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High-end TV with Mini LED Backlighting Rises, Panel Makers Rush to Develop Active Matrix Technology (2019.12.30) |
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The increase in die bonding efficiency, the decrease in Mini LED chip cost, and the historical low of open cell prices all contributed to the significantly lowered costs of displays utilizing Mini LED backlighting. According to the New Display Technology Cost Analysis quarterly report from the WitsView research division of TrendForce, Mini LED backlighting has significantly lowered the cost of display modules used in 65-inch 4K TVs... |
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328 RAISE PhD Trainees Have Already Been Working in the Industry This Year (2019.12.30) |
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TAIPEI, Taiwan - The 2nd Phase of RAISE program (Rebuild After PhDs' Industrial and Skill Expertise) has been implemented by the Ministry of Science and Technology (MOST) this year in 2019. 425 PhD graduates have been cultivated and 328 of them have already been recruited in the industry... |
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Murata Acquires MIRAISENS, a 3DHaptics Company (2019.12.25) |
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Murata Manufacturing and MIRAISENS, which offers haptic solutions technology using 3DHaptics technology, have signed an agreement for MIRAISENS to become a wholly-owned subsidiary of Murata Manufacturing. However, the specific terms and conditions of this agreement have not been disclosed... |
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ASE Shares Experience with Lights Out Factories (2019.12.25) |
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TAIPEI, Taiwan - In order to promote the smart transformation and upgrading of Taiwan's manufacturing industry and enable both traditional industries and new entrepreneurs to gain an understanding of the practical applications of smart manufacturing... |
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Ten New 300mm Wafer Fabs Expected to Open in 2020, Two of Them in China. (2019.12.22) |
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IC Insights recently released its Global Wafer Capacity 2020-2024 report that provides in-depth analyses and forecasts of IC industry capacity by wafer size, by process geometry, by region, and by product type through 2024.
According to IC Insights, the number of good ICs shipped per wafer increased by an average of only 0... |
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Tencent Cloud and STMicroelectronics Announce Cooperation on IoT Platform (2019.12.20) |
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At Tencent Cloud IoT Ecosystem Summit 2019, Tencent Cloud IoT Division of Tencent Group, and STMicroelectronics, announce their cooperation on Tencent’s latest IoT operation system, TencentOS Tiny LoRaWAN. Through TencentOS Tiny LoRaWAN running on STM32 LoRaWAN software expansion package... |
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Keysight Helps Accelerate Industry Adoption of USB4 Standard (2019.12.20) |
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Keysight Technologies announced that the company’s early research and development in high-speed digital technology will enable the 5G and IoT device ecosystems to accelerate adoption of the recently released USB4 specification... |
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Faraday Unveils New IoT SoC Platform to Accelerate Early-Stage ASIC Development (2019.12.19) |
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HSINCHU, Taiwan - Faraday Technology today introduced the Faraday FIE3240 FPGA platform, the latest addition to its SoCreative! IoT SoC platform series. The reprogrammable FIE3240 platform offers enhanced flexibility and scalability for today’s AIoT SoC designs utilizing Arm Cortex-M series processors... |
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eMemory Joins Arm Ecosystem for Secure IoT Chips (2019.12.19) |
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HSINCHU, Taiwan – eMemory Technology is working with Arm to create new state-of-the-art secure solutions for Internet of Things (IoT) chips.
eMemory will provide its proprietary NeoFuse IP to be implemented into the Arm CryptoIsland-300P family of hard macros to enable persistent storage... |
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Innodisk Group Strengthens AIoT Vision with Sysinno Acquisition (2019.12.18) |
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TAIPEI, Taiwan - Innodisk is announcing the addition of Sysinno Technology to Innodisk Group. The acquisition strengthens Innodisk Group’s ambition to bring the future of Artificial Intelligence and the Internet of Things (AIoT) to customers around the world... |
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Baidu and Samsung Ready for Production of New Edge AI Chip for Early Next Year (2019.12.18) |
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Baidu and Samsung Electronics today announced that Baidu’s first cloud-to-edge AI accelerator, Baidu KUNLUN, has completed its development and will be mass-produced early next year.
Baidu KUNLUN chip is built on the company’s advanced XPU, a home-grown neural processor architecture for cloud, edge, and AI, as well as Samsung’s 14-nanometer (nm) process technology with its I-Cube (Interposer-Cube) package solution... |
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