 |
UMC Obtains LEED Gold Certification for Its Xiamen Based Fab 12X (2017.10.30)
HSINCHU, Taiwan - United Microelectronics Corporation today announced that its 300mm Fab 12X in Xiamen China, has gained LEED (Leadership in Energy and Environmental Design) Gold recognition from the U.S. Green Building Council |
|
WLP Device Shipments to Overtake Flip Chip in 2018, Says Information Network (2017.10.24)
The number of IC packages utilizing WLP will overtake Flip Chip shipments in 2018 and then continue growing at a compound annual growth rate of 15% (between 2014 and 2020) compared to just 5% for Flip Chip, according to the Information Network |
|
North American Semiconductor Equipment Industry Posts September 2017 Billings (2017.10.23)
North America-based manufacturers of semiconductor equipment posted $2.03 billion in billings worldwide in September 2017 (three-month average basis), according to the September Equipment Market Data Subscription (EMDS) Billings Report published by SEMI |
|
IC Insights Raises 2017 IC Market Forecast to +22% (2017.10.19)
IC Insights has raised its IC market growth rate forecast for 2017 to 22%, up six percentage points from the 16% increase shown in its Mid-Year Update. The IC unit volume shipment growth rate forecast has also been increased from 11% depicted in the Mid-Year Update to 14% currently |
|
China Semiconductor Fab Equipment Spending Forecasted to Over Than $12 Billion (2017.10.18)
SEMI today announced its new China IC Industry Outlook Report. With an increasing presence in the global semiconductor manufacturing supply chain, the market opportunities in China are expanding dramatically.
China is the largest consumer of semiconductors in the world, but it currently relies mainly on semiconductor imports to drive its growth |
|
Samsung Completes Qualification of 8nm LPP Process (2017.10.18)
Samsung Electronics announced today that 8-nanometer (nm) FinFET process technology, 8LPP (Low Power Plus), has been qualified and is ready for production.
The newest process node, 8LPP provides up to 10-percent lower power consumption with up to 10-percent area reduction from 10LPP through narrower metal pitch |
|
300mm Wafer Fabs Expected to Increase Each Year by 2021, IC Insights Says (2017.10.13)
With the prospects of large 450mm wafers going nowhere, IC manufacturers are increasing efforts to maximize fabrication plants using 300mm and 200mm diameter silicon substrates. The number of 300mm wafer production-class fabs in operation worldwide is expected to increase each year between now and 2021 to reach 123 compared to 98 in 2016, according to the forecast in IC Insights |
|
Worldwide Semiconductor Revenue to Reach $411 Billion in 2017, Gartner Says (2017.10.12)
Worldwide semiconductor revenue is forecast to total $411.1 billion in 2017, an increase of 19.7 percent from 2016, according to Gartner, Inc. This represents the strongest growth since the 2010 recovery from the financial crisis when revenue increased by 31 |
|
Pure-play Foundry Sales in China Expected to Jump by 16% This Year (2017.10.06)
According to IC Insights that with the rise of fabless IC companies in China, demand for foundry services in that country has also increased. Pure-play foundry sales in China are expected to jump by 16% this year to about $7.0 billion |
|
Power Transistor Growth Returns After Volatile Period (2017.09.28)
After recovering from a 7% drop in 2015, power transistor sales grew 5% in 2016 to $12.9 billion and are forecast to set a new record high this year with worldwide revenues rising 6% to $13.6 billion, according to IC Insights |
|
Faraday Launches SoReal! 2.0 Virtual Platform to Support Its FPGA Board (2017.09.27)
HSINCHU, Taiwan - Faraday Technology Corporation today announced the availability of its SoReal! 2.0 Virtual Platform. The upgraded solution enables Faraday’s SoCreative! FPGA board to connect to the customized SoC virtual platform, becoming a mixed prototyping approach |
|
North American Semiconductor Equipment Industry Posts $2.18B in Billings in August (2017.09.25)
North American Semiconductor Equipment Industry Posts $2.18B in Billings in August
North America-based manufacturers of semiconductor equipment posted $2.18 billion in billings worldwide in August 2017 (three-month average basis), according to the August Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI |
|
ITRI’s New Liquid Nanoparticle Monitoring System Can Inspect Particles Down to 5nm (2017.09.19)
TAIPEI, Taiwan - Taiwan's Industrial Technology Research Institute (ITRI) participated in the SEMICON Taiwan exhibition to showcase a “Liquid Nanoparticle Monitoring System” with the capacity of inspecting 5nm grade solutions in an independent exhibition booth for the first time |
|
Taiwan's ITRI Showcases Flexible Fan-out Panel Level Packaging Technology at SEMICON Taiwan (2017.09.14)
TAIPEI, Taiwan - Fan-Out Wafer Level Packaging technology can package different die in one chip, is a key technology of the development of ultra-thin devices. Taiwan's Industrial Technology Research Institute(ITRI) showcased its flexible Fan-Out 3 Layers RDL panel level packaging technology at this year's SEMICON Taiwan, which not only can reduce the thickness of chip and power consumption, but also can increase the output of chip packaging |
|
eMemory Receives 2017 TSMC IP Partner Award (2017.09.14)
HSINCHU, Taiwan – eMemory announced today that it received TSMC’s Open Innovation Platform (OIP) “IP Partner Award” of 2017.
The company has been honored with this award in the “Specialty Embedded Memory IP” category every year from its inception in 2010 |
|
2017 Fab Equipment Spending Expected to Increase by 37%, Reaching a New Record (2017.09.13)
The latest update to the World Fab Forecast report, published by SEMI, reveals record spending for fab equipment. The report shows 30 facilities and lines with over $500 million in fab equipment spending. 2017 fab equipment spending (new and refurbished) is expected to increase by 37 percent, reaching a new annual spending record of about US$55 billion |
|
Synopsys, TSMC Collaborate to Develop DesignWare Foundation IP for TSMC 40nm LP eFlash Processes (2017.09.13)
Synopsys today announced its collaboration with TSMC to develop foundry-sponsored DesignWare Foundation IP, including logic libraries and embedded memories, for TSMC's 40-nanometer (nm) ultra-low power (ULP) eFlash and 40-nm low-power (LP) eFlash processes |
|
More than 45,000 Visitors Expected at SEMICON Taiwan 2017 (2017.09.12)
TAIPEI， Taiwan ─ Upbeat about the growth prospects of Taiwan’s electronics sector, more than 45,000 visitors are expected to attend SEMICON Taiwan 2017 which opens tomorrow at Taipei’s Nangang Exhibition Center.
SEMICON Taiwan (September 13-15), the premier tradeshow and event for the electronics manufacturing supply chain, aims to connect the electronics manufacturing ecosystem ─ both vertically and horizontally |
|
Semiconductor Industry Records Best Second Quarter in Three Years, IHS Markit Says (2017.09.11)
Despite a slightly down first quarter, the semiconductor industry achieved near record growth in the second quarter of 2017, posting a 6.1 percent growth from the previous quarter, according to IHS Markit. Global revenue came in at $101 |
|
Samsung Adds 11nm FinFET Process Technology to Its Advanced Foundry Process Portfolio (2017.09.11)
Samsung Electronics today announced it has added 11-nanometer (nm) FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio, offering customers with an even wider range of options for their next-generation products |
Transmission technology into the digital era, users and manufacturers are increasingly focusing on the quality requirements of the digital display, digital display interface standard combination of hardware graphics card, and therefore more subject to the attention of the progress of its development.