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TI CEO Rich Templeton to deliver keynote at Citi investor conference (2017.08.23)
Texas Instruments Incorporated (TI) Chairman, President and Chief Executive Officer Rich Templeton will deliver keynote remarks at the 2017 Citi Global Technology Conference in New York City on Wednesday, September 6, at 4:35 p |
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Semiconductor Industry Capital Spending Forecast to Jump 20% in 2017 (2017.08.23)
According to IC Insights’ latest forecast is for semiconductor industry capital spending to climb 20% this year.
The figure shows the steep upward trend of quarterly capital spending in the semiconductor industry since 1Q16 |
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ADI announces Current Mode, 2MHz Step-up DC/DC Converter With an Internal 2A, 60V Switch (2017.08.22)
Analog Devices announced the LT8362, a current mode, 2MHz step-up DC/DC converter with an internal 2A, 60V switch. It operates from an input voltage range of 2.8V to 60V, suitable for applications with input sources ranging from a single-cell Li-Ion battery to automotive and industrial inputs |
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Würth Elektronik eiSos Expands Mix and Match Selection Tool (2017.08.21)
Würth Elektronik eiSos placed a tool at developers’ disposal which facilitates selection of the appropriate transmitter and receiver coils.
As with REDEXPERT the product specifications accessible for Mix and Match are based on extensive measurements of the electrical response of individual coils in sample applications |
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Polysilicon Prices to Remain High in Q3 Even Though Supply Might Start to Improve in Mid-September (2017.08.18)
According to EnergyTrend's report, finds that the average global spot price of polysilicon has surged by 20% between the end of July and the middle of August.
The polysilicon supply has tightened up suddenly because the leading supplier in China had to do an emergency repair at one of its factories |
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JSC Introduces Serial Interface OctaRAM Combining with MXIC OctaFlash (2017.08.17)
JSC announced the Octa serial interface RAM, the OctaRAM JSC64SS product family. OctaRAM provides designers with the next generation performance level of x8 I/O serial interface products with an operating frequency of up to 200MHz and transmission speeds of up to 400MB/s |
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DRAM, NAND Flash, Automotive Analog/Logic Among Best-Growing ICs (2017.08.16)
IC Insights has revised its outlook and analysis of the IC industry and presented its new findings in the Mid-Year Update to The McClean Report 2017.
Among the revisions is a complete update of forecast growth rates of the 33 main product categories classified by the World Semiconductor Trade Statistics organization (WSTS) |
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2Q17 Server DRAM Revenue of the Top Three Suppliers Rose by 30.1% (2017.08.15)
For this second quarter, the total server DRAM revenue of the global top three DRAM makers – Samsung, SK Hynix and Micron – jumped by 30.1% compared with the prior quarter, as ASPs of server DRAM products remained high on continuing undersupply, says DRAMeXchange |
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Ultra-Wideband 3GHz to 20GHz Mixer Supports DC to 6GHz IF & 0dBm LO Drive (2017.08.15)
Analog Devices announced the LTC5552, a double balanced mixer that features wideband matching from 3GHz to 20GHz.
The mixer can be used as an up- or downconverter. The LTC5552 is especially useful in upconversion applications with its DC capable differential IF port that enables the LO to be close in frequency to the RF |
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Axiomtek COM Express Type 10 Mini Module Offers High Graphics Capability (2017.08.11)
Axiomtek introducied the CEM311, its COM Express Type 10 Mini module featuring Intel Apollo Lake processor, high graphics capabilities, a wide temperature range, and I/O options in a compact form factor.
The new CEM311 is designed to support the Intel Pentium N4200 quad-core and Celeron N3350 dual-core processors (codename: Apollo Lake) |
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Würth Elektronik eiSos Series 8050 Available Either As a Two or Three-pole Version (2017.08.09)
Würth Elektronik eiSos offers an addition to its “Wire Protection System WR-TBL” product family: Series 8050 is a horizontal entry clamp in 2.5-mm pitch, available either as a two or three-pole version.
What makes this component unique is its combination of properties: perfect for pure SMT assembly without drilling, extremely small (5 mm high) and these parts have screwless spring clamping |
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Vishay Intertechnology RF MLCCs provides Industry's First Operating Temps to +200 °C in Small Cases (2017.08.08)
Vishay Intertechnology introduced new surface-mount multilayer ceramic chip capacitors (MLCCs) for high frequency RF and microwave applications to offer an operating temperature range to +200 °C.
For telecom base stations and military communication systems, the Vishay Vitramon VJ HIFREQ HT series provides ultra high Q and low ESR in four compact case sizes |
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Excelero Expands Scale-out Storage Offerings by Combining Intelligent Software with NICs (2017.08.08)
Excelero announced that it has validated its NVMesh server SAN software on the Broadcom NetXtreme BCM57414 25/50Gb Ethernet network interface card (NIC).
The combined solution provides enterprise IT architects with a new option for storage in hyperscale data centers – one that's equipped with the low-latency RoCE support |
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Microsemi Announces New Switchtec PAX Advanced Fabric PCIe Switch (2017.08.07)
Microsemi announced the availability of its Switchtec PAX advanced fabric Gen3 PCIe switch providing fabric connectivity for scalable, multi-host systems and just a bunch of flash (JBOF) supporting single root input/output (I/O) virtualization (SR-IOV), NVMe and multi-function endpoints |
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Broadcom Announces High-Performance Data Center SoC with Integrated NetXtreme Ethernet Controller (2017.08.04)
The Broadcom NetXtreme S-Series BCM58800 family of data center System-on-Chip (SoC) devices are purpose-built to enable solutions in the evolving data center.
The devices integrate networking and processing subsystems for a wide range of data center applications including programmable NIC (or Smart NIC) for data plane acceleration and high-performance Flash storage disaggregation using NVMe-over-Fabrics (NVMe-oF) |
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Latest Fab Plans in China Need Government Subsidies to Minimize Risks of Losses in Short/Medium Term (2017.08.03)
According to TrendForce’s research on semiconductor fab plans in China after 2016 finds that a total 17 new fabs are slated for construction so far. Five of these plants will be for processing 8-inch wafers and the remaining 12 plants will be for processing 12-inch wafers |
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Littelfuse Compact Auto-Grade ESD Suppressors Protects Against Transients up to 30kV (2017.08.02)
Littelfuse announced a surface-mount, polymer automotive-grade electrostatic discharge suppressors capable of protecting sensitive devices from contact/air discharges as high as 30kV.
The AXGD Series XTREME-GUARD ESD Suppressors are specifically designed for high-frequency, high-speed applications with high voltage ratings (up to 32VDC) and extreme ESD protection requirements |
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DRAM, NAND Flash Memory Markets Drive the First Annual Double-digit Upturn since 2010 (2017.08.02)
Entering the second half of the year, it is clear the IC industry is on course for a much stronger upturn than was initially forecast in January. According to IC Insights’ reports, the IC market to increase 16% in 2017 due to exceptional growth in the DRAM and NAND flash memory markets |
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COM Express Type 7 Server-on-modules Simplifies Micro Server Designs (2017.07.28)
congatec launches the new COM Express Type 7 quick starter set as the fundamental basis for OEM’s modular micro server designs.
The new quick starter set simplifies the evaluation of the first server-on-modules designed in accordance to PICMG’s COM Express Type 7 standard, poised to be deployed in cloud, edge, and fog server applications |
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Synopsys HBM2 IP Solution Offering More Than 300 GB/s Bandwidth for Graphics and High-Performance Co (2017.07.27)
Synopsys introduced its DesignWare High Bandwidth Memory 2 (HBM2) IP solution consisting of controller, PHY and verification IP, enabling designers to achieve up to 307GB/s aggregate bandwidth, which is 12 times the bandwidth of a DDR4 interface operating at 3200Mb/s data rate |
Hardware assembling together, unable to contact each other just a bunch of parts, parts to be able to communicate with each other, communication and coordination, in order to constitute the basis of the overall "system", the BIOS will play this role.