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MOST: New Record on Ultrafast Green Micro-LED Array (2022.02.17) |
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“Ultrafast optical wireless data streaming for transmitting a high-definition video signal within one second with directly using the smart display made by RGB micro-LEDs” will come true soon. Under the continued support by the Ministry of Science and Technology (MOST) in Taiwan, Professor Gong-Ru Lin, Professor Hao-Chung Kuo, and Dr... |
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ICInsights:Semiconductor Sales To Rise at 7.1% CAGR Through 2026 (2022.02.14) |
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IC Insights has released its forecast and analysis of the worldwide semiconductor industry in its January Semiconductor Industry Flash Report—part of the 2022 McClean Report service.
The report forecasts total semiconductor sales will rise 11% this year following a very strong 25% increase in 2021 and an 11% increase in 2020... |
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PUFsecurity Launch New Hardware Root of Trust IP for Future Computing (2022.02.09) |
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PUFsecurity, a subsidiary of eMemory, launches a new generation of its flagship product, PUFrt. This implementation brings together a Hardware Root of Trust with eMemory’s quantum-tunneling PUF in compliance with cutting-edge computing for the cloud and beyond... |
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Andes Partnership with Intel's IFS to Provide RISC-V IP to SoC Designers Using (2022.02.09) |
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Andes Technology announce that Andes has joined the IP Alliance of Intel Foundry Services (IFS) Accelerator program. Andes provides comprehensive solution of RISC-V CPU IP cores from entry level to high-end products to meet application requirements from edge to cloud, including its RISC-V Superscalar Multicore A(X)45MP and Vector Processor NX27V... |
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MediaTek Shows The World’s First Live Demos of Wi-Fi 7 Technology (2022.01.26) |
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MediaTek announced the world’s first live demo of Wi-Fi 7 technology, highlighting the capabilities of its forthcoming Wi-Fi 7 Filogic connectivity portfolio. MediaTek is currently showcasing two Wi-Fi 7 demos to key customers and industry collaborators to demonstrate the technology’s super-fast speeds and low latency transmission... |
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Apple Joins in imec's Program to Reduce Ecological Footprint of Semiconductor (2021.11.03) |
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Imec announced that Apple Inc. has joined imec’s brand-new Sustainable Semiconductor Technologies and Systems (SSTS) research program. The SSTS program is the first initiative rallying stakeholders from across the IC value chain to anticipate the environmental impact of choices made at chip technology’s definition phase... |
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AUO Teams Up with ADLINK to Envision Visualization at the Edge (2021.11.02) |
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HSINCHU, Taiwan – Today, AUO and ADLINK jointly held their first ever virtual technology forum themed “Visualization at the Edge” to share the industry trends and applications of the visualization of edge computing and jointly increase the possibilities of complementing, collaboration, and co-creation with global ecosystem partners in the hope of accelerating key decision-making at the edge and realizing the future with 5G and AI... |
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Bird Debuts Smart Sidewalk Protection with u-blox (2021.11.02) |
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Bird, the leader in environmentally friendly electric transportation, today announced the first-of-its-kind smart sidewalk protection technology - a sensor fusion solution - designed and developed in partnership with u-blox, which is integrated into Bird’s vehicles, is designed to prevent micromobility devices from being used on sidewalks and footpaths... |
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DRAM Prices Projected to Enter Period of Downswing in 2022, Says TrendForce (2021.10.12) |
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DRAM contract prices are likely to exit a bullish period that lasted three quarters and be on the downswing in 4Q21 at a QoQ decline of 3-8%, according to TrendForce’s latest investigations.
This decline can be attributed to not only the declining procurement activities of DRAM buyers going forward, but also the drop in DRAM spot prices ahead of contract prices... |
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Samsung Starts Mass Production of 14nm EUV DDR5 DRAM (2021.10.12) |
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Samsung Electronics today announced that it has begun mass producing the industry's smallest, 14-nanometer (nm), DRAM based on extreme ultraviolet (EUV) technology. Following the company’s shipment of the industry-first EUV DRAM in March of last year, Samsung has increased the number of EUV layers to five to deliver today’s finest, most advanced DRAM process for its DDR5 solutions... |
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Samsung Introduces Industry's First Open-Source Software Solution for CXL Memory (2021.10.08) |
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Samsung Electronics introduced the first open-source software solution, the Scalable Memory Development Kit (SMDK), that has been specially designed to support the Compute Express Link (CXL) memory platform.
In May, Samsung unveiled the industry’s first CXL memory expander that allows memory capacity and bandwidth to scale to levels far exceeding what is possible in today’s server systems... |
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A New Memory Device that Can Store and Transmit Data Visually (2021.10.08) |
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TAIPEI, Taiwan - Taiwan’s National Taiwan Normal University Prof. Ya-Ju Lee and Kyushu University Prof. Kaoru Tamada have developed a new device that needs only a single semiconductor known as perovskite to simultaneously store and visually transmit data... |
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New framework of Platform Management Features for COM-HPC Based Edge Computing Designs (2021.08.15) |
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PICMG, a leading consortium for developing open embedded computing specifications, announces the release of the COM-HPC Platform Management Interface (PMI) specification. It provides a framework of remote and out-of-band platform management features for COM-HPC Computer-on-Module based edge computing designs and is freely available on the PICMG website... |
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