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u-blox, ORBCOMM Partner for Integrated Terrestrial and Satellite IoT Solutions (2023.09.04)
u-blox and ORBCOMM have announced today their partnership to start developing solutions for the convergence of terrestrial and satellite IoT communications markets.
The cellular and satellite IoT communications markets have grown substantially and will continue to do so for years to come |
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VIAVI First to Introduce RedCap Device Emulation, Boosting 5G IoT Commercialization (2023.08.03)
Viavi Solutions Inc. launched the industry’s first Reduced Capability (RedCap) device emulation for 5G network testing, enabling true performance validation for Internet of Things (IoT) and private networks based on a new class of simpler, lower-cost devices including wearables, industrial wireless sensors and video surveillance |
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PCI-SIG Exploring an Optical Interconnect to Enable Higher PCIe Technology Performance (2023.08.03)
PCI-SIG today announced the formation of a new workgroup to deliver PCI Express (PCIe) technology over optical connections. The PCI-SIG Optical Workgroup intends to be optical technology-agnostic, supporting a wide range of optical technologies, while potentially developing technology-specific form factors |
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Airoha Technology Eyes on Broadband, Automotive and LEO Satellite Markets (2023.08.01)
TAIPEI, Taiwan - During the last 20 years, Airoha Technology, a Taiwanese fabless IC design house, MediaTek’s subsidiary has engaged in networking IC technologies development including the xDSL copper wire, GPON, xG-PON, and optical fiber |
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HOLTEK New HT32F67233 Sub-1GHz GFSK Transceiver Arm Cortex -M0+ MCU (2023.07.27)
Holtek announces the release of its new wireless communication dedicated MCU, an Arm Cortex-M0+ core Sub-1GHz GFSK transceiver, the HT32F67233. The device operates in the 315/433/470/868/915MHz license-free ISM Bands and is suitable for wireless bidirectional transmission applications such as in smart homes, security products, industrial/agricultural automation, data acquisition and recording, etc |
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u-blox Introduces the Smallest LTE-M/NB-IoT Module with 23dBm RF Output Power (2023.07.27)
u-blox has announced the u-blox LEXI-R4, its newest module customized for size-constrained application requirements. Albeit compact (16 x 16 mm), the module supports all LTE-M and NB-IoT bands with an RF output power of 23dBm, also offering the possibility to operate on a 2G network |
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u-blox Announces Two New high-precision GNSS Positioning Modules Based on the F9 Platform (2023.07.10)
u-blox has announced two new modules based on the u-blox F9 high-precision GNSS platform. The low-power NEO-F9P supports precise navigation and automation of moving industrial machinery, and the ZED-F9P-15B provides customers in the mobile robotics market with an L1/L5 option in addition to the L1/L2 bands |
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u-blox’s Newest Module Stands Temperatures up to 105 °C for Advanced Automotive Applications (2023.05.03)
u-blox has announced the u- blox ZED-F9L, its newest module tailored for automotive applications. With its fully integrated dead reckoning technology, new generation six-axis IMU, multiple outputs, and robust automotive grade hardware (AEC-Q104), this module is ideal for innovative automotive designs that demand top-tier performance and seamless integration |
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Samsung and AMD Extend IP Licensing Agreement to Bring AMD Radeon Graphics to Mobile Platforms (2023.04.09)
Samsung Electronics announced they have signed a multi-year agreement extension to bring multiple generations of high-performance, ultra-low-power AMD Radeon graphics solutions to an expanded portfolio of Samsung Exynos SoCs. Through the licensing extension, Samsung will bring console-level graphics quality and optimized power consumption to more mobile devices, offering an incredibly immersive and long-lasting gaming experience |
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NEUCHIPS Delivers Industry Leading Results for MLPerf v3.0 DLRM Inference Benchmarking (2023.04.09)
TAIPEI, Taiwan - NEUCHIPS, the leader in AI ASIC platforms for deep learning recommendation, participated in MLPerf(TM) v3.0 with their RecAccel(TM) N3000 and demonstrated industry-leading performance and power efficiency. The RecAccel(TM) N3000 system delivered 1 |
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Imec’s Virtual Fab Underpins Strategies to Reduce the Carbon Footprint of Lithography and Etch (2023.03.29)
At the 2023 Advanced Lithography + Patterning Conference, imec presents a quantitative assessment of the environmental impact of patterning in advanced IC manufacturing. A virtual fab has been developed in the imec.netzero modeling platform |
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STM Reveals New Antenna-matching RF Integrated Passive Devices for STM32WL MCUs (2023.03.28)
STMicroelectronics has released nine RF integrated passive devices (RF IPDs) that combine antenna impedance-matching, balun, and harmonic-filter circuity optimized for STM32WL wireless microcontrollers (MCUs).
ST’s STM32WL MCUs combine application-level processing and wireless communication for smart, connected devices, by integrating an Arm® Cortex®-M4 MCU with a sub-GHz long-range radio managed by a Cortex-M0+ core |
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eMemory, UMC Expand LP-Memory Solutions with 22nm RRAM Qualification (2023.03.28)
HSINCHU, Taiwan - eMemory and United Microelectronics Corporation today announced that eMemory’s Resistive Random Access Memory (RRAM) IP has been qualified on UMC’s 22nm ultra-low power process, adding to UMC’s comprehensive embedded memory offering for AIoT and mobile applications |
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HOLTEK New BC66F2143 Sub-1GHz RF Transmitter MCU (2023.03.28)
Holtek announces the release of its new Sub-1GHz RF OOK/FSK Transmitter Flash MCU, the BC66F2143. This new device, which can operate in the license-free ISM bands, has RF characteristics which are compliant with the ETSI/FCC specifications |
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u-blox Announces Its First Tri-radio Stand-alone Module (2023.03.28)
u-blox has announced u blox IRIS-W1, the first compact stand-alone Wi-Fi module combining dual-band Wi-Fi 6, Bluetooth LE (Low Energy) 5.3, and Thread including support for Matter. IRIS-W1 comes in four variants, each enabling the user to select among various antennas and software environments |
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Survey: People Concerning Their Data Privacy in AI Applications (2023.02.16)
TAIPEI, Taiwan - Cisco recently released a global annual survey. The research indicated that enterprises continue to invest in privacy protection, and the average cost of Taiwanese companies is increased to 2.7 million $USD from 1 |
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Universal Robots is Optimistic about Taiwan's Cobot Market (2023.02.02)
TAIPEI, Taiwan -Universal Robots （UR）, a cobot solution provider, estimated that the cobot market of Taiwan will maintain strong growth in 2023, and high flexibility, high payload, all scenario, and customer co-create will become fundamental needs to industry development |
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Jun Seki Joins Foxconn’s EV Business as the Chief Strategy Officer (2023.02.01)
TAIIPEI, Taiwan - Hon Hai Technology Group (Foxconn) announced yesterday that Jun Seki has been pointed as the Chief Strategy Officer of its electric Vehicle group. He will directly report to Liu Yang-wei and the new assignment will be effective from February 1st |
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French Start-Up Siquance Targets Commercial Quantum Computing Using Si Technology (2022.12.08)
Siquance, a CEA/CNRS-inspired startup, was launched in Grenoble on the 29th of November, 2022. Co-founded and directed by Maud Vinet, Siquance aims to develop and commercialize a quantum computer built on advanced microelectronics technology |
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Edgecore Networks Introduces New High-Performance Aggregation Routers for 5G Network (2022.12.08)
HSINCHU, Taiwan - Edgecore Networks announces a new generation high-Performance 100G open aggregation router family – AGR400 series, to enable enterprises and service providers to deploy future-proof and cutting-edge solutions for Internet peering, 5G network, OpenBNG, and aggregation applications |
Overall, the number of times the Bus specification standard is rising between mainframe computers and peripherals, data transfer speed, capacity and quality of the application process. Let's Introduction to several important bus application specifications.