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BrainChip and Socionext Provide a New Low-Power Artificial Intelligence Platform for AI Edge Applica (2020.03.24)
BrainChip Holdings today announced that Socionext Inc will offer customers an Artificial Intelligence Platform that includes the Akida SoC, an ultra-low power high performance AI technology.
BrainChip has developed an advanced neural networking processor that brings artificial intelligence to the edge in a way that existing technologies are not capable |
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Faraday’s 28Gbps SerDes IP Now Available on UMC’s 28HPC Process (2020.03.24)
HSINCHU, Taiwan - United Microelectronics Corporation and Faraday Technology today announced that Faraday’s 28Gbps programmable SerDes PHY is now available on UMC’s 28HPC process technology. UMC’s 28HPC process stands out as an easy-to-adopt platform to realize high-speed interface designs; thus this 28nm 28G SerDes can significantly shorten chip design cycle times to more readily enable the infrastructure for 100G Ethernet, PCIe 4 |
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ST Reveals STM32CubeMonitor Runtime Variable Monitoring and Visualization Tool (2020.03.24)
The new STM32CubeMonitor software tool from STMicroelectronics displays runtime variables of STM32 applications in real time while enabling developers to customize the graphical visualization in their OS environment of choice (Windows, Linux, or MacOS) |
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Samsung Introduces Industry’s First All-in-One Power ICs Optimized for Wireless Earbuds (2020.03.24)
Samsung Electronics today announced the industry’s first all-in-one power management integrated circuits (PMIC), MUA01 and MUB01, optimized for today’s True Wireless Stereo (TWS) devices.
Unlike wireless headphones, TWS earbuds have no wire that connect the two earpieces |
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Synopsys Delivers Industry's First Ethernet 800G Verification IP (2020.03.24)
Synopsys announced the availability of the industry's first verification IP (VIP) and Universal Verification Methodology (UVM) source code test suite for Ethernet 800G.
As the requirements for increased bandwidth to support video-on-demand |
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STMicroelectronics Joins Zigbee Alliance Member Group China as A Council Member (2020.03.24)
Extending its efforts with the Zigbee Alliance, STMicroelectronics has joined the Zigbee Alliance Member Group China (ZMGC) as a council member. ZMGC focuses on accelerating market adoption of Zigbee in China, simplifying development for manufacturers and increasing device compatibility for consumers |
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Propelled by 51% Share of IDM Sales and 65% Share of Fabless Sales, U.S. Companies Captured 55% (2020.03.22)
Regional marketshares of IDMs (companies operating wafer fabs), fabless companies, and total IC sales were led by U.S. headquartered companies in 2019, according to data presented in the recently released March Update to The McClean Report 2020 |
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Foundry Revenue Estimated to Grow by 30% YoY in 1Q20, while COVID-19 May Hinder Future Demand (2020.03.19)
The latest investigations by TrendForce show that the foundry industry benefitted from the previous quarter’s order fulfillment and client stock-up demands, with overall projected revenue undergoing a slight 2% dip QoQ but about 30% growth YoY in 1Q20 due to the comparatively lower 1Q19 base period |
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X-FAB Further Expands Its SiC Capacity and Adds New In-House Epitaxy Capabilities (2020.03.19)
X-FAB Silicon Foundries SE continues to drive the adoption of silicon-carbide (SiC) technology forward by offering SiC foundry services at the scale of silicon. The company has confirmed that it is the first pure-play foundry to add internal SiC epitaxy capabilities to its offering |
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Internet Infrastructure Demand Rises during COVID-19 Pandemic by 30 Percent (2020.03.19)
Internet infrastructure has experienced significant growth in demand due to the increased amount of people confined to their homes, consequently working and shopping remotely due to the enforced precautionary measures.
Having most of our daily activities migrating to the digital space, internet infrastructure is being strained by the sheer amount of users |
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NTT DOCOMO to Launch 5G Service in Japan on March 25 (2020.03.18)
NTT DOCOMO, INC. announced today that it will launch its much anticipated fifth-generation mobile communications service (5G) on a commercial basis in Japan on March 25. At the time of launch, the service will achieve a maximum data rate of 3 |
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Avalue Introduces EMX-WHLGP Onboard Processor Thin MINI ITX Motherboard (2020.03.18)
Avalue Technology is unveiling EMX-WHLGP, based on Whiskey Lake U Intel Core and Celeron Processors.
The 8th Gen Intel Whiskey Lake U Core SoC i7/i5/i3 & Celeron BGA onboard processor, leverage the power efficiency of 14nm microarchitecture to deliver double-digit performance compare to the KabyLake Refresh, offers a future-proof platform for intelligent solution development and higher turbo clocks |
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SYSGO and CoreAVI Collaborate to Support Cortex-A72-based CPU for Safety-Critical Systems (2020.03.18)
Core Avionics & Industrial Inc. ("CoreAVI") and SYSGO announced today their collaboration to support ARM's Cortex-A72-based CPU for next gen safety-critical graphics and compute applications. CoreAVI and SYSGO will work together to ensure the interoperability of CoreAVI's new COTS-D 3U VPX NXP LX2160-based SBC0003 Single Board Computer hardware design IP with SYSGO's safety-critical PikeOS RTOS |
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Chailease Leads the Pack in 2019 Rankings of Taiwanese EPC Suppliers, Says TrendForce (2020.03.18)
According to the latest edition of the 2020 Solar Powering Taiwan: Special Report, published by the EnergyTrend research division of TrendForce, the Taiwanese PV market reached newly installed capacity of 1,411MW in 2019, which was 94% of the way to meeting its 1 |
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STMicroelectronics Boosts Performance While Enhancing Ecosystem on STM32 MPU (2020.03.17)
STMicroelectronics is expanding its STM32MP1 microprocessor (MPU) offering with the addition of new authorized partners, new software functionalities, and a significant performance bump by increasing the clock speed to 800MHz, maintaining software and pin-to-pin compatibility with the 650MHz devices |
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Faraday Delivers System-Level ESD Protection Service to Reduce ASIC Time-to-Market (2020.03.17)
HSINCHU, Taiwan - Faraday Technology today introduced its system-level ESD (electrostatic discharge) protection service. Faraday has successfully deployed this service in many ASIC projects, including factory automation applications, further shortening production lead times |
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Embedded Computing on the Frontlines of Pandemic Response and Prevention (2020.03.17)
AAEON is helping to power the pandemic response with the BOXER-6638U rugged embedded box PC. Featuring Intel Core i3 processors, the BOXER-6638U brings the power of industrial computing to mobile X-ray machines, used to perform chest X-ray scans of suspected COVID-19 patients |
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TSMC and NCTU Work on Wafer-scale One-atom-thick Insulating Layer Technology (2020.03.17)
TAIPEI, Taiwan - Under long-term support from the “Taiwan Consortium of Emergent Crystalline Materials” (TCECM) program of the Ministry of Science and Technology (MOST), Taiwan, a research team at National Chiao Tung University (NCTU) collaborated with Taiwan Semiconductor Manufacturing Company (TSMC) to form an industry-university joint research team, reporting a breakthrough in the synthesis of one-atom-thick boron nitride (BN) |
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Samsung Begins Mass Production of the Fastest Storage for Flagship Smartphones (2020.03.17)
Samsung Electronics today announced that it has begun mass producing the industry's first 512-gigabyte (GB) eUFS (embedded Universal Flash Storage) 3.1 for use in flagship smartphones. Delivering three times the write speed of the previous 512GB eUFS 3 |
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ICT Spending in Malaysia to Reach US$25.2b in 2023, Says GlobalData (2020.03.16)
The information and communication technology (ICT) market in Malaysia is set to grow at a compound annual growth rate (CAGR) of 8.9% between 2019 and 2023.This growth from 2018 US$16.5bn to US$25.2bn in 2023, will mainly be supported by the rising adoption of ‘client computing’ and ‘cloud computing’, says GlobalData, a leading data and analytics company |
