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Samsung Increases Production of Industry’s Fastest DRAM ─ 8GB HBM2 (2017.07.18)
Samsung Electronics today announced that it is increasing the production volume of its 8-gigabyte (GB) High Bandwidth Memory-2 (HBM2) to meet growing market needs across a wide range of applications including artificial intelligence, HPC (high-performance computing), advanced graphics, network systems and enterprise servers |
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Floadia Completes Fundraising from 9 VCs in Japan and Taiwan for Embedded Flash Memory IP Business (2017.07.05)
Floadia Corporation announced today that it successfully closed "Series B" fundraising of 1.6 billion Japanese yen (US$14.5 million) to use the funds to continue the commercial supply of its embedded flash memory IP to major foundries |
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NAND Flash Controller Supplier Phison Opens Phase Three Plant in Zhunan (2017.06.19)
TAIPEI, Taiwan - Taiwanese NAND Flash controller and NAND solutions supplier Phison Electronics Corp. last week held an opening ceremony for their phase three chip plant in Zhunan. Following the completion of factory construction, Phison is expanding their workforce and strengthening their R&D and will continue to further enhance their Flash memory technology |
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Contract Prices of Server DRAM Modules to Increase by 3% to 8% in Q3 (2017.06.15)
DRAMeXchange, a division of TrendForce, reports that the average contract price of server DRAM modules rose sequentially by nearly 40% and 10% respectively for the first and second quarter of 2017 due to tight supply. In the third quarter |
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Samsung Ramps up 64-Layer V-NAND Memory Production for Expanding Flash Storage Solutions (2017.06.15)
Samsung Electronics today announced that it has begun volume production of 64-layer, 256Gb V-NAND flash memory for use with an expanding line-up of storage solutions for server, PC and mobile applications.
Since Samsung began producing the industry’s first SSDs based on 64-layer 256Gb V-NAND chips in January for key IT customers, it has been working on a wide range of new V-NAND-based mobile and consumer storage solutions |
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Alliance Memory Introduces New Die Version for 2Gb and 4Gb DDR3 and DDR3L SDRAMs (2017.06.08)
To address the memory market's shortage of high-speed CMOS DDR3 and low-voltage DDR3L SDRAMs, Alliance Memory today announced a new die revision (B die) for its 2Gb and 4Gb devices in the 96-ball FBGA package.
"Market demand for DDR3 and DDR3L SDRAMs is extremely high due to their increased functionality and speed |
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3D NAND Flash Market Is About to Boom (2017.06.02)
TAIPEI, Taiwan - 3D NAND flash memory now is for everybody. At Computex 2017, there were more memory manufacturers and suppliers began offering 3D NAND flash memory products, including Toshiba, Western Digital (WD), Transcend, ADATA, Intel, Apacer and PLEXTOR all showcased their new products using 3D NAND flash memory |
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1Q17 NAND Flash Revenue Dipped Only 0.4%, Says TrendForce (2017.06.01)
The NAND Flash market remained in undersupply in the first quarter of 2017 as it had been in the preceding quarter, according to the latest report from DRAMeXchange, a division of TrendForce. Despite seasonality, the average contract price of NAND Flash chips in the channel market actually surged by 20~25% in the first quarter compared with last year’s fourth quarter |
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WD to Deliver World’s First Client SSD with 64-Layer 3D NAND Technology (2017.05.30)
Western Digital Corporation announced the world’s first client solid state drives built with its 64-layer 3D NAND technology. This technology milestone enables the company to deliver new, innovative SSDs with lower power consumption and higher performance, endurance and capacities |
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Toshiba Unveils NVMe SSDs Using 64-Layer, 3D Flash Memory (2017.05.29)
Toshiba Memory Corporation launched the XG5 series, a new line of NVM Express (NVMe) SSDs integrating 64-layer, 3D flash memories, with a maximum capacity of 1024GB in a thin single-sided form factor. Sample shipments to OEM customers start today in limited quantities, and Toshiba will gradually increase shipments from the third calendar quarter of this year |
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TrendForce Reports Intel Took First Place in Enterprise-Grade SSD Shipments for Q1 (2017.05.26)
Global shipments of enterprise-grade SSDs for the first quarter of 2017 grew against seasonal headwinds by 3~4% compared with the prior quarter to reach around 6 million units, says DRAMeXchange, a division of TrendForce.
For the same quarter, enterprise-grade SSDs also represented more than 10% of the total SSD product shipments worldwide |
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TrendForce Reports 1Q17 Global Mobile DRAM Revenue Fell by Just 1.7% (2017.05.24)
DRAMeXchange, a division of TrendForce, reports that the global mobile DRAM revenue for the first quarter of 2017 dropped slightly by 1.7% compared with the prior quarter. The smartphone market in the first quarter went through the conventional off season in the first quarter with the global device production volume declined by 23% from last year’s fourth quarter |
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AIC Presents A Broad Portfolio of Rack, NVMe, and Storage Server Solutions in 2017 Computex (2017.05.24)
TAIPEI, Taiwan – AIC announced today that it will bring out the whole series of products at 2017 Computex Taipei, (05/30~06/03/2017), on the fourth floor of Nangang Exhibition Hall.
This year with separate zones of Rack and All-Flash-Array NVMe, to showcase the new generation Smart Rack and OCP Rack |
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Alliance Memory Launches New 32-Bit Wide 8Mb and 16Mb Fast SRAMs in 90-Ball TFBGA Package (2017.05.18)
Alliance Memory introduced new 8Mb and 16Mb x32 devices in the 90-ball 8mm by 13mm TFBGA package.
Providing space-saving alternatives to solutions in larger 119-ball packages, the devices released today are optimized for networking routers and switchers, test and medical equipment, and automotive applications |
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WD’s SanDisk Subsidiaries Initiate Arbitration with Toshiba (2017.05.15)
Western Digital Corp. (WDC) today announced that several of its SanDisk subsidiaries have filed a Request for Arbitration with the ICC International Court of Arbitration related to three NAND flash-memory joint ventures operated with Toshiba Corporation |
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Intel’s Cloud-Inspired 3D NAND SSDs for Data Centers (2017.05.04)
Intel announced two new Intel 3D NAND solid state drives for data centers, the Intel SSD DC P4500 Series and Intel SSD DC P4600 Series, along with reinforcing its commitment to expanding 3D NAND supply.
The latest additions to the Intel SSD Family for Data Center have been designed from the ground up for cloud storage solutions, including software defined storage and converged infrastructure |
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3D-NAND to Account for Over 50% of Total NAND Flash Bit Output This Q3, Says TrendForce (2017.04.26)
DRAMeXchange, a division of TrendForce, anticipates that 3D-NAND will formally become the mainstream architecture of NAND Flash memory in the third quarter of 2017 with its share in the total NAND Flash bit output exceeding 50% |
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Average Contract Price of 4GB DDR4 DRAM Modules to Increase 12.5% in 2Q17, TrendForce Estimates (2017.04.17)
DRAMeXchange, a division of TrendForce, reports the general price increase in the PC DRAM market is growing larger than anticipated as the already tight supply situation is compounded by quality problems with products made on the leading-edge processes |
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New 1Gb, 2Gb, and 4Gb Mobile LPDDR2 SDRAMs From Alliance Memory (2017.04.13)
Alliance Memory introduced a new line of high-speed CMOS mobile low-power DDR2 (LPDDR2) SDRAMs with densities of 1Gb, 2Gb, and 4Gb in the 134-ball FBGA package. The devices offer a variety of power-saving features, including 1 |
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SK Hynix Introduces Industry's Highest 72-Layer 3D NAND Flash (2017.04.10)
SK Hynix Inc. today introduced the industry's first 72-Layer 256Gb (Gigabit) 3D (Three-Dimensional) NAND Flash based on its TLC (Triple-Level Cell) arrays and own technologies.
The company stacks 1.5 times more cells for the 72-Layer 3D NAND than it does for the 48-Layer 3D which is already in mass production |
