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Micron and Intel Announce Update to 3D XPoint Joint Development Program (2018.07.17)
Micron and Intel today announced an update to their 3D XPoint joint development partnership, which has resulted in the development of an entirely new class of non-volatile memory with dramatically lower latency and exponentially greater endurance than NAND memory |
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Samsung Electronics Starts Mass Production of Fifth-Generation V-NAND (2018.07.10)
Samsung Electronics announced that it has begun mass producing its fifth-generation V-NAND memory chips with the fastest data transfers now available. In the industry’s first use of the ‘Toggle DDR 4.0’ interface, the speed for transmitting data between storage and memory over Samsung’s new 256-gigabit (Gb) V-NAND has reached 1 |
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Price Decline Will Continue in NAND Flash Market in 2H18, Says TrendForce (2018.06.28)
The growth momentum for 2H18 NAND Flash market is expected to be weak, according to the latest report of DRAMeXchange, a division of TrendForce. Coupled with continuous improvements in yield rate and output of 64/72-layer 3D NAND Flash, DRAMeXchange expects the market to approach a balance between supply and demand, the contract prices of NAND Flash products are expected to decline further |
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Samsung Introduces 8TB SSD for Data Centers in Next-generation 'NF1' Form Factor (2018.06.21)
Samsung Electronics announced that it has launched the industry’s highest capacity NVMe solid state drive (SSD) based on the incredibly small Next-generation Small Form Factor (NGSFF)* – an eight-terabyte (TB) NF1 SSD. The new 8TB NVMe NF1 SSD has been optimized for data-intensive analytics and virtualization applications in next-generation data centers and enterprise server systems |
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Toshiba to Deliver Value SAS SSDs Targeting SATA Applications (2018.06.20)
Toshiba Memory Corporation game-changing category of SAS SSDs expected to replace SATA SSDs in server applications. The RM5 12Gbit/s value SAS (vSAS) series features capacity, performance, reliability, manageability and data security advantages – at a price that obsoletes SATA SSDs |
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Winbond Extends Serial NAND Flash Memory with 1Gbit Device with Data-Transfer Rate of 83MB/s (2018.06.11)
TAICHUNG, Taiwan - Winbond Electronics Corporation announced the introduction of the W25N01JW, a high-performance, 1.8V Serial NAND Flash memory IC delivering a new high in data-transfer rates: 83MB/s via a Quad Serial Peripheral Interface (QSPI) |
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Toshiba Memory Corporation and Synopsys Collaborate to Accelerate 3D Flash Memory Verification (2018.05.31)
Synopsys announced that it has collaborated with Toshiba Memory Corporation to accelerate the verification of Toshiba Memory Corporation's BiCS FLASH vertically stacked three-dimensional (3D) flash memory. By working closely with Toshiba Memory Corporation, Synopsys introduced innovative simulation algorithms in its FineSim Pro FastSPICE tool to address the increased design complexity of 3D NAND Flash memory |
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Global NAND Flash Revenue Dropped by 3% QoQ in 1Q18, Says TrendForce (2018.05.28)
The latest analysis by DRAMeXchange, a division of TrendForce, finds that the seasonal headwinds in 1Q18 has resulted in downward corrections of prices. On the whole, the revenue of branded NAND Flash suppliers dropped by 3% QoQ in 1Q18 |
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Toshiba Memory Corporation to Expand 3D Flash Memory Production Capacity (2018.05.22)
Toshiba Memory Corporation (TMC) today announced that it decided to start construction of a new state-of-the-art fab for BiCS FLASH, its proprietary 3D flash memory, in Kitakami, Iwate prefecture in July this year.
TMC has selected Kitakami City as the next location to expand its operations in September last year, and has started preparations for construction of the new fab |
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The Average Contract Prices of Enterprise SSD May Fall by 10% in 2Q18, Says TrendForce (2018.05.17)
According to the report of DRAMeXchange, a division of TrendForce, the Enterprise SSD market has been expanding in recent years driven by the development of data center, AI, big data, 5G, and edge computing. The shipments of Enterprise SSD are expected to reach 30 million units this year, up from less than 20 million units in 2016 |
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Alliance Memory Expands Low-Power SDRAM Portfolio (2018.05.09)
Alliance Memory announced that its SDRAM portfolio now features a wide variety of components that combine low power consumption with power-saving features to extend battery life in mobile devices.
Alliance Memory's lineup of high-speed CMOS mobile low-power SDRAMs includes SDR (LPSDR), double data rate (LPDDR), and DDR2 (LPDDR2) devices |
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Chinese and Taiwanese Memory Manufacturers to Collaborate on Production of NAND Flash Memory (2018.04.30)
TAIPEI, Taiwan - According to Taiwan’s Economic Daily News, Yangtze Memory Technology Corp (YMTC), a subsidiary company of China’s Tsinghua Unigroup, is interested in forming a memory industry alliance with Taiwanese memory manufacturers which include Phison Electronics Corp |
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Samsung Begins Mass Production of 10nm-class 16Gb LPDDR4X DRAM for Automobiles (2018.04.25)
Samsung Electronics announced that it has begun mass producing 10-nanometer (nm)-class* 16-gigabit (Gb) LPDDR4X DRAM for automobiles. The latest LPDDR4X features high performance and energy efficiency while significantly raising the thermal endurance level for automotive applications that often need to operate in extreme environments |
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The Three Major Chinese Memory Companies Arrange Trial Production to Begin in 2H18 (2018.04.19)
According to DRAMeXchange, a division of TrendForce, China has entered the semiconductor sector and focused on the development of domestic memory industry. The three key players are YMTC, Innotron (Hefei Chang Xin) and JHICC, which work on NAND Flash, mobile DRAM and specialty DRAM respectively |
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NAND Flash Prices Will Continue to Decline as the Slight Oversupply Continues in 2Q18 (2018.04.13)
The NAND Flash market has witnessed a slight oversupply in 1Q18. The growth momentum remains weak in 2Q18 although the demand increases, according to DRAMeXchange, a division of TrendForce. It is expected that the slight oversupply in NAND Flash market will remain and the prices will continue to decline |
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Lam Research’s Market Share Reached 55% in Semiconductor Etch Sector in 2017 (2018.03.08)
On the heels of strong growth in 3D NAND manufacturing, Lam Research’s market share rose to 55% in 2017, according to the Information Network, a New Tripoli, PA-based market research company.
3D NAND memory manufacturing utilizes a combination of deposition and etch processes to define complex 3D structures with extremely high aspect ratio features |
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Samsung Electronics Starts Producing 8-Gigabyte HBM2 With Highest Data Transmission Speed (2018.01.11)
Samsung Electronics today announced that it has started mass production of its 2nd-generation 8-gigabyte (GB) High Bandwidth Memory-2 (HBM2) with the fastest data transmission speed on the market today. The new solution, Aquabolt, which is the industry’s first HBM2 to deliver a 2 |
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Micron and Intel to Complete Development of Third-gen of 3D NAND Technology (2018.01.09)
Micron and Intel today announced an update to their successful NAND memory joint development partnership that has helped the companies develop and deliver industry-leading NAND technologies to market.
The announcement involves the companies’ mutual agreement to work independently on future generations of 3D NAND |
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TrendForce Forecasts a Possible Oversupply in 2019 (2018.01.04)
According to DRAMeXchange, a division of TrendForce, the production capacity expansion of major NAND Flash manufacturers, e.g. Toshiba, Samsung, Intel, and Yangtze Memory Technologies Corporation (YMTC), will have increasing impacts on the industry, resulting in a possible oversupply in NAND Flash market in 2019 |
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Macronix to Increase Its Advanced Process Manufacturing Capacity Next Year (2017.12.29)
TAIPEI, Taiwan - Taiwanese memory solution provider Macronix announced today that its board of directors had approved its capital expenditure budget for next year, totaled NT$ 3.89 billion yuan, an increase of more than 60% over this year |
