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Science and Technology
Allusion |
Power management is a good helper - ACPI
The ACPI specification enables the operating system, the central processing unit and peripheral equipment to integrate and exchange power usage message, simple and more effective co-management power.
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Winbond Releases 2Gb NAND+2Gb LPDDR4x Multi-Chip Package for 5G CPE Modems (2019.07.03)
TAICHUNG CITY, Taiwan-- Winbond Electronics today announced the launch of a new 1.8V 2Gb+2Gb NAND Flash and LPDDR4x memory product in a compact 8.0mm x 9.5mm x 0.8mm multi-chip package (MCP).
The new W71NW20KK1KW product, which combines robust Single Level Cell (SLC) NAND Flash and high-speed |
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Toshiba Recovering Slower Than Expected from the Power Outage, with 3Q Wafer Quotes Under Pressure (2019.06.28)
Toshiba Memory Corp. (TMC) reported that its main NAND Flash production base in Yokkaichi, Japan, experienced a 13-minute power outage on June 15. All production facilities within the base (Fab 2, Fab 3, Fab 4, Fab 5, and Fab 6) were affected by the power outage, but we have yet to see all facilities return to normal operation as of now |
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Uncertainties in the Market Rise while a Bounce in NAND Flash Prices Remains Unlikely in 3Q (2019.06.20)
According to the latest investigations by DRAMeXchange, a division of TrendForce, demand for smartphones and servers go below expected levels in 2019 as the US-China trade dispute heats up. Adding the CPU shortage, which continues to haunt notebook shipments, we may see the shipments of eMMC/UFSs, SSDs etc |
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Toshiba Memory Corporation Announces XG6-P SSD Series (2019.05.28)
Toshiba Memory Corporation announced the XG6-P solid state drive (SSD) Series, a derivative of its XG6 Series. Offering up to 2,048GB of capacity and over 30 percent higher sequential write bandwidth than its predecessor, the XG6-P is suited for high-end workstation PCs and gaming systems, as well as cost-optimized data center and composable infrastructures |
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NAND Flash Giants Suffer Revenue Loss of 16.8% in 4Q18, Says TrendForce (2019.02.22)
DRAMeXchange, a division of the global market research firm TrendForce, reports that the rising economic uncertainties caused some server manufacturers to delay restocking or cancel orders, and compelled those upstream in the supply chain to make adjustments to their production lines, damaging their ability to stock up |
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Samsung Announces Industry’s First 1TB Embedded Universal Flash Storage (2019.01.30)
Samsung Electronics announced that it has begun mass producing the industry’s first one-terabyte (TB) embedded Universal Flash Storage (eUFS) 2.1, for use in next-generation mobile applications. Just four years after introducing the first UFS solution, the 128-gigabyte (GB) eUFS, Samsung has passed the much-anticipated terabyte threshold in smartphone storage |
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Toshiba Memory Unveils Industry's First UFS Ver. 3.0 Embedded Flash Memory Devices (2019.01.23)
Toshiba Memory Corporation has started sampling the industry’s first Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. The new line-up utilizes the company’s cutting-edge, 96-layer BiCS FLASH 3D flash memory and is available in three capacities: 128GB, 256GB and 512GB |
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Toshiba Memory Unveils 1TB Single Package PCIe Gen3 x4L SSDs with 96-Layer 3D Flash Memory (2019.01.09)
Toshiba Memory Corporation, the world leader in memory solutions, today announced the BG4 series, a new line-up of single package NVMe SSDs with capacities up to 1,024GB, which places both innovative 96-layer 3D flash memory and an all-new controller into one package to deliver best-in-class read performance |
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Contract Prices of NAND Flash Products to Drop Further in 1H19; Decline 10% in 1Q19, Says TrendForce (2018.12.18)
DRAMeXchange, a division of TrendForce, reports that the bit output from the NAND Flash industry in 2018 turned out to be higher than expected, as suppliers had steady yields of their 64-layer 3D NAND production. NAND Flash demand, however, has remained sluggish due to the looming trade war between China and the U |
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Total NAND Flash Revenue Rose by Just 4.4% QoQ in 3Q18 (2018.11.19)
DRAMeXchange, a division of TrendForce, reports that the bit output from the NAND Flash industry increased steadily in 3Q18, as suppliers raised the yields of their 64/72-layer 3D NAND production. NAND Flash demand, however, had yet to catch up with supply despite the year-end busy season |
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Micron Opens Backend Factory in Taichung Aiming 3D memory Market (2018.10.31)
TAIPEI, Taiwan - Major memory manufacturer Micron on October 26 held an opening ceremony for their backend packaging and testing plant in Taichung. With the opening of this factory, Micron Taiwan will be the world’s only memory vertical integration production base with both manufacturing and testing, and the main target product will be 3D memory, which is currently in high demand |
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New Alliance Memory High-Speed CMOS PSRAMs Offer 8Mb to 128Mb in 48/49-Ball FPBGA Packages (2018.10.25)
Alliance Memory introduced a new family of high-speed CMOS pseudo SRAMs (PSRAMs) with densities from 8Mb to 128Mb in 6.0 mm x 7.0 mm x 1.0 mm 48-ball FPBGA and 4.0 mm by 4.0 mm by 1.0 mm 49-ball FPBGA packages. The devices combine the most desirable features of SRAMs and DRAMs to provide designers with easy-to-use, low-power, and cost-effective memory solutions for wireless, automotive, networking, and industrial applications |
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Winbond Announces New 1.8V Confidential and Replay-Protected Flasay-protected Flash Storage Products (2018.10.22)
TAICHUNG CITY, Taiwan –Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of new SpiFlash Flash storage components with Replay-Protected Monotonic Counter (RPMC) capability to meet Microsoft and Intel requirements for Windows 10 Secure UEFI Boot |
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Global Ranking of Branded SSD Module Makers for 2017; Kingston, ADATA, and Tigo Took Top 3 (2018.10.15)
DRAMeXchange, a division of TrendForce, announces the global ranking of SSD module makers (NAND Flash manufacturers excluded) for 2017 based on the shipments of their own-branded SSD products in the channel market. Kingston, ADATA, and Tigo took the top three positions in the ranking, with market shares of 23%, 8%, and 7% respectively |
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DRAM and NAND Flash Products to See Price Decline in 4Q18, Says TrendForce (2018.10.09)
According to DRAMeXchange, a division of TrendForce, DRAM products have begun to see a weak price trend, showing only a 1~2% QoQ hike in contract prices for 3Q18 due to the continued oversupply, despite the coming of holiday sales season |
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Toshiba Memory and WD Celebrate the Opening of Fab 6 and Memory R&D Center in Japan (2018.09.19)
Toshiba Memory Corporation and Western Digital Corporation today celebrated the opening of a new state-of-the-art semiconductor fabrication facility, Fab 6, and the Memory R&D Center, at Yokkaichi operations in Mie Prefecture, Japan |
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TrendForce Expects Close to 10% Decline in NAND Flash Prices in 3Q18 (2018.08.16)
DRAMeXchange, a division of TrendForce, reports that the global NAND Flash market has stayed in oversupply since the traditional slow season in 1Q18, resulting in an average drop of 15~20% in NAND Flash contract prices in 2Q18 |
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Samsung Starts Mass Production of Industry’s First 4-bit Consumer SSD (2018.08.07)
Samsung Electronics today announced that it has begun mass producing the industry’s first 4-bit (QLC, quad-level cell) 4-terabyte (TB) SATA solid-state drive (SSD) for consumers.
Based on 1-terabit (Tb)* V-NAND with outstanding performance equivalent to the company’s 3-bit design, Samsung’s QLC SSD is expected to bring a new level of efficiency to consumer SSDs |
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Toshiba Unveils Industry's First SSDs Utilizing 96-Layer, 3D Flash Memory (2018.07.24)
Toshiba Memory Corporation today announced the launch of the industry’s first SSDs utilizing 96-layer, 3D flash memory. Sample shipments to OEM customers start today in limited quantities, and Toshiba Memory Corporation will gradually increase shipments from the fourth calendar quarter of 2018 |
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Toshiba Memory Starts Construction of the First Fabrication Facility in Kitakami City, Iwate Prefect (2018.07.24)
Toshiba Memory Corporation today held a groundbreaking ceremony for the first semiconductor fabrication facility (fab), called K1, in Kitakami, Iwate prefecture, in northeastern Japan. On its completion in autumn 2019, the facility will be one of the most advanced manufacturing operations in the world, dedicated to production of 3D flash memory |
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