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CTIMES / Electronic Science and Technology
Science and Technology
Allusion
─ ─ On the course of development of the chipset to

The highly integrated chipset, but only in recent years happened, if the CPU is the brain of the computer, Chipsets can be regarded as the heart of the computer.
Realtek Second Generation 2.5GbE Provides an Advanced Ethernet Solution for Modern Demands (2020.10.02)
HSINCHU, Taiwan - As people around the world make the shift to a longer-term remote work environment caused by the coronavirus pandemic, the demand for more Ethernet bandwidth to meet the needs of companies and their employees is rising
Toshiba Launches Ultra-Low Current Consumption CMOS Operational Amplifier (2020.09.29)
Toshiba has added “TC75S102F,” a new CMOS operational amplifier featuring industry-leading ultra-low current consumption to its lineup. Shipments start today. Operational amplifiers boost weak signals from sensor, and to support longer use between charges of battery-operated equipment, including IoT edge devices and mobile devices, they must also deliver lower current consumption
BOXER-8222AI: The Power of AI at the Edge (2020.09.29)
AAEON announces the BOXER-8222AI compact system powered by NVIDIA Jetson Nano. Featuring a PoE PD LAN port, the BOXER-8222AI can be powered by a PSE Gateway allowing for deployment without requiring a dedicated power supply. The BOXER-8222AI is the latest platform in AAEON’s family of compact rugged AI systems powered by the innovative and energy efficient NVIDIA Jetson Nano SoC
Samsung to Galvanize Growth of Mini LED Backlight TV Market, Says TrendForce (2020.09.28)
Yearly Mini LED backlight TV shipment is projected to reach 4.4 million units for 2021, a 2% penetration rate in the overall TV market, as brands begin integrating Mini LED backlights into their TVs and continue to improve technologies as well as optimize costs, according to TrendForce’s latest investigations
TIE Showcases Taiwan's Smart Value and R&D Capacities of Government Agencies (2020.09.28)
TAIPEI, Taiwan - The 2020 Taiwan Innotech Expo's (TIE’s) Innovation Pilot Pavilion, organized by the Industrial Development Bureau (IDB), MOEA, opened yesterday (September 24) at the Taipei World Trade Center Exhibition Hall 1
STMicroelectronics Accelerates Space Applications with 150MHz+ High-Speed Rad-Hard Logic (2020.09.28)
STMicroelectronics has introduced the first two logic devices in a new high-speed, radiation-hardened family that brings 150MHz+ performance to space applications. The QML-V qualified RHFOSC04 (SMD 5962F20207) integrated oscillator driver/divider and RHFAHC00 (SMD 5962F18202) quad NAND gate have more than twice the gate speed of typical rad-hard logic ICs to ensure faster response in high-frequency circuits
Long Feng and Cub Supply Innovative Auto Parts to the World (2020.09.23)
TAIPEI, Taiwan - Due to intelligence and network trends in recent years, the global automotive industry has been fervently investing in the development of driver assistance systems. According to survey results from JD Power, an authority on auto ratings in the U
COM Express Module Supports PCIe Gen4 and AI Optimization (2020.09.23)
ADLINK Technology launches its next generation COM Express Type 6 module, the cExpress-TL, based on the 11th Gen Intel Core i7/i5/i3 and Celeron processor (formerly Tiger Lake UP3). Featuring a brand new high performance graphics core called Intel Iris Xe and supporting AVX-512 VNNI (Vector Neural Network Instructions), the cExpress-TL provides AI inferencing performance nearly 3X that previously available from non-VNNI platforms
World’s First USB PD E-Marker Transmission Control IC, Certified by USB-IF for USB4 and Intel (2020.09.22)
TAIPEI, Taiwan - eEver Technology, Inc. and Etron Technology, Inc. jointly announce that their new USB Type-C E-Marker controller IC, EJ903, has been certified by USB-IF for USB4 Cables and Intel for Thunderbolt 4 Cables. This positions eEver and Etron Tech as the world’s first supplier of USB-IF certified USB4 & Intel certified Thunderbolt 4 E-Marker ICs, advancing next-generation, top-performing electrical cables to the market
Taiwan Launches a Business Speed-dating Platform for the AI Ecosystem (2020.09.22)
TAIPEI, Taiwan - The new AI Tech Business Matchmaking Platform wants international investors and people in tech to swipe right for Taiwanese AI companies. Driven by the “Taiwan AI Action Plan” initiative, this is the world’s first AI business matchmaking platform, offering unprecedented access into Taiwan’s burgeoning AI ecosystem, which is already home to the likes of Amazon, Google, IBM, and Microsoft
HUBER+SUHNER and Rosenberger Publish an Industry First Extensive RF Connector Plating Guide (2020.09.22)
White paper follows extensive performance testing – carried out with Rosenberger Hochfrequenztechnik – on five plating types under a 720 hrs salt spray corrosion test. HUBER+SUHNER and Rosenberger worked closely together to create this white paper
BOXER-6842: Powering the Next Generation of Edge AI (2020.09.22)
AAEON, an industry leader in embedded industrial computing, announces the BOXER-6842M, the latest solution in high performance industrial computing. Powered by the 8th and 9th Generation Intel Core processors and supporting graphics cards up to 250W for video capturing applications, the BOXER-6842M is designed for the most intensive applications from Edge AI server to automated optical inspection (AOI)
Mitsubishi Electric to Establish FA Products Service Center in Philippines (2020.09.17)
Mitsubishi Electric announced today that it will establish the Philippine FA Center in Manila on the premises of its local subsidiary, MELCO Factory Automation Philippines Inc. The new facility, which is scheduled to start operating on October 1, will strengthen servicing of Mitsubishi Electric factory automation (FA) products in the Philippines and thereby facilitate expansion of the company’s local business in FA systems
Panasonic and Octasic Extend sXGP Collaboration to 5G/Beyond 5G (2020.09.17)
Panasonic Corporation and Octasic Inc. today announced the enhancement of their ongoing collaboration to develop shared eXtended Global Platform (sXGP) solutions to include 5G and Beyond 5G based wireless network products, especially for mission-critical applications
Nvidia’s $40 Billion ARM Purchase Will Test Current M&A “Ceiling” (2020.09.17)
After nearly two months of negotiations and press reports that a blockbuster deal was in the works, Nvidia this week announced a $40 billion agreement to buy ARM—the leading supplier of processor intellectual property (IP)—from financially struggling SoftBank in Japan
Enterprise storage market in APAC to reach US$55.6bn in 2024 (2020.09.16)
The COVID-19 pandemic has affected most of the industries in the Asia-Pacific (APAC) region, with the storage market being no exception. The overall APAC storage market revenue is now expected to grow at a compound annual growth rate (CAGR) of 5
Alibaba Unveils New Manufacturing Digital Factory (2020.09.16)
Alibaba Group Holding Limited today revealed its New Manufacturing model for the first time with the unveiling of Xunxi Digital Factory (“Xunxi”). Powered by Alibaba’s cloud computing infrastructure and IoT, the Hangzhou-based factory offers SMEs a digitalized end-to-end manufacturing supply chain that allows for fully-customized, demand-driven production
Samsung Display Unveils Foldable OLED Panel with World’s Smallest Curvature (2020.09.16)
Samsung Display announced today that it is the first in the industry to successfully commercialize a foldable display panel having a 1.4R rating for its curvature, representing the smallest degree of curving among commercialized foldable smartphones to date ― an advancement first applied to the recently-released Galaxy Z Fold2 5G
Samsung Expands Advanced 0.7μm-Pixel ISOCELL Image Sensor (2020.09.15)
Samsung Electronics today introduced four new Samsung ISOCELL image sensors for its 0.7 micrometer (μm)-pixel product lineup; 108-megapixel (Mp) ISOCELL HM2, 64Mp ISOCELL GW3, 48Mp ISOCELL GM5 and 32Mp ISOCELL JD1. With the new 0
Mitsubishi Electric to Launch Second-generation Full-SiC Power Modules for Industrial Use (2020.09.15)
Mitsubishi Electric Corporation announced today its coming launch of second-generation full-SiC (silicon carbide) power modules featuring a newly developed SiC chip for industrial use. The low power loss characteristics and high carrier frequency operation of the SiC-MOSFET (metal oxide semiconductor field-effect transistor) and SiC-SBD (schottky barrier diode) chips in the modules are expected to facilitate the development of more efficient

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