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Telink and Andes Announce the TLSR9 SoC with RISC-V Processor (2020.11.03) |
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TAIPEI, Taiwan - Telink Semiconductor and Andes Technology introduced the new connectivity system on a chip (SoC) for Telink’s latest product line, the TLSR9 series. Powered by the 32-bit AndesCore D25F, the TLSR9 series is designed for the next generation of hearables, wearables, and other high-performance IoT applications... |
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Kioxia to Expand 3D Flash Memory Production Capacity (2020.10.29) |
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Kioxia Corporation today announced it will begin construction of a state-of-the-art fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan to expand production of its proprietary 3D Flash memory BiCS FLASHTM. The construction of Kioxia Corporation’s Fab7 facility is expected to commence in the spring of 2021... |
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AAEON Receives four Taiwan Excellence Awards for 2021 (2020.10.29) |
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AAEON is honored with receiving the 29th Taiwan Excellence Award for 2021. Four AAEON products are recognized this year for their innovation and design to continue pushing AI and edge computing; the BOXER-6641, BOXER-6842M, BOXER-8221AI and BOXER-8521AI... |
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DRAM Price Erosion Expected Through the End of 2020, Says IC Insights (2020.10.28) |
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IC Insights’ October Update to The McClean Report showed the monthly average selling price (ASP) of DRAM started on a steep downward trend in the second half of 2018 that eventually bottomed out at $3.04 in December 2019. DRAM prices rebounded in the first half of 2020 as memory demand grew for personal and enterprise computing systems after the Covid-19 virus forced a rapid and dramatic shift to online-based education... |
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Kingston, ADATA, Tigo Take Top Three of SSD Module Makers (2020.10.27) |
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The total worldwide shipments of branded SSDs bound for the channel (retail) market in 2019 reached 131 million units, showing an increase of almost 60% from 2018, according to TrendForce's latest investigations. This result also indicated a further and substantial growth in SSD adoption... |
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Nuvoton NuMaker-IoT-M263A Developing Board Speeds Up IoT Device Design Cycle (2020.10.26) |
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HSINCHU, Taiwan - Nuvoton Technology expanded its IoT platform based on the NuMicro Family product portfolio. The NuMaker-IoT-M263A board is an IoT device development board. With the IoT software development kit provided by NuMicro series products, it supports a wide range of software development work to ensure low power consumption and high-security IoT device design... |
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Renesas and Sequans to Collaborate on 5G/4G Cellular IoT (2020.10.23) |
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Renesas Electronics and Sequans Communications will partner to develop IoT modules based on Sequans’ Monarch LTE-M/NB-IoT platform. The modules are designed to provide IoT companies with an integrated microcontroller (MCU) plus connectivity platform that streamlines and simplifies IoT system design for many applications, including smart city, smart home, and industrial IoT... |
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eMemory Receives 2020 TSMC OIP Partner of the Year Award for Embedded Memory IP (2020.10.22) |
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HSINCHU, Taiwan – eMemory has been recognized by TSMC as a recipient of a 2020 OIP Partner of the Year award for Embedded Memory IP. The OIP Partner of the Year awards honor TSMC Open Innovation Platform® (OIP) ecosystem partners like eMemory, demonstrating excellence in next-generation system-on-chip (SoC) and 3DIC design enablement over the past year... |
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Global and Taiwan Notebook Shipments Hitting Record Highs Again in 2020 (2020.10.22) |
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Shipment volume of the global notebook PC industry is projected to reach 170 million units and represent 6% year-on-year growth in 2020, hitting record highs in nearly five years, according to MIC (Market Intelligence & Consulting Institute), a government think tank and a leading IT research institute in Taiwan... |
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M31 Technology Receives 2020 TSMC OIP Partner of the Year Award (2020.10.22) |
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HSINCHU, Taiwan – M31 Technology has been recognized by TSMC as a recipient of 2020 OIP Partner of the Year award for Specialty Process IP. The OIP Partner of the Year awards honor TSMC Open Innovation Platform® (OIP) ecosystem partners like M31 Technology demonstrating excellence in next-generation system-on-chip (SoC) and 3DIC design enablement over the past year... |
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