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Covestro Relies on Circulating Process Water (2021.08.03) |
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Covestro intends to increase the circular use of process water in the future. To this end, the company is focusing specifically on research and development and is participating in the new RIKovery research project (funding code 02WV1569)... |
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MIKROE’s Universal FUSION Development Board for All Microchip PIC MCU (2021.07.14) |
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MikroElektronika (MIKROE), the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, has launched FUSION for PIC v8, offering universal support for PIC, dsPIC, PIC24, PIC32 microcontrollers on one board... |
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SGET Announces New Chairman and Sets Sail for a New Decade (2021.07.11) |
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SGET, an international not-for-profit association of companies and organizations that collaboratively develop independent specifications for embedded computer technology, held its triennial management board election. The group elected a new chairman and re-elected four members of the board to lead the association through 2024... |
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STMicroelectronics and Metalenz Partner to Transform Optical Sensing (2021.07.01) |
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STMicroelectronics and Metalenz Inc., the pioneer in meta-surface design and commercialization, today announced a co-development and license agreement that will see ST develop manufacturing processes for Metalenz’s meta-optics technology for next-generation smartphones, consumer devices, healthcare, and automotive applications... |
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Pervasive Displays Adds Rugged EPDs to its Product Portfolio (2021.06.18) |
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TAINAN CITY, Taiwan – Pervasive Displays, recognized specialist in the development and supply of e-paper displays (EPDs), has further expanded the range of potential use cases that its products can support through introduction of the new Armor offering... |
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Samsung Starts Mass Production of LPDDR5 Multichip Package (2021.06.16) |
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Samsung Electronics announced that it has begun mass producing its latest smartphone memory solution, the LPDDR5 UFS-based multichip package (uMCP). Samsung’s uMCP integrates the fastest LPDDR5 DRAM with the latest UFS 3.1 NAND flash, delivering flagship-level performance to a much broader range of smartphone users... |
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Samsung Starts Mass Production of Industry’s Smallest 0.64μm-pixel Mobile Image Sensor (2021.06.10) |
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Samsung Electronics today introduced the industry’s first 0.64-micrometer (μm)-pixel image sensor, the 50-megapixel (Mp) Samsung ISOCELL JN1. Equipped with the latest pixel technologies such as enhanced ISOCELL 2.0, Smart-ISO and Double Super PDAF, the JN1 can capture more vivid images on the industry’s smallest 50Mp mobile sensor... |
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Zeitfracht Acquires Sauter Feinmechanik (2021.06.09) |
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Zeitfracht Group acquires the system supplier of machine tools SAUTER Feinmechanik. Being a family-owned company from Metzingen, Germany, SAUTER is the world market leader for tool turret technology.
With its motor spindles, tooling, automation solutions and rotary tables, SAUTER is also one of the leading companies in the areas of tool and workpiece carrier systems... |
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eMemory and PUFsecurity Join DARPA Toolbox Initiative (2021.06.09) |
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HSINCHU, Taiwan – eMemory today announced a partnership agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to enable furthering of accelerated technology innovation for the agency’s programs.
The agreement makes eMemory’s NeoFuse... |
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Imec, Sivers Photonics and ASM AMICRA to Accelerate InP Lasers and Silicon Photonics (2021.06.08) |
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imec together with Sivers Photonics (formerly CST Global, and a subsidiary of Sivers Semiconductors), and ASM AMICRA Microtechnologies announce the successful wafer-scale integration of indium-phosphide (InP) distributed feedback (DFB) lasers from Sivers’ InP100 platform onto imec’s silicon photonics platform (iSiPP)... |
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COMPUTEX 2021 Virtual Now Open Showcasing the Tech Ecosystem (2021.06.01) |
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TAIPEI, Taiwan - COMPUTEX kicked off this year’s month-long #COMPUTEXVirtual on May 31 with James Huang, TAITRA Chairman, highlighting the not-to-be-missed events.
Michelle Johnston Holthaus, Intel Executive Vice President, Chief Revenue Officer, discussed accelerating digital transformation and how to release a new era of innovation when the world is most looking forward to innovation... |
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