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Edgecore Networks Unveils ecCLOUD – Cloud Controller for Wired and Wireless Devices (2020.08.31)
HSINCHU, Taiwan - Edgecore Networks announced a major addition to its product family – ecCLOUD, a comprehensive cloud controller featuring an intuitive user interface. ecCLOUD offers a centralized platform for unified visibility and control over Edgecore wired and wireless devices, saving the cost and complexity of on-site management system installations |
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ST Eases Design of Advanced Energy-Saving Power Supplies with Eco-Certified 400W Evaluation Board (2020.08.31)
STMicroelectronics’ EVL400W-EUPL7 evaluation board delivers a ready-to-use 400-Watt power-supply solution that meets today’s toughest eco-design norms. The board leverages innovative features of ST’s L4984D current-mode PFC controller and L6699 resonant half-bridge controller to maximize energy efficiency in multiple operating modes |
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Broadcom Overtakes Qualcomm for First Place in 2Q20 Revenue Ranking (2020.08.31)
According to the revenue ranking of top ten IC design companies for 2Q20 compiled by TrendForce, Broadcom was able to capture number one position by surpassing Qualcomm in quarterly revenue. Despite strong demand for 5G products driven by WFH and distance education needs, Qualcomm’s upward momentum in 2Q20 was constrained due to the delayed release of Apple’s latest iPhones |
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Samsung Begins Mass Production of 16Gb LPDDR5 DRAM at World's Largest Semiconductor Line (2020.08.31)
Samsung Electronics today announced that its second production line in Pyeongtaek, Korea, has commenced mass production of the industry's first 16-gigabit (Gb) LPDDR5 mobile DRAM, using extreme ultraviolet (EUV) technology. Built on Samsung's third-generation 10nm-class (1z) process |
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Smartphone Production Registers Largest YoY Drop on Record with 16.7% Decline in 2Q20 (2020.08.25)
TAIPEI, Taiwan - According to TrendForce’s latest investigations, total smartphone production reached 286 million units in 2Q20, a slight QoQ rebound of 2.2%, but a 16.7% decrease YoY, which is the largest quarterly YoY drop in history |
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TSMC Announces Its N4 and 3DFabric Services at Online Technology Symposium (2020.08.25)
HSINCHU, Taiwan - TSMC is showcasing the latest developments in its advanced logic technology, specialty technologies, 3DIC system integration solutions, and comprehensive design enablement ecosystem at the Company’s first online Technology Symposium and Open Innovation Platform (OIP) Ecosystem Forum |
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HOLTEK New BM25S2021-1 Resistive Temperature and Humidity Digital Sensor (2020.08.25)
Holtek announced its new Temperature and Humidity Digital Sensor, the BM25S2021-1, a device which includes fully integrated humidity and temperature sensors.
After temperature and humidity calibration and temperature compensation is carried out, the module has the characteristics of high precision, low power consumption and ease of use, thus greatly reducing product development time |
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Over 50% of Taiwanese Netizens Order Food Delivery (2020.08.24)
TAIPEI, Taiwan - Amid the COVID-19 pandemic, 53.3% of Taiwanese netizens ordered food delivery in the first half of 2020, according to a survey conducted by MIC (Market Intelligence & Consulting Institute), a government think tank and IT research institute in Taiwan |
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TrendForce Analyzes Impacts of Expanded U.S. Sanctions Against Huawei on Five Major Tech Industries (2020.08.24)
TAIPEI, Taiwan - On August 17, the U.S. Department of Commerce announced the latest revisions to its Entity List, which now includes 38 additional Huawei subsidiaries. Suppliers are prohibited from providing semiconductor products and components manufactured with U |
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Low-Profile Surface-Mount Schottky Diodes from STMicroelectronics Boost Power Density and Efficiency (2020.08.24)
STMicroelectronics has launched 26 new Schottky diodes in low-profile SMA and SMB Flat packages, covering voltage ratings from 25 to 200V and current ratings from 1 to 5A.
The 1.0mm-high devices have 50% lower profile than diodes in standard SMA and SMB packages, enabling designers to increase power density and save space |
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Smart Manufacturing Becomes Key to Enterprise Survival in Post-Pandemic Era (2020.08.18)
Integrating smart manufacturing remains the key to enterprise survival in the face of the COVID-19 pandemic, according to TrendForce’s latest investigations. In addition to furthering the technical development of AR, teleoperation |
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Mycropore Expands Customer Base with Orders from Two North American Memory IC and RF IC Manufacturer (2020.08.18)
HSINCHU, Taiwan - Mycropore announced the receipt of repeat purchase orders from two leading North America-based customers who manufacture Memory IC and RF IC devices that serve the fast growing 5G market. The potential annual revenue of these purchase orders is in hundreds of thousand US dollars |
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MediaTek Introduces Newest 5G SoC, Dimensity 800U for Ultra Connectivity and Advanced 5G Dual SIM (2020.08.18)
HSINCHU, Taiwan –MediaTek today announced its newest 5G SoC, the Dimensity 800U, as the latest addition in MediaTek’s Dimensity series family. The 7nm Dimensity 800U chipset is designed for multi-core high performance and leading 5G+5G Dual Sim Dual Standby (DSDS) technology |
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STMicroelectronics Boosts STM32Cube Ecosystem with New Features (2020.08.18)
STMicroelectronics has released enhancements to the STM32Cube software-development ecosystem, letting users more easily filter and choose software examples, gather and apply development tools, and customize, use, and share STM32Cube Expansion Packages |
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HOLTEK New TinyPowerTM 40V/250mA HT73Hxx Series Ultra Low Quiescent Current with Protection (2020.08.18)
Holtek announced the release of its new TinyPower ultra low quiescent current LDO series, the HT73Hxx. This new LDO series includes a high input voltage of 40V, ultra-low quiescent current of 2.5μA and a maximum output current value of 250mA |
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STMicroelectronics Enables Innovative Social-Distancing Applications with FlightSense ToF Sensors (2020.08.13)
TAIPEI, Taiwan – High-accuracy FlightSens proximity and ranging sensors from STMicroelectronics are helping prevent disease transmission in innovative products developed by customers in response to the global pandemic situation |
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Samsung Announces Availability of its Silicon-Proven 3D IC (2020.08.13)
Samsung Electronics today announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes. Leveraging Samsung's through-silicon via (TSV) technology |
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Miniaturized Highly Reliable PCIe M.2 BGA SSD for Ultra-small Industrial Applications (2020.08.10)
Swissbit launches EN-20, a new single chip solution which offers high speed PCIe SSD performance in a 3.2cm² BGA package. The device acts as a true industrial grade SSD with up to 480GB capacity and 4 lane PCIe 3.1 / NVMe 1.3 specification |
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AUO President Frank Ko Presents Online Keynote on “Display Innovations in the New Normal Economy” (2020.08.10)
HSINCHU, Taiwan – At the Display Week 2020 online exhibition, Dr. Frank Ko, AUO President and Chief Operating Officer, delivered an online keynote speech titled “Display Innovations in the New Normal Economy”. According to Ko, the COVID-19 pandemic has not only threatened people’s health but also exerted an adverse impact on areas such as work, consumption, living and industry |
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Acer Reports July Consolidated Revenues of NT$23.24B, Up 26.9% YoY (2020.08.10)
TAIPEI, Taiwan - Acer announced its consolidated revenues for July at NT$23.24 billion, up 26.9% year-on-year (YoY). For year-to-July, consolidated revenues were NT$137.70 billion, growing by 7.5% YoY. Work-from-home and online learning needs remain strong, and market demand is higher than supply |
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