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2020 AI NOW Examines AI in the Contactless Economy with ASUS and More (2020.09.14)
TAIPEI, Taiwan - Researchers at McKinsey predict that AI will boost global economic activity by $13 trillion over the next decade. As economies begin reopening to the post-pandemic world, AI industry growth is being accelerated by social distancing in the contactless economy |
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HOLTEK New HT66F4560 MCU with 4-level Adjustable Bandwidth OPA (2020.09.14)
Holtek announced the release of its new A/D with OPA Flash MCU, the HT66F4560. One of the chief features of this device is its 4-level adjustable bandwidth integrated operational amplifiers. This feature makes this device especially suitable for use in sensor related applications which have low power consumption requirements or which demand rapid response times, such as smoke detectors, PM2 |
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Toshiba Launches Photorelays in New Package for High-density Mounting (2020.09.14)
Toshiba has launched three photorelays, TLP3480, TLP3481 and TLP3482 in P-SON4, a new package with a significantly smaller mounting area than Toshiba’s SOP packages. Shipments start today.
All of the new photorelays have an OFF-state output terminal voltage rating and ON-state current rating comparable with products housed in SOP package products, with ratings ranging from 30V and 4 |
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Bureau Veritas Supports Moxa to Obtain the First IEC 62443-4-1 Certificate (2020.09.11)
Moxa Obtains IEC 62443-4-1 Certification
As the wave of Industry 4.0 sweeps the world, smart manufacturing has become the most crucial trend in various industries. In a smart system, the integration of IT and OT systems can comprehensively enhance the value of OT system's information in the application field, thereby creating a different operating model |
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Notebook Computer Shipment Expected to Soar Past 180 Million Units in 2020 (2020.09.10)
Demand for notebook computers (NBs) across the globe experienced an explosive growth in 2Q20 due to increased WFH and distance education demand generated by the COVID-19 pandemic, according to TrendForce’s latest investigations |
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Renesas Introduces DDR5 Data Buffer for High-Performance Server and Cloud Service Applications (2020.09.10)
Renesas Electronics announced a new high-speed, low-power DDR5 data buffer for data center, server, and high-performance workstation applications.
Advancements over the past few years in real-time analytics, machine learning, HPC, AI, and other memory and bandwidth-hungry applications have fueled explosive growth in server memory bandwidth requirements |
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EVs Pushing Battery Prices Down and ESS to Next Phase of Energy Transition, reveals GlobalData (2020.09.10)
Energy storage systems (ESS) installations linked to the electricity grid and ancillary services will witness rapid growth in the coming two to three years because of their increasing number of applications and the falling cost of systems due to electric vehicle (EV) development |
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Inkron Invests in Augmented Reality Components Development Infrastructure (2020.09.09)
Inkron, a Nagase Group Company, the global leader of siloxane-based, optically clear Nano-Imprint Lithography (NIL) materials, makes a strategic investment in NIL materials and components development infrastructure. The investment will significantly accelerate Inkron’s development of high-performance optical materials needed in critical components of augmented reality (AR) glasses, 3D sensors and other diffractive optical elements (DOE) |
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Global Fitness Apps' Revenue to Grow by 50% with Users Hitting 1 Billion by 2024 (2020.09.09)
Data presented by Stock Apps indicates that the global fitness apps revenue will grow by approximately 48.44%. The growth will be registered between 2020 and 2024.
In 2020, the revenue is expected to stand at $3.55 billion while in 2024, the figure will be $5 |
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Taiwan Innotech Expo (TIE) Showcases Strong Ecosystems in the Post-Pandemic World (2020.09.09)
TAIPEI, Taiwan - Over 1,000 innovative technologies will lead Taiwan into a smart future! The annual Taiwan Innotech Expo, which brings together industry, government and academia, will be launched at Taipei World Trade Center Hall 1 on September 24, 2020 |
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SnapEDA Launches New KiCad Plugin to Help Engineers Design Electronics Faster (2020.09.09)
SnapEDA is launching a new KiCad plugin, allowing designers to search and download its computer-aided design (CAD) models directly within the KiCad PCB design environment.
KiCad is a free and open-source software that has been gaining popularity in the PCB design industry |
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Covestro Invited to Taiwan Sustainable Supply Chain Forum: Building Circular Ecosystems (2020.09.09)
TAIPEI, Taiwan - The development of a circular economy is one of Taiwan’s stated national goals. In order to continue promoting the spirit of a circular economy, the Industrial Development Bureau of the Ministry of Economic Affairs (MOEA) held “Link and Loop: Sustainable Supply Chain Forum” |
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Credo Announces the DOVE Platform, 2th Gen of Low Power PAM4 DSPs for 100G/200G/400G Data Networks (2020.09.08)
Credo today announced the DOVE Platform, the second generation, low power PAM4 DSP family for high-speed data networks. The DOVE Platform includes products for 100/200/400G optical interconnects.
“100/200/400G is already |
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Cincoze Embedded System Helps New Development of Smart Vehicle (2020.09.08)
TAIPEI, Taiwan - Cincoze has developed the industry-leading Diamond Series line of embedded systems for these exact applications. The Diamond Series is customizable and quick to configure, meeting the strict requirements of the smart vehicle industry, pursuing stability and quality under urgent time constraints |
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Bluetooth Modules from u-blox Prove Instrumental in COVID-19 Track and Trace Wearable Devices (2020.09.07)
u-blox has confirmed that its Bluetooth 5 modules are being built into wearable devices that are helping to combat the global COVID-19 pandemic. Available as either a wristband or a pendant, the TDS 50 has been developed by Electronic Precepts to present a highly-effective track and trace solution, with data being directly stored on the device then periodically sent to a web server |
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Remote Testing Is the Key in Testing New Network Equipment, Says HUBER+SUHNER (2020.09.07)
The ongoing Covid-19 pandemic has shown how important it is for companies to operate remotely. In fact, it’s the difference between completing a task or facing extensive delays for businesses relying on new, certified equipment for day-to-day activities, Chris O’Conor, Regional VP, Service Provider Sales at HUBER+SUHNER Polatis said today |
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Acer Announces New Spin 7 Powered by the Qualcomm 5G Platform (2020.09.04)
TAIPEI, Taiwan - Acer announced its new Spin 7 convertible notebook that offers a bold new take on productivity, with blazing-fast 5G connectivity supporting both mmWave and sub-6 GHz frequencies. Powered by the Snapdragon 8cx Gen 2 5G compute platform |
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TSMC Continues to Reap the Benefits of Strong Demand for 7nm and 5nm Devices, Says IC Insights (2020.09.04)
As expected, most IC suppliers experienced weaker demand and generally poor sales results in the first half of this year due to the Covid-19 pandemic and strained U.S./China trade relations. However, as reported in IC Insights’ August Update to the 2020 McClean Report, some key IC suppliers believe that the second half of this year will yield better results |
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Fingerprint Cards Launches Next-gen T-Shape for Contactless Biometric Payment Cards (2020.09.04)
Fingerprint Cards AB has launched the second generation of its T-Shape sensor and software platform for contactless biometric payment cards. The new product solution, part of the FPC1300-series, delivers increased image quality and transaction speed as well as improved power efficiency by combining extensive R&D investment with key learnings from more than 20 market pilots and commercial rollouts |
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STMicroelectronics Reveals Fast-Starting Intelligent Power Switches for Demanding Safety Application (2020.09.04)
STMicroelectronics has added new fast-starting devices to its family of intelligent power switches for safety-instrumented systems. With power-on delay time of less than 60µs, the IPS160HF and IPS161HF satisfy standardized requirements for interface types C and D in Safety Integrity Level (SIL) Class 3 applications |
