometer (nm) FinFET process |
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Analog Bits Announces Mixed Signal Design Kits for 7nm at TSMC Technology Symposium (2017.03.14)
Analog Bits today announced availability of front-end design kits which enable use of low power IP on TSMC's latest 7nm process nodes. These design kits provide customers with early access to Analog Bits' latest low-power IP for SERDES, PLL, PVT sensors and POR - which are already shipping in other TSMC nodes such as 16FFC and 16FFP which will be demonstrated at the Symposium |
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Commodity-filled Discretes Devices Accounted for 44% of All Semiconductor Unit Shipments in 2016 (2017.03.10)
Annual total semiconductor unit shipments (integrated circuits and opto-sensor-discrete, or O-S-D, devices) are forecast to continue their upward march in the next five years and are now expected to top one trillion units for the first time in 2018, according to the IC Insights |
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Taiwan's Semiconductor Industry to Continue Outperform the Global Average in 2017 (2017.03.06)
Bolstered by the increased demand for smartphone ICs in the second quarter of 2016, Taiwan's semiconductor industry as a whole managed to witness a stronger year-on-year growth in 2016, higher than the global average, according to Taipei-based IT research institute MIC (Market Intelligence & Consulting Institute) |
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Intel, GlobalFoundries, and ST Are Forecast to Increase Capex spending by 25% or More (2017.03.06)
According to IC Insights that eleven leading semiconductor companies are forecast to have semiconductor capital expenditure budgets greater than $1.0 billion in 2017, and account for 78% of total worldwide semiconductor industry capital spending this year |
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TSMC's 5nm Process Scheduled to Enter Risk Production in 2019 (2017.02.24)
TAIPEI, Taiwan - TSMC Co-CEO Mark Liu said yesterday that TSMC will take the lead in providing the 5nm node process technology. The company is officially entering the technology development stage and scheduled to enter risk production in the first half of 2019, at least six months ahead of original schedule |
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Samsung Launches Premium Exynos 9 Series Processor Using10nm FinFET Process Technology (2017.02.23)
Samsung Electronics today announced the launch of its latest premium application processor (AP), the Exynos 9 Series 8895. This is Samsung’s first processor chipset to take advantage of the most advanced and industry leading 10-nanometer (nm) FinFET process technology with improved 3D transistor structure, which allows up to 27% higher performance while consuming 40% less power when compared to 14nm technology |
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Q4 2016 Taiwan IC Revenue Down 2.3% QoQ and 14.4% Increase YoY (2017.02.20)
TAIPEI, Taiwan - According to the TSIA survey showed that Q4 2016 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled NT$644.2 billion(US$19.9B), down 2.3% on-quarter and 14.4% increase on-year |
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Intel Top All Chip companies in R&D Expenditures and TSMC Ranks Sixth in 2016 (2017.02.17)
According to the 20th anniversary 2017 edition of The McClean Report from IC Insights, Intel continued to top all other chip companies in R&D expenditures in 2016 with spending that reached $12.7 billion and represented 22.4% of its semiconductor sales last year |
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Andes Technology Eyes to Become the Top 4 Silicon IP Provider in Three Years (2017.02.14)
TAIPEI, Taiwan - Andes Technology Corporation, a Taiwan-based Silicon Intellectual Property provider, said it hopes to become the fourth-largest IP vendor in the market within three years.
Andes currently is ranked the fifth IP company that accounted for about 2 |
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