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Mitsubishi Electric to Launch “EcoAdviser” AI-enabled Energy Software (2020.10.19)
Mitsubishi Electric Corporation (announced today that the company’s new EcoAdviser data-analysis and diagnostic software (MES3-EAP1-AI) for increased energy savings at manufacturing facilities will be released on October 26 |
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AUO to Take Advantage of Smart Vertical Opportunities from 5G + AI Digital Transformation (2020.10.15)
HSINCHU, Taiwan – The COVID-19 pandemic has accelerated the pace of digital transformation for the entire industry. Innovative fusion of 5G, AI and display technologies is now crucial for turning crisis into opportunity in the post-pandemic era |
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MicroSAM – The New Microcontroller-Agnostic Module Form Factor for the Enablement of Smart Sensors (2020.10.13)
PICMG, a leading consortium for the development of open embedded computing specifications, announces the ratification of the MicroSAM specification. MicroSAM is a new microcontroller-agnostic, ultra-small form-factor module for the enablement of smart sensors |
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AU Optronics Reports September 2020 Consolidated Revenue of NT$26.08 Billion, 9.2% YoY (2020.10.13)
AU Optronics Corp. today announced its unaudited consolidated revenue of NT$26.08 billion for September 2020, up by 7.5% month-over-month and 9.2% year-over-year. Consolidated revenues in the third quarter of 2020 were NT$73.23 billion, up by 15 |
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Acer Reports September Consolidated Revenues of NT$29.51 Billion, Record High in 72 Months (2020.10.13)
TAIPEI, Taiwan – Acer announced today its consolidated revenues for September at NT$29.51 billion, reaching a record high in 72 months, and up 21.3% year-on-year (YoY) or 8.2% month-on-month.
Preliminary consolidated revenues for the third quarter of 2020 reached NT$80 |
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Imec Presents Alternative Metals in Advanced Interconnect and Contact Schemes As a Path to 2nm Nodes (2020.10.10)
At the 2020 International Interconnect Technology Conference, imec demonstrates for the first time electrically functional 2-metal-level interconnects fabricated with Ru semi-damascene and airgap technology showing a long lifetime and good mechanical strength |
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HOLTEK New BC66F5132 2.4GHz Transmitter with Encoder MCU (2020.10.09)
Holtek announced the release of its new 2.4GHz unidirectional RF Flash MCU, the BC66F5132. The RF characteristics of this new device are fully compliant with ETSI/FCC specifications. The device has data rates of 125 kbps, 250 kbps and 500kbps and includes a frequency hopping function |
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Small Size, Highly Reliable PCIe M.2 SSD for Industrial Applications (2020.10.09)
Swissbit announces the introduction of its N-20m2 SSD module, which delivers high speed PCIe performance from a small M.2 2230 form factor. The module utilizes Swissbit’s recently launched EN-20 PCIe-BGA component to minimize PCB space requirements while offering a wide storage capacity range of up to 480 GB as well as 4-lane PCIe-3 |
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CyberLink Adds Mask Detection and Temperature Measurement to its FaceMe Security Solution (2020.10.07)
TAIPEI, Taiwan - CyberLink announced FaceMe Security’s Health Add-on, the ultimate unobtrusive health-monitoring solution for any facility. The AI engine recognizes if a person is wearing a mask properly over their nose and mouth, verifies identity, and measures temperature |
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Edgecore Networks Offers Commercial Support and Service for SONiC (2020.10.07)
HSINCHU, Taiwan - Edgecore Networks today announced the availability of its commercial support and service offering for a hardened, tested, and qualified Enterprise SONiC distribution on Edgecore switch platforms.
SONiC (Software for Open Networking in the Cloud) is the open-source network operating system |
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TrendForce Announces 10 Tech Industry Trends for 2021 (2020.10.06)
TAIPEI, Taiwan - TrendForce presents its forecast of 10 key trends in the tech industry for 2021, across various sectors including semiconductors, DRAM, NAND Flash, telecommunications, TVs, foldable displays, LED, IoT, AR/VR, and self-driving cars |
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ST Pioneers Smaller, Faster Chargers and Power Supplies with World’s First Driver and GaN Device (2020.10.06)
STMicroelectronics has unveiled MasterGaN, the world-first platform embedding a half-bridge driver based on silicon technology along with a pair of gallium-nitride (GaN) transistors. The combination will accelerate the creation of next-generation compact and efficient chargers and power adapters for consumer and industrial applications up to 400W |
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Lextar Partners With X Display to Accelerate MicroLED Mass Production (2020.10.06)
HSINHU, Taiwan – Lextar Electronics and X Display Company announced today that the companies entered into agreements, including Development and License Agreement and Services Agreement wherein Lextar has licensed XDC’s Intellectual Property, and both Lextar’s and XDC’s customers will be supplied Lextar’s high-performance MicroLEDs |
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Nuvoton Technology Introduces Arm Cortex-M23 Based NuMicro M251/M252 Series MCU (2020.10.05)
HSINCHU, Taiwan - Nuvoton Technology launches a new low power, industrial grade NuMicro M251/M252 Series designed for industrial control applications. It is based on Arm Cortex-M23 secure core for Armv8-M architecture, running up to 48 MHz with up to 256 KB Flash and 32 KB SRAM |
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HOLTEK New HT66F2030 Small Package MCU (2020.10.05)
Holtek announced the release of a new addition to its small package Flash type range, the HT66F2030. The device features a wide operating voltage range of 1.8V~5.5V, a fast power on function, integrated high accuracy oscillators, an accurate A/D reference voltage and is supplied in a small outline QFN package |
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Renesas Selects Andes RISC-V 32-Bit CPU Cores for its First RISC-V Implementation of ASSPs (2020.10.05)
Renesas Electronics announced a technology IP cooperation with Andes Technology, an advanced supplier of RISC-V based embedded CPU cores and associated SoC development environment. Renesas selected the AndesCore IP 32-bit RISC-V CPU cores to embed into its new application-specific standard products that will begin customer sampling in the second half of 2021 |
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Epson Taiwan Partners with Local Organizations to Create Smart Glasses AR Ecosystem (2020.10.05)
TAIPEI, Taiwan - Epson Taiwan Technology and Trading (“Epson Taiwan”) has today begun selling smart glasses optical engine modules worldwide for the first time, offering a world-class AR ecosystem to global consumers and providing a more complete way of working remotely during COVID-19 |
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Acer’s ConceptD Line for Creators Earns Good Design Awards (2020.10.05)
TAIPEI, Taiwan - Acer’s ConceptD line of products for creators has won two 2020 Good Design Awards, shared amongst three products: the ConceptD 3 Ezel and ConceptD 7 Ezel notebooks, and the ConceptD 700 desktop.
“Winning this award comes down to being able to understand and accommodate the needs of your audience,” said Seji Peng, AVP of Industrial Design, Acer |
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Mitsubishi Electric’s Net Zero Energy Building Test Facility to Be Completed on Oct. 14 (2020.10.02)
Mitsubishi Electric announced today that construction of its SUSTIE net zero-energy building (ZEB) test facility located on the premises of the company’s Information Technology R&D Center in Kamakura, Japan, will be completed on October 14 |
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Renesas I3C Bus Extension and SPD Hub Devices Qualified for ASPEED AST2600 Baseboard Controller (2020.10.02)
Renesas Electronics announced that ASPEED Technology has qualified the Renesas I3C IMX3102 2:1 bus multiplexer, IMX3112 1:2 bus expander, and DDR5 SPD Hub SPD5118 for its cutting-edge AST2600 Baseboard Management Controller (BMC) designed for use in data centers and embedded platforms and applications |
USB2.0 is a Universal Serial Bus standard PC and peripheral equipment is widely used to get rid of the application areas limited to the PC in the past, and more in-depth applications in the digital consumer electronics products which.