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Photoplethysmography to Pursue Higher Accuracy, Leading to High Growth in IR Optical Components (2018.06.11)
According to LEDinside’s 2018 Infrared Sensing Application Market Report, pulse oximeter heart rate sensors have been widely introduced into smartwatch and wristband markets, pushing the demand for infrared optical components |
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Nuvoton Launches High Performance NuMicro M480 Series Arm Cortex-M4 MCU (2018.06.11)
HSINCHU, Taiwan – Nuvoton Technology announces the launch of its high performance, low power NuMicro M480 series - an Arm Cortex-M4 based microcontroller, supporting DSP instruction and integrated floating-point unit. The M480 series provides rich features and consists of six sub-series targeting different applications |
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Winbond Extends Serial NAND Flash Memory with 1Gbit Device with Data-Transfer Rate of 83MB/s (2018.06.11)
TAICHUNG, Taiwan - Winbond Electronics Corporation announced the introduction of the W25N01JW, a high-performance, 1.8V Serial NAND Flash memory IC delivering a new high in data-transfer rates: 83MB/s via a Quad Serial Peripheral Interface (QSPI) |
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Customized Emulator Testing Overcomes Challenges Arising From Different Standards (2018.06.11)
With the booming development of IoT application, major brands have built protocol platforms and jumped into the most competitive market, the smart home system. In addition, organizations including Wi-Fi, Bluetooth, Zigbee and LoRa also created relevant technologies in full swing to edge into the IoT system |
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COMPUTEX Draws to a Close After Attracting 42,200 International Buyers (2018.06.11)
TAIPEI, Taiwan - Hosted by Taiwan External Trade Development Council (TAITRA) and Taipei Computer Association (TCA), COMPUTEX 2018 drew to a close on June 9th. According to TAITRA statistics, over the course of 5 days the exhibition attracted 42,200 international buyers from 168 different countries, which was a 1% increase over the previous year |
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TYAN Showcases HPC, Storage and Cloud Server Platforms at Computex 2018 (2018.06.07)
TAIPEI, Taiwan –TYAN, an server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, is exhibiting a full line of HPC, cloud computing and storage server platforms that are optimized for HPC, Artificial Intelligence and Datacenter markets at Computex 2018 in Taipei, Taiwan, through June 9 |
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BIOSTAR Presents Latest Crypto Mining, Gaming Products at COMPUTEX 2018 (2018.06.07)
TAIPEI, Taiwan - BIOSTAR unveils its latest crypto mining, gaming and smart home products featuring next-generation technologies at COMPUTEX 2018. This year, BIOSTAR showcases its crypto mining solutions with its BTC line in both Intel B360 chipset and AMD B350 platforms, RACING Intel 300 and AMD X470 gaming motherboards, graphics cards, and the new iMiner pre-built mining solutions |
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Lian Li Partners with Razer for Special Edition PC-O11 Dynamic Designed by Razer Chassis (2018.06.07)
TAIPEI, Taiwan – Lian Li Industrial Co. Ltd., a manufacturer of aluminum chassis for enthusiasts, custom OEM/ODM case solutions and case accessories in partnership with Razer, announced the launch of a special edition PC-011 Dynamic chassis |
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MediaTek: We are in the Leading Position in 5G (2018.06.06)
TAIPEI, Taiwan - MediaTek, Inc. on June 5 announced that they would host their “Annual COMPUTEX Media Event,” with themes focusing on 5G and AI, and they also announced that they will release 5G products in 2019.
MediaTek CEO Rick Tsai shared the company’s strategies for 5G and AI and also emphasized their ability to bring about the top experience for users in terms of 5G and AI while bringing these technologies into public life |
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ASUS Announces New ZenBook and VivoBook at Computex 2018 (2018.06.05)
TAIPEI, Taiwan — ASUS Chairman Jonney Shih today hosted a press event at Computex 2018, unveiling all-new products, including ZenBook Pro 15 and ZenBook Pro 14 with the revolutionary ScreenPad input device, the triple-award-winning ZenBook S, a full lineup of VivoBook notebooks, and the VivoWatch BP wearable blood-pressure monitor |
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Acer Chromebook 11 Wins Gold at Computex d&i Awards 2018 (2018.06.05)
TAIPEI, Taiwan – Acer announced today that it has captured the d&i gold award at Computex 2018 for exceptional design, earning a total of four d&i awards. Acer also earned three Computex Best Choice Awards.
The awards winning products including Acer Chromebook 11(Winner of the d&i gold award) |
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Three New Class-D Amplifiers Solve Smart-Home Audio Design Challenges (2018.06.04)
Texas Instruments (TI) introduced three new digital-input Class-D audio amplifiers that enable engineers to deliver high-resolution audio in more smart-home and voice-enabled applications.
By combining first-of-its-kind integration, real-time protection and new modulation schemes, TI's new audio devices allow designers to reduce board space and overall bill of material (BOM) cost |
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Toshiba Releases Interface Bridge Devices for Automotive Infotainment Applications (2018.06.04)
Toshiba Electronic Devices & Storage Corporation announces a new range of video interface bridge devices intended for modern automotive In-Vehicle Infotainment (IVI) applications.
Increasingly, Systems-on-Chip (SoCs) from smartphones and tablets have been used in automotive applications as IVI systems became more sophisticated, requiring more functionality and greater performance |
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Airgain Announces Development of 802.11ax Technology at COMPUTEX 2018 (2018.06.04)
TAIPEI, Taiwan - Airgain, Inc. today announced it is actively engaged in the development of IEEE 802.11ax Over-the-Air (OTA) optimized reference designs for multiple tier 1 and tier 2 vendors of 802.11ax chipsets. It also confirmed it is in the performance verification phase of multiple commercial programs with leading service providers of 802 |
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Supermicro Announces Cost-Saving Green Computing at COMPUTEX 2018 (2018.06.04)
TAIPEI, Taiwan — Super Micro Computer today announced its new green computing with Resource Saving datacenter and cloud solutions, including SuperBlade, BigTwin and all-flash NVMe composable storage systems at Computex Taipei 2018 |
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NVIDIA, Taiwan’s MOST Unveil Collaboration to Supercharge AI Efforts (2018.06.04)
TAIPEI, Taiwan - NVIDIA and Taiwan’s Ministry of Science and Technology today announced an extensive collaboration that will advance Taiwan’s artificial intelligence capabilities.
Announced at the start of Computex 2018, the partnership will extend over the next decade to build up local deep learning and associated AI technologies |
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Taiwan Mobile, Asus, and Quanta Team Up to Collectively Form National AI Cloud Platform (2018.06.04)
TAIPEI, Taiwan - Taiwan’s Ministry of Science and Technology (MOST) announced the development of a national AI cloud platform in Taiwan by a collaborative team comprised of Taiwan Mobile, Asus, and Quanta. The platform is expected to be completed in December 2018 |
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Increase System Performance in Closed-loop Control Applications with New PIC and AVR MCUs (2018.06.01)
From pool pumps to air handling units, closed-loop control is one of the most fundamental tasks performed by embedded systems. Advancements in the architecture of PIC and AVR 8-bit microcontrollers (MCUs) have optimized the devices for implementing closed-loop control, enabling systems to offload the Central Processing Unit (CPU) to manage more tasks and save power |
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The Automotive IC Market to Raise 18.5% YoY This Year, IC Insights Says (2018.06.01)
Consumer demand and government mandates for electronic systems that improve vehicle performance, that add comfort and convenience, and that warn, detect, and take corrective measures to keep drivers safe and alert are being added to new cars each year |
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Toshiba Memory Corporation and Synopsys Collaborate to Accelerate 3D Flash Memory Verification (2018.05.31)
Synopsys announced that it has collaborated with Toshiba Memory Corporation to accelerate the verification of Toshiba Memory Corporation's BiCS FLASH vertically stacked three-dimensional (3D) flash memory. By working closely with Toshiba Memory Corporation, Synopsys introduced innovative simulation algorithms in its FineSim Pro FastSPICE tool to address the increased design complexity of 3D NAND Flash memory |
