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North American Semiconductor Equipment Industry Posts July 2017 Billings (2017.08.23)
North America-based manufacturers of semiconductor equipment posted $2.27 billion in billings worldwide in July 2017 (three-month average basis), according to the July Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI |
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Semiconductor Industry Capital Spending Forecast to Jump 20% in 2017 (2017.08.23)
According to IC Insights’ latest forecast is for semiconductor industry capital spending to climb 20% this year.
The figure shows the steep upward trend of quarterly capital spending in the semiconductor industry since 1Q16 |
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Taiwan IC Revenue Totaled US$18.9B in Q2, Up 0.2% QoQ and 4.8% Decrease YoY (2017.08.09)
TAIPEI, Taiwan - The TSIA survey showed that Q2 2017 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled NT$572.6 billion(US$18.9B), up 0.2% on-quarter and 4.8% decrease on-year.
In design, was NT$150 |
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CHPT Next Year to Launch 7-nm Test Product (2017.08.07)
TAIPEI, Taiwan - Taiwanese semiconductor testing services provider Chunghwa Precision Test Tech. Co. (CHPT) yesterday announced that next year they well launch a 7-nm testing product and also develop a PCB testing product for specialized applications in satellite and communications industries |
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Latest Fab Plans in China Need Government Subsidies to Minimize Risks of Losses in Short/Medium Term (2017.08.03)
According to TrendForce’s research on semiconductor fab plans in China after 2016 finds that a total 17 new fabs are slated for construction so far. Five of these plants will be for processing 8-inch wafers and the remaining 12 plants will be for processing 12-inch wafers |
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Semiconductor Capital Spending Is Forecast to Grow 10.2% in 2017, Gartner Says (2017.08.02)
Worldwide semiconductor capital spending is projected to increase 10.2 percent in 2017, to $77.7 billion, according to Gartner, Inc. This growth rate is up from the previous quarter's forecast of 1.4 percent, due to continued aggressive investment in memory and leading-edge logic which is driving spending in wafer-level equipment |
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eMemory Announces Validation of On-Chip Security IP on UMC Advanced Nodes (2017.07.27)
HSINCHU, Taiwan – eMemory announced today that it has verified its latest on-chip security IP on several of UMC’s advanced nodes. The IP, based on unique IC biometrics, can enable a wide range of in-field security applications and be tailored for hardware protection within IoT and data centers |
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Synopsys HBM2 IP Solution Offering More Than 300 GB/s Bandwidth for Graphics and High-Performance Co (2017.07.27)
Synopsys introduced its DesignWare High Bandwidth Memory 2 (HBM2) IP solution consisting of controller, PHY and verification IP, enabling designers to achieve up to 307GB/s aggregate bandwidth, which is 12 times the bandwidth of a DDR4 interface operating at 3200Mb/s data rate |
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N.A. Semiconductor Equipment Posted $2.29 Billion in Billings in June (2017.07.26)
North America-based manufacturers of semiconductor equipment posted $2.29 billion in billings worldwide in June 2017 (three-month average basis), according to the June Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI |
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SEMICON Taiwan to Take Place During 13-15 September at Taipei’s Nangang Exhibition Center (2017.07.19)
TAIPEI, Taiwan – Semi announced today that SEMICON Taiwan (13-15 September), held at Taipei’s Nangang Exhibition Center, will feature over 1,700 booths and 700 exhibitors, and more than 45,000 attendees from the global electronics manufacturing supply chain |
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Semiconductor Content in an Electronic System will reach 28.1% in 2017, Says IC Insights (2017.07.13)
IC Insights forecasts that the 2017 global electronic systems market will grow by only 2% to $1,493 billion while the worldwide semiconductor market is expected to surge by 15% this year to $419.1 billion.
Moreover, IC Insights forecasts that the total semiconductor market will exceed $500 |
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China to Add Most of the 200mm Capacity Through 2021 with 34% Growth, Semi Report (2017.07.12)
SEMI issued an update to its 200mm Fab Outlook report, with improved and expanded report forecasting of 200mm fab trends out to 2021. SEMI’s analysts updated information on over 100 facilities, including the latest new facilities and investment projects in China |
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GUC Opens New Korea Office (2017.07.11)
HSINCHU, Taiwan - Global Unichip Corp. (GUC) announced its facilities in Seoul, Korea. The company's new offices are located in AnnJay Tower at 3F, 208 Teheran-ro, Gangnam-gu, Seoul.
GUC required new space to enhance both technical and business customer support |
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Cellphone IC Sales Will Top Total Personal Computing in 2017 (2017.06.22)
The ongoing slump in shipments of standard personal computers along with the drop-off in tablets are setting the stage for cellphone IC sales to finally surpass integrated circuit revenues in total personal computing systems this year, based on new forecasts in the recently released update of IC Insights’ 2017 IC Market Drivers Report |
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GUC Successfully Rolls out HBM2 Total Solution (2017.06.19)
HISNCHU, Taiwan – Global Unichip, the custom ASIC company, has successful taped out a 16nm, second-generation High Bandwidth Memory (HBM) PHY and controller with verified interposer design and CoWoS Package. The innovative ultra-high capacity memory ASIC solution will meet the demanding requirements of artificial intelligence (AI), deep learning (DL), and a variety of high performance computing (HPC) applications |
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Imec Develops 200V/650V Dispersion Free Normally-off/e-mode Power Devices on 8-inch Si Wafers (2017.06.13)
Imec announced today that it has developed 200V and 650V normally-off/enhancement mode (e-mode) on 200mm/8-inch GaN-on-Silicon wafers, achieving a very low dynamic Ron dispersion (below 20 percent) and state-of-the-art performance and reproducibility |
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Imec Achieves Record-Low Source/Drain Contact Resistivity for PMOS Transistors (2017.06.08)
At this week’s 2017 Symposia on VLSI Technology and Circuits, imec, the world-leading research and innovation hub in nano-electronics and digital technology, reported record breaking values below 10^-9 Ohm.cm² for PMOS source/drain contact resistivity |
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Asia Pacific Microsystems Will Exhibit at Transducers 2017 in June (2017.06.07)
TAIPEI, Taiwan - Asia Pacific Microsystems, Inc. (APM), "Paving the way toward MEMS production", will exhibit at Transducers 2017 at Kaohsiung Exhibition Center from June 18th to 22th. Transducers 2017 is co-sponsored by IEEE Electron Devices Society (EDS) |
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IBM, GLOBALFOUNDRIES and Samsung Builds New Transistor for 5nm Technology (2017.06.06)
IBM, its Research Alliance partners GLOBALFOUNDRIES and Samsung, and equipment suppliers have developed an industry-first process to build silicon nanosheet transistors that will enable 5 nanometer (nm) chips.
The resulting increase in performance will help accelerate cognitive computing, the Internet of Things (IoT), and other data-intensive applications delivered in the cloud |
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Worldwide Semiconductor Manufacturing Equipment Billings Reached US$13.1 billion for Q1 (2017.06.06)
SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$13.1 billion for the first quarter of 2017. The quarter ended very strong, with March billings reaching $5.6 billion, an all-time monthly record |
