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Semiconductor Units Forecast To Exceed 1 Trillion Devices Again in 2021 (2021.04.11)
Total semiconductor unit shipments, which include integrated circuits as well as optoelectronics, sensor/actuator, and discrete (O-S-D) devices, are forecast to rise 13% in 2021, to 1,135.3 billion (1.1353 trillion) units to set a new all-time annual record, based on data presented in the 2021 edition of IC Insights’ McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry |
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Acer Reports Q1’21 Preliminary Revenue at NT$71.56 Billion, Up 46.5% YoY (2021.04.11)
TAIPEI, Taiwan - Acer announced its preliminary consolidated revenues for the first quarter of 2021 at NT$71.56 billion, up 46.5% year-on-year (YoY), and marking the highest quarter of the same period in seven years. Consolidated revenues for March reached NT$27 |
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Acer Reports Q1’21 Preliminary Revenue at NT$71.56 Billion, Up 46.5% YoY (2021.04.11)
TAIPEI, Taiwan - Acer announced its preliminary consolidated revenues for the first quarter of 2021 at NT$71.56 billion, up 46.5% year-on-year (YoY), and marking the highest quarter of the same period in seven years. Consolidated revenues for March reached NT$27 |
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Intel Steps up Hiring in Taiwan to Secure Semiconductor Chips supply Chain for PC Partners (2021.04.11)
Intel Corporation (Intel) is ramping up hiring activity globally but more so in Taiwan. The move forms part of Intel’s strategy to scale the existing supply chains with PC manufacturers in Taiwan and work with external foundries to ensure design, quality, and reliability of its products, observes GlobalData, a leading data and analytics company |
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u-blox Acquires Full Ownership in Sapcorda Joint Venture (2021.04.08)
u-blox announced that it has acquired full ownership of Sapcorda Services GmbH, a joint venture formed by u-blox, Bosch, Geo++, and Mitsubishi Electric.
Sapcorda is the leading provider of advanced GNSS augmentation services serving the high precision GNSS mass market |
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Enter Quantum Electronics Via Patterned Strain Engineering (2021.04.08)
Diamond is hard and transparent and is also a good insulator. The graphite, by contrast, is soft and dark and easy to conduct electricity. These two seemingly distant substances are actually composed of the same atom, i.e. carbon |
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Avalue Brings AIoT to Taipei City with Innodisk Partnership (2021.04.08)
TAIPEI, Taiwan – Avalue Technology Inc. announced today a new partnership with Innodisk, with the goal of bringing AIoT to Taipei City streets. This radical AIoT solution includes EPC-APL from Avalue and the InnoAGE SSD from Innodisk, and enables AI recognition with smart cameras for object detection, behavior identification, and traffic flow monitoring, all together making traffic easier to manage |
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AAEON Announces New Upcoming Platforms Powered by NVIDIA Jetson Edge AI Platform (2021.04.08)
AAEON announces a lineup of platforms currently under development powered by the newly released NVIDIA Jetson TX2 NX system on module (SOM). This range of systems, named the BOXER-823x Series, will augment AAEON’s lineup of diverse solutions powered by the NVIDIA Jetson edge AI platform |
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AUO Partners with ADLINK to Introduce All-in-One Medical Panel Computers to NTU Hospital (2021.04.08)
HSINCHU, Taiwan – In the post-pandemic era, hospitals and clinics are at the frontline of epidemic prevention and control. AUO and its subsidiary AUO Display Plus have partnered with ADLINK Technology, the global leader in industrial computers, to introduce 20 medical panel computers equipped with AUO Display Plus medical displays to National Taiwan University Hospital |
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Wiwynn Boosts Two-phase Immersion Cooling Development by Investing in LiquidStack (2021.03.28)
TAIPEI, Taiwan - Wiwynn announced an investment in LiquidStack, the world’s largest liquid cooling company, through Series A funding and obtained one seat on the board of directors. Wiwynn and LiquidStack will also build strategic partnerships to enable the synergistic advancement of next-generation cloud IT infrastructure designed for two-phase immersion cooling in data centers, edge and high-performance computing (HPC) |
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u-blox Announces First Timing Solutions Based on L1 and L5 GNSS Signals (2021.03.28)
u-blox has announced its first multi-band high accuracy timing solutions to concurrently support the L1 and L5 GNSS (global navigation satellite system) signals. The ZED-F9T-10B and LEA-F9T-10B timing modules, and the RCB-F9T-1 timing card deliver nanosecond-level timing accuracies required to synchronize cellular network base stations and smart power grids |
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Mitsubishi Electric to Launch 80x60 pixel Thermal Diode Infrared Sensor (2021.03.14)
Mitsubishi Electric Corporation announced that its Mitsubishi Electric Diode InfraRed (MelDIR) sensor lineup will introduce on July 1 a new thermal sensor featuring a wide field of view (FoV) and high 80x60 pixel resolution for applications including security, heating, ventilation and air conditioning (HVAC), people counting, smart buildings and thermal scanners |
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Astera Labs Expands Focus to Deliver Purpose-Built Solutions Addressing Connectivity Bottlenecks (2021.03.14)
Astera Labs announces its expanded focus to address system-wide performance bottlenecks in data-centric applications. The new Aries Compute Express Link (CXL 2.0) Smart Retimer portfolio (PT5161LX, PT5081LX) for low-latency CXL |
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Toshiba Releases 650V Super Junction Power MOSFETs in TOLL Package (2021.03.14)
Toshiba has launched 650V super junction power MOSFETs, TK065U65Z, TK090U65Z, TK110U65Z, TK155U65Z and TK190U65Z, in its DTMOSVI series that are housed in a TOLL (TO-leadless) package. Volume production shipments start today.
TOLL is a surface-mount package that has an approximately 27% smaller footprint than the usual D2PAK package |
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New Autodesk Fusion 360 App from SnapEDA Makes PCB Part Libraries a Snap (2021.03.12)
SnapEDA is releasing the SnapEDA for Autodesk Fusion 360 app in collaboration with Autodesk.
This new app integrates SnapEDA’s database directly within Fusion 360, enabling electronics engineers and designers to search and place millions of electronic component models - including symbols, footprints and 3D models - directly within the Fusion 360 environment |
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WL-SIQW – High Efficiency Infrared Light Source (2021.03.03)
Würth Elektronik complements its infrared product range with the new WL-SIQW SMT Infrared QFN LED Waterclear product series. The LEDs in Quad Flat No Leads (QFN) format are available in 2720, 3535 and 3737 packages with different radiant intensities from 125 to 800 mW/sr and in 90°, 120° or 150° beam angles |
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Global IT Spending to Jump by $228B and hit $3.92T in 2021 (2021.03.03)
The COVID-19 crisis forced companies and organizations across the globe to speed up the digitalization of their business, as remote working and distance learning became the new normal amid the ongoing lockdown.
The surge in the use of digital solutions and services abated the pandemic’s negative effect on IT spending, which still dropped to just under $3 |
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Kioxia Establishing A New 6th-Gen 3D Flash Memory Factory (2021.02.25)
Kioxia Corporation held a groundbreaking ceremony for its state-of-the-art semiconductor fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan. The facility will be one of the most advanced manufacturing operations in the world, dedicated to production of its proprietary 3D flash memory BiCS FLASH |
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PICMG Announces Official Ratification of COM-HPC Specification (2021.02.25)
PICMG announces that COM-HPC has been approved and ratified, and is now available for public download and distribution.
"Twenty-six industry-leading companies worked together diligently and cohesively over a span of five years”, said Christian Eder, the COM-HPC Working Group Chair |
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SRG-3352C: The Intelligent Solution for Edge Networks (2021.02.25)
AAEON announces the SRG-3352C Compact Edge IoT Gateway System. The SRG-3352C brings reliable, cost effective gateway operations with expandability and wireless communication support designed to quickly deploy edge networks in a variety of environments |
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