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CTIMES / Electronic Science and Technology
Science and Technology
Allusion
About the Bus specifications

Overall, the number of times the Bus specification standard is rising between mainframe computers and peripherals, data transfer speed, capacity and quality of the application process. Let's Introduction to several important bus application specifications.
STMicroelectronics Boosts Performance While Enhancing Ecosystem on STM32 MPU (2020.03.17)
STMicroelectronics is expanding its STM32MP1 microprocessor (MPU) offering with the addition of new authorized partners, new software functionalities, and a significant performance bump by increasing the clock speed to 800MHz, maintaining software and pin-to-pin compatibility with the 650MHz devices
Faraday Delivers System-Level ESD Protection Service to Reduce ASIC Time-to-Market (2020.03.17)
HSINCHU, Taiwan - Faraday Technology today introduced its system-level ESD (electrostatic discharge) protection service. Faraday has successfully deployed this service in many ASIC projects, including factory automation applications, further shortening production lead times
Embedded Computing on the Frontlines of Pandemic Response and Prevention (2020.03.17)
AAEON is helping to power the pandemic response with the BOXER-6638U rugged embedded box PC. Featuring Intel Core i3 processors, the BOXER-6638U brings the power of industrial computing to mobile X-ray machines, used to perform chest X-ray scans of suspected COVID-19 patients
TSMC and NCTU Work on Wafer-scale One-atom-thick Insulating Layer Technology (2020.03.17)
TAIPEI, Taiwan - Under long-term support from the “Taiwan Consortium of Emergent Crystalline Materials” (TCECM) program of the Ministry of Science and Technology (MOST), Taiwan, a research team at National Chiao Tung University (NCTU) collaborated with Taiwan Semiconductor Manufacturing Company (TSMC) to form an industry-university joint research team, reporting a breakthrough in the synthesis of one-atom-thick boron nitride (BN)
Samsung Begins Mass Production of the Fastest Storage for Flagship Smartphones (2020.03.17)
Samsung Electronics today announced that it has begun mass producing the industry's first 512-gigabyte (GB) eUFS (embedded Universal Flash Storage) 3.1 for use in flagship smartphones. Delivering three times the write speed of the previous 512GB eUFS 3
Mitsubishi Electric Develops BLEnDer ICE Battery-powered Wireless Terminal (2020.03.16)
Mitsubishi Electricannounced today that it has developed the BLEnDer ICE battery-powered wireless communication terminal for use in sensor networks to collect gas and water meter data and remotely control sensors in the networks
Fully Integrated Wireless-Charging IC from STMicroelectronics (2020.03.16)
In the age of 5G communication with ever-increasing demand for more power and higher efficiency, STMicroelectronics’ STWLC68 product family provides the best solution for wireless-charging applications with industry-leading efficiency, highest power transfer, and safety
ICT Spending in Malaysia to Reach US$25.2bn 2023, Says GlobalData (2020.03.16)
The information and communication technology (ICT) market in Malaysia is set to grow at a compound annual growth rate (CAGR) of 8.9% between 2019 and 2023.This growth from 2018 US$16.5bn to US$25.2bn in 2023, will mainly be supported by the rising adoption of ‘client computing’ and ‘cloud computing’, says GlobalData, a leading data and analytics company
eMemory Launches Reprogrammable NVM Solution on TSMC Platform (2020.03.16)
HSINCHU, Taiwan – eMemory today announced that its NeoMTP has been qualified on TSMC’s Third-Generation 0.18μm Bipolar-CMOS-DMOS (BCD) process to provide IoT power-management solutions and cost competitiveness. eMemory’s NeoMTP is a popular choice for chip designers making products for power management in USB Type-C devices and wireless chargers
PIDA:醫療保健將成為XR的殺手級應用 (2020.03.12)
光電協進會(PIDA)指出,XR(VR、AR)、MR的通稱)正在興起。根據美國專家在西雅圖的一場研討會上所談論的焦點,醫療保健將會是推動XR的殺手級應用。由於醫療保健應用所針對的是高壓力的環境,在這種環境中,使用者必須在決策時處理大量數據,而且醫療保健也是一個觸及所有人的行業,一年的規模達3.5兆美元
Renesas Electronics Unveils Industry’s Highest Performance Wideband mmWave Synthesizer (2020.03.12)
Renesas Electronics Corporation introduced a next-generation wideband mmWave synthesizer with the industry’s highest performance and unique set of features optimized for 5G and broadband wireless applications. The flagship 8V97003 device is ideal as a local oscillator (LO) for mmWave and beamforming
Mitsubishi Electric Develops MEMS LiDAR Solution for Autonomous Vehicles (2020.03.12)
Mitsubishi Electric Corporation announced today that it has developed a compact light-detection and ranging (LiDAR) solution incorporating a micro-electromechanical system (MEMS) that achieves an extra-wide horizontal scanning angle to accurately detect the shapes and distances of objects ahead in autonomous driving systems
“Black Swan” Event Triggers Revision to 2020 IC Market Forecast (2020.03.12)
“Black Swan” is a commonly used phrase in the world of finance to describe an event that is unexpected and unknowable. The recent surge of the spread of the coronavirus (Covid-19) and its anticipated negative impact on the global economy and IC market definitely fits the definition of a Black Swan event
Rafael Microelectronics Launches Advanced RT18X Series for AOC Market (2020.03.12)
HSINCHU, Taiwan - Rafael Microelectronics announced availability of RT18X series for high-speed optical connectivity applications. This series of optoelectronic transmission chips conform to the industry's mainstream standards such as HDMI 2
Globalization Strategy, Edge Computing, and WISE-PaaS Leads Advantech's Long-Term Growth (2020.03.11)
TAIPEI, Taiwan - Advantech hosted its latest investor’s meeting today. In 2019, Advantech's earnings per share (EPS) reached NT$10.51, a record high in its history. In the near term, the production capability, component supply, and logistics have been affected by the COVID-19 outbreak
Infineon and pmd Collaborate With Qualcomm to Enable High-Quality 3D Authentication Solution (2020.03.11)
Infineon Technologies worked with Qualcomm Technologies, Inc. to develop a reference design for 3D authentication based on the Qualcomm Snapdragon 865 Mobile Platform. Infineon is thus extending its application portfolio of its 3D sensor technology for mobile devices
Visualization of Drosophila’s Mind: Taiwan Develops Novel Optical Microscopies (2020.03.11)
Brain, which governs our mind and behaviors, is arguably the most important organ in our body, but is also the functionally least understood one. Although the function of a single neuron or interaction of a few neurons have been well studied, the number of neurons ranges from hundred thousands in drosophila to billions in human brains, and the emerging properties from the massive connection among these neurons are unknown yet
Samsung Electronics Unveils Its First Family of 'Human-centric' LED Components (2020.03.11)
Samsung Electronics today unveiled its first "human-centric" LED packages, collectively known as LM302N. Engineered with carefully created light spectra, the LM302N family helps human bodies adjust melatonin levels indoors, making people feel more energetic or relaxed depending on their daily life patterns
Traditional PC Market in the Asia/Pacific Region Grew by 3.8% in 2019 (2020.03.10)
According to the latest IDC Quarterly Personal Computing Devices Tracker 2019Q4, the Traditional PC market (Desktops, Notebooks, Workstations) grew by 3.8% – total of 103.3M units – in Asia/Pacific (including Japan) in 2019
Ying-Chih Yang Joins SiPearl as CTO (2020.03.10)
SiPearl, the company that is bringing to life the European Processor Initiative (EPI) consortium’s project by designing the microprocessor for the European exascale supercomputer, is announcing that it has appointed Ying-Chih Yang as Chief Technical Officer

  Top Ten News
1 PICMG COM-HPC 1.2 Mini Brings PCIe 5.0, USB4 & 10 GbE to Far Edge
2 u-blox Introduces the Smallest Single-mode LTE Cat 1bis IoT Module
3 mechatronic systemtechnik GmbH Unveils Its New Technology Center in Fürnitz
4 u-blox Positioning Solutions Available on NVIDIA Jetson Edge AI and DRIVE Hyperion platforms
5 Grundfos and YCM Partner to Accelerate Smart and Energy-Efficient Machine Tool
6 NSTC Minister Meets with Czech Republic Minister of Science, Re-search and Innovation
7 ITRI to Cultivate Green Talents and Bridge Taiwan's Power Gap

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