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New Alliance Memory 512Mb SDRAMs in 54-Pin TSOP II Package (2017.03.30)
Alliance Memory introduced two new 512Mb synchronous DRAMs (SDRAM) in the 54-pin TSOP II package. The AS4C32M16SB-7TCN and AS4C32M16SB-7TIN are available in commercial (0°C to +70°C) and industrial (-40°C to +85°C) temperature ranges |
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IC Insights Expects DRAM Sales to Grow 39% and NAND Flash to Increase 25% This Year (2017.03.30)
IC Insights has raised its worldwide IC market growth forecast for 2017 to 11%—more than twice its original 5% outlook. The revision was necessary due to a substantial upgrade to the 2017 growth rates forecast for the DRAM and NAND flash memory markets |
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Intel Unveiles the Optane SSD Series with Memory Drive Technology (2017.03.20)
Intel unveiled the Intel Optane SSD DC P4800X Series and Intel Optane SSD DC P4800X Series with Intel Memory Drive Technology, enabling new possibilities to transform storage and memory architectures for the data center.
Deployed as blazing fast storage or caching tier, Intel Optane SSD DC P4800X breaks the confines of traditional storage to significantly increase scale per server and accelerate applications |
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Tight NAND Flash Supply to Cause Prices of Mainstream SSDs to Jump by More Than 10% in Q1 (2017.03.13)
DRAMeXchange, a division of TrendForce, reports that client-grade SSDs of mainstream capacities continue to see rising contract prices in the PC-OEM market during this first quarter. On average, contract prices of MLC-based client-grade SSDs are projected to go up by 12~16% compared with the fourth quarter of last year, while prices of TLC-based products are expected to increase by 10~16% sequentially |
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NAND Flash Revenue Grew 17.8% Sequentially in Fourth Quarter of 2016, TrendForce Says (2017.03.07)
DRAMeXchange, a division of TrendForce, reported that in the fourth quarter of 2016, the NAND Flash market was at its most severe phase of shortage for the year while shipments in the end device markets were robust. Consequently, average sales prices (ASPs) of NAND Flash products rose significantly, and the fourth-quarter global NAND Flash revenue registered a large sequential increase of 17 |
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New UFS 2.1 Controller Family from Silicon Motion (2017.03.07)
Silicon Motion Technology Corporation announced the launch of its new UFS (Universal Flash Storage) 2.1 controller family, a complete product line supporting UFS HS-Gear3x1L and HS-Gear3x2L, enabling high-performance, high capacity and low power embedded memory for mobile phones |
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Prices of Mobile DRAM, AMOLED Panels Continue to Climb (2017.03.01)
The markets for key components used in smartphones have experienced rising prices since the second half of 2016 because of tightening supply. TrendForce’s latest analyses indicate that prices of mobile DRAM, mobile NAND Flash products and AMOLED panels will continue to climb through 2017 |
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Alliance Memory New High-speed CMOS 16Gb Mobile LPDDR3 SDRAM (2017.03.01)
Alliance Memory introduced a new high-speed CMOS mobile low-power DDR3 (LPDDR3) SDRAM designed to extend battery life in compact portable devices. Featuring low voltage operation of 1.2V/1.8V and a number of power-saving features, the 16Gb AS4C512M32MD3 is offered in the 11 |
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Contract Prices of SSDs and eMMCs to Increase 5~10% in Q2, TrendForce Forecasts (2017.02.23)
The global supply of 2D-NAND Flash will remain tight going into the second quarter of 2017, according to the latest analysis from DRAMeXchange, a division of TrendForce. Also, major smartphone brands will soon begin their first wave of new product release for the year after the Mobile World Congress in Spain |
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Toshiba to Ship Samples of 64-Layer, 512-gigabit 3D Flash Memory this Month (2017.02.22)
Toshiba Corporation has today unveiled the latest addition in its industry-leading line-up of BiCS FLASH three-dimensional flash memory with a stacked cell structure, a 64-layer device that achieves a 512-gigabit (64-gigabytes) capacity with 3-bit-per-cell (triple-level cell, TLC) technology |
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Global DRAM Revenue Jumped 18.2% Sequentially in Q4 2016, TrendForce Reports (2017.02.14)
Peak season demand and surging prices for DRAM products across different applications resulted in an 18.2% sequential growth in the global DRAM revenue for the final quarter of 2016, reports DRAMeXchange, a division of TrendForce |
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Korea KIST-MIT Team Achieves the World's First Non-Electrical Memory (2017.02.13)
An international research team of the Korea Institute of Science and Technology (KIST), has discovered the key to unlocking “non-electrical” memory, which could replace current technology such as DRAM and NAND flash.
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Toshiba Starts Construction of Fab 6 and Memory R&D Center at Yokkaichi, Japan (2017.02.09)
Toshiba Corporation today announced that it has started construction of a new state-of-the-art semiconductor fabrication facility, Fab 6, and a new R&D center, the Memory R&D Center, at Yokkaichi Operations in Mie prefecture, Japan, the company’s main memory production base |
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Winbond's 3x-nm DRAM to Begin Mass Deliveries in Q3 2017 (2017.02.08)
TAIPEI, Taiwan - Taiwanese memory manufacturer Winbond yesterday at a corporate briefing session announced that Windbond has completed client authentication for 3x nanometer DRAM that they developed themselves, and they expect to begin mass deliveries in the third quarter of this year |
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Toshiba Spins Off Memory Business to Strengthen Its NAND Flash Competitiveness, TrendForce Says (2017.01.28)
Toshiba officially announced today that its memory business will be spun off. Although the detail is not disclosed yet, but overall the procedure will be completed by March 31st . DRAMeXchange, a division of TrendForce, believes that from this point on, Toshiba’s memory business will have more operational flexibility and stronger fundraising ability |
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Innodisk Introduces The World’s Smallest Embedded RAID 1 Solution (2017.01.19)
Innodisk has introduced the world’s smallest RAID 1 solution. As embedded systems and devices became smaller, there are more and smaller form factor storage devices that include 2.5”, mSATA and M.2 SSDs that can be used as boot-up disks or data disks in small systems |
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Macronix's NAND MCP Incorporated in Qualcomm Technologies’ LTE IoT Chipset Reference Design (2017.01.12)
HSINCHU, Taiwan – Taiwan’s Non-Volatile Memory (NVM) manufacturer Macronix International today announced that the NAND MCP memory solution has been adopted and incorporated by Qualcomm Technologies Inc., a subsidiary of Qualcomm Incorporated as a part of the reference design for a Qualcomm Technologies’ LTE Cat |
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TrendForce Expects NAND Flash Prices to Keep Rising During 2017 (2016.12.21)
The global NAND Flash industry will see an annual increase of just 6% in its total wafer capacity in 2017, according to analysis by DRAMeXchange, a division of TrendForce.
DRAMeXchange noted, as the pace of the industry-wide transition to 3D-NAND architecture accelerates, supply of 2D-NAND memory will drop sharply, leading to shortages next year |
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Memory Market to Increase 10% in 2017, IC Insights Says (2016.12.21)
According to IC Insights, the total memory market still down 1% yearly in 2016, and will increase 10% in 2017 to a new record high of $85.3 billion as gains in average selling prices for DRAM and NAND flash.
IC Insights pointed, after increasing by more than 20% in both 2013 and 2014, the memory market fell upon difficult times in 2015 |
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Storage Market Declines Another Quarter but Flash Storage Remains Robust, Says IDC (2016.12.13)
Total EMEA external storage systems revenue fell 5.1% year over year to $1.49 billion in the third quarter of 2016 (3Q16), according to the International Data Corporation (IDC) EMEA Quarterly Disk Storage Systems Tracker 3Q16 |
