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Toyoda Gosei to Partner With Ossia Inc., a Wireless Power Supplier (2020.07.30) |
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Toyoda Gosei has concluded a joint development agreement with Ossia Inc., a U.S. startup that leads the world in the field of wireless power solutions. The two companies will work to apply wireless power technology in vehicle cabins, smart cities, and more... |
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Samtec Announces Over 200,000 Symbols & Footprints for Its interconnect Products (2020.07.30) |
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Samtec, a global manufacturer of interconnect solutions, announced that it now has over 200,000 symbols & footprints for its products to accelerate the design process for engineers.
Engineers spend days creating digital models for each component on their circuit boards, such as symbols and footprints... |
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RF/Microwave to Lead Power Transistor Recovery in 2021 (2020.07.27) |
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The total power transistor market is expected to fall 7% in 2020 because of the Covid-19 virus crisis, but sales are forecast to rebound 7% next year and reach a new record high in 2022, says O-S-D Report.
After three straight years of record-high sales... |
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Cadence and UMC Certify mmWave Reference Flow on 28HPC+ Process for Advanced RF Designs (2020.07.27) |
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HSINCHU, Taiwan - Cadence Design Systems and United Microelectronics Corporation announced that the Cadence millimeter wave (mmWave) reference flow has achieved certification for UMC’s 28HPC+ process technology. With this certification, mutual Cadence and UMC customers have access to an integrated RF design flow that accelerates time to market... |
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M31 Completes the Comprehensive Physical IP Platform on TSMC 22nm Process (2020.07.27) |
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HSINCHU, Taiwan – M31 Technology announced the completion of a comprehensive physical IP platform on TSMC 22nm process, which includes 22nm ultra-low power (22ULP) and 22nm ultra-low leakage (22ULL) process technologies. M31 offers solutions of Foundation IP, Memory IP, High-Speed Interface IP, and Analog IP for customers’ SoC design requirements... |
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Toyoda Gosei Develops Deep UV LED Light Module for Sterilization (2020.07.22) |
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Toyoda Gosei has developed a deep UV LED light module for use in the sterilization of water, air, and surfaces. These new modules take advantage of the technology that the company has accumulated over 30 years in the development and production of blue LEDs... |
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ASE Technology Holding Joins Apple’s Supplier Clean Energy Program (2020.07.22) |
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TAIPEI, Taiwan - ASE Technology announced today that it has joined the Apple Supplier Clean Energy Program. As a leading semiconductor packaging, test and system service provider, ASE is focused on cutting edge manufacturing technologies including System-in-Package (SiP), Heterogeneous Integration (HI), 3D IC, MEMS and sensor, and systems integration that form the backbone of many electronic devices... |
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Chip Manufacturing Equipment Spending to Hit Record High $70 Billion in 2021 After Strong 2020 (2020.07.22) |
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Global sales of semiconductor manufacturing equipment by original equipment manufacturers are projected to increase six percent to $63.2 billion in 2020 compared to $59.6 billion in 2019 before logging record high revenue of $70 billion in 2021 on the strength of double-digit growth, SEMI announced today in releasing its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective at the annual SEMICON West exposition... |
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STMicroelectronics Makes Acquisitions to Further Strengthen the Wireless Connectivity of STM32 MCUs (2020.07.21) |
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STMicroelectronics today announced the signing of two M&A agreements related to the acquisitions of the entire share capital of Ultra Wide Band specialist BeSpoon and of the cellular IoT connectivity assets of Riot Micro. After closing of the two transactions, subject to customary regulatory approvals, ST will further strengthen its offer for wireless connectivity and, in particular, the roadmap for its STM32 microcontrollers and secure MCUs... |
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USB-IF Publishes USB Device Class Specification for MIDI Devices v2.0 (2020.07.20) |
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USB Implementers Forum (USB-IF announced an updated USB Device Class Definition for MIDI Devices, Version 2.0 in support of MIDI 2.0 devices. The standard represents an industry-wide effort by the USB-IF, MIDI Manufacturers Association (MMA), and Association of Musical Electronics Industry (AMEI) to provide MIDI users with an expanded MIDI environment connected by USB... |
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Analog’s $20bn Maxim Deal Another Example of Semiconductor Sector Shakeout, says GlobalData (2020.07.20) |
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The global semiconductor industry has too much capacity, too many players and has had declining revenues since the end of 2018. Market prospects are bleak for the next two years and the recent acquisition of Maxim Integrated by Analog Devices is the latest example of the industry's shakeout, says GlobalData, a leading data and analytics company... |
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Delta Launches New Digital Exhibition of Energy-Efficient Solutions (2020.07.17) |
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Delta today launched an innovative digital exhibition under the theme 'Pioneering Energy-efficient Infrastructure Technologies' to unveil new smart and energy-efficient solutions for 5G and IoT edge computing, e-mobility, as well as smart manufacturing... |
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Faraday Launches Ariel SoC Platform with Infineon’s SONOS eFlash (2020.07.16) |
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HSINCHU, Taiwan - Faraday Technology today launched its next generation IoT SoC development platform, called Ariel, which is built on UMC’s 40uLP logic process combined with Infineon’s SONOS eFlash technology. Compared with its predecessor... |
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