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GLOBALFOUNDRIES 12-Inch Wafer Production Line in Chengdu Commences Operation (2017.02.13)
GLOBALFOUNDRIES published its global manufacturing business expansion plan today. According to the cooperation plan of the two parties, the Chengdu plant will start production in Q4 of 2018, with fabrication of the advanced 22FDX to begin in Q4 of 2019 |
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GLOBALFOUNDRIES to Expand Its Manufacturing Footprint in China and Singapore (2017.02.10)
GLOBALFOUNDRIES today announced plans to expand its global manufacturing footprint in response to growing customer demand for its comprehensive and differentiated technology portfolio. The company is expanding its footprint in China with a fab in Chengdu, and adding capacity for mainstream technologies in Singapore, and investing in its existing fabs in the United States and Germany |
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eMemory Qualified NeoFuse in TSMC 16FFC Process (2017.02.08)
HSINCHU, Taiwan – Taiwanese NVM IP provider eMemory announces the availability of NeoFuse technology, qualified in TSMC’s 16nm FinFET Compact (16FFC) process. Customers have already embedded the NeoFuse IP for product tape-out |
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Samsung and Apple Continued to as Top Semiconductor Customers in 2016, Gartner Says (2017.02.02)
Samsung Electronics and Apple remained the top two semiconductor chip buyers in 2016, representing 18.2 percent of the total worldwide market, according to Gartner, Inc. Samsung and Apple together consumed $61.7 billion of semiconductors in 2016, an increase of $0 |
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Semiconductor Revenue Forecast to Grow 7.2% in 2017, Gartner Says (2017.01.23)
Worldwide semiconductor revenue is forecast to total $364.1 billion in 2017, an increase of 7.2 percent from 2016, according to Gartner, Inc. This represents a complete turnaround for the semiconductor industry as the market experienced 1 |
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TSMC Settles Its 5nm Production Base Down (2017.01.19)
TAIPEI, Taiwan - Taiwan's Environmental Protection Agency(EPA) yesterday passed an environmental assessment of TSMC's 5-nanometer production base in Tainan, Taiwan. TSMC said, in the best circumstance, the 5nm manufacturing base will start construction this year, and scheduled to enter mass production in the 2020 |
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TSMC Holds a 59% Marketshare of The IC Foundry Market in 2016 (2017.01.13)
The pure-play foundry market is forecast to play an increasingly stronger role in the worldwide IC market during the next five years, according to IC Insights’ new 2017 McClean Report. And the “Big 4” pure-play foundries (i |
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TSMC: Taiwan Is Still the Best Manufacturing Base (2017.01.12)
TAIPEI, Taiwan – Morris Chang, chairman of TSMC, said in the fourth-quarter investor conference today that he did not rule out the possibility of setting a manufacturing plant in the United States, but for now, Taiwan is still the best place for TSMC |
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Researchers Create Practical and Versatile Microscopic Optomechancial Device (2017.01.11)
Researchers have developed a new type of optomechanical device that uses a microscopic silicon disk to confine optical and mechanical waves. The new device is highly customizable and compatible with commercial manufacturing processes, making it a practical solution for improving sensors that detect force and movement |
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Imec and Besi Demonstrate Long-Term Reliability of Ni-Cu-Ag Plated Solar Modules (2017.01.03)
imec and BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment for the semiconductor industry, announced that they have demonstrated long-term reliability in five full size 60-cells Nickel/Copper/Silver (Ni/Cu/Ag) plated solar cell modules, confirming the industrial value of this metallization technology |
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TrendForce Expects NAND Flash Prices to Keep Rising During 2017 (2016.12.21)
The global NAND Flash industry will see an annual increase of just 6% in its total wafer capacity in 2017, according to analysis by DRAMeXchange, a division of TrendForce.
DRAMeXchange noted, as the pace of the industry-wide transition to 3D-NAND architecture accelerates, supply of 2D-NAND memory will drop sharply, leading to shortages next year |
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Memory Market to Increase 10% in 2017, IC Insights Says (2016.12.21)
According to IC Insights, the total memory market still down 1% yearly in 2016, and will increase 10% in 2017 to a new record high of $85.3 billion as gains in average selling prices for DRAM and NAND flash.
IC Insights pointed, after increasing by more than 20% in both 2013 and 2014, the memory market fell upon difficult times in 2015 |
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Toshiba Expands Line-up of Embedded NAND Flash Memory Products for Automotive Applications (2016.12.20)
Toshiba Corporation’s Storage & Electronic Devices Solutions Company announced the launch of JEDEC e∙MMC Version 5.1 compliant embedded NAND flash memory products supporting AEC-Q100 Grade2 requirements. The line-up offers densities of 8GB, 16GB, 32GB and 64GB |
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China’s National IC Fund to Focus on Fabless IC Design (2016.12.19)
China’s National Integrated Circuitry Investment Fund (here referred to as “National IC Fund”) has committed to invest nearly RMB 70 billion into the domestic semiconductor sector since its creation in 2015. Approximately 60% of the committed investment amount has been allocated to building semiconductor wafer fabs, according to TrendForce’s analysis |
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Only DRAM Suppliers and Top Foundries Use 300mm Wafers (2016.12.19)
According to IC Insights’ latest report, number of IC manufacturers using 300mm wafers less than half using 200mm wafers, and is becoming top-heavy.
IC Insights said, prior to 2008, the 200mm wafer was used in more cases for manufacturing ICs than any other wafer size |
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New iCE40 UltraPlus Accelerate Innovation in Smartphones and IoT Devices (2016.12.13)
Lattice Semiconductor Corporation announced its new iCE40 UltraPlus FPGA devices, one of the industry’s most energy-efficient & programmable mobile heterogeneous computing (MHC) solutions. This latest addition to the iCE40 Ultra family delivers eight times more memory (1 |
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Shortage of NAND Flash to Cause Prices of SSDs and EMMCs to Rise by Over 10% in Q1 2017 (2016.12.12)
DRAMeXchange, a division of TrendForce, reports that the global shortage of NAND Flash has reached its most severe phase for 2016 in this fourth quarter. Factors that aggravate the shortage include strong smartphone shipments, growing SSD demand and the increase in the average memory density of eMMCs and eMCPs |
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Renesas Announces World’s First Fin-Shaped MONOS Flash Memory Cells for MCUs in 16/14nm (2016.12.07)
Renesas Electronics Corporation today announced its successful development of the world’s first split-gate metal-oxide nitride oxide silicon (SG-MONOS) flash memory cells employing transistors with fin-shape for use in microcontrollers (MCUs) with on-chip flash memory having a circuit linewidth of 16 to 14 nanometer (nm) or finer |
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Imec Demonstrates World’s First Vertically Stacked Gate-all-Around Si Nanowire CMOS Transistors (2016.12.07)
At IEEE IEDM conference, imec reported for the first time the CMOS integration of vertically stacked gate-all-around (GAA) silicon nanowire MOSFETs. Key in the integration scheme is a dual-work-function metal gate enabling matched threshold voltages for the n- and p-type devices |
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Toshiba Launches 1.3A LDO Regulator with the Industry's Leading-class Small Package (2016.12.05)
Toshiba Corporation’s Storage & Electronic Devices Solutions Company today announced the launch of a 1.3A output current CMOS LDO regulator, TCR13AGADJ, for use in the power supplies of mobile devices, housed in the industry’s leading-class small package |
