|
Sensor Shipments Strengthened By Wearables and IoT; But Prices Falling (2015.04.09) According to IC Insights’ new report, sensor shipments are getting a big boost from the spread of embedded measurement functions for automated intelligent controls in systems and new high-volume applications—such as wearable electronics and the huge potential of the Internet of Things (IoT)—but sales growth is being pulled down significantly by price erosion in this once high-flying semiconductor marketplace |
|
XYZprinting Launches Entry-level 3D Printer Aims at Education Market (2015.04.08) TAIPEI, Taiwan — XYZprinting, a 3D printers manufacturer, which is backed by world’s leading electronic manufacturing conglomerate Kinpo Group, has launched the entry-level da Vinci Jr. 1.0 3D printer that aims at penetrating the education market |
|
Simon Shen: China Market About to be as Important as the U.S. (2015.04.08) TAIPEI, Taiwan — Simon Shen, CEO of XYZprinting, has shown up as an important representative and guest from the 3D printing industry at the Boao Forum for Asia (BFA). He suggested that the 3D printing market is a bullish trend, which is exactly the opposite of the PC market |
|
Rockchip Works Closely with Intel on Atom X3 Based Mobile Devices (2015.04.08) At the Intel Developer Forum(IDF), Shenzhen, China, Rockchip CEO Min Li joined Intel CEO Brian Krzanich on stage, said that multiple original design manufacturers (ODMs) are designing products based on the Intel Atom x3-C3230RK quad-core processor reference design from Rockchip, with devices expected to be in market later this quarter |
|
Intel Announces New Investments and Collaborations in China (2015.04.08) Intel CEO Brian Krzanich, at IDF Shenzhen, China, announced additional investments and collaborations that promise to deliver value across a range of industries for the smart, connected world for years to come.
Krzanich, along with additional keynote speakers Ian Yang |
|
75% of Cars Will Be Connected by 2020 (2015.04.08) According to Topology, a division of TrendForce, autonomous vehicles will enter mass production by 2020 as more and more major auto makers in recent years have committed to their R&D. Furthermore, the scale of the market will likely surpass a million vehicle mark by 2035 |
|
UMC’s 8-inch Fabs to At Full Capacity; Pushing 12-inch Fab Creation (2015.04.08) TAIPEI, Taiwan - According to Taiwan media reported, the production capacity of UMC's 8-inch fab have been fulfilled this year, which caused a serious shortage of supply of 8-inch IC foundry, and some IC design companies have started to seize the limited output |
|
Shipments of NB Touch Panels Climbed 6.2% in Q4 2014, But Value Fell (2015.04.08) According to IHS, in the fourth quarter of 2014, shipments of touch panels for notebook PCs climbed 6.2% on quarter and 9.4% on year to 5.6 million units. In terms of area, the total shipments increased 7.0% quarter on quarter and 15 |
|
Worldwide Semiconductor Revenue Grew 7.9 % in 2014; Micron Biggest Increases (2015.04.07) According to final results by Gartner, worldwide semiconductor revenue totaled $340.3 billion in 2014, a 7.9 percent increase from 2013 revenue of $315.4 billion. The top 25 semiconductor vendors' combined revenue increased 11 |
|
RTG4 Radiation-tolerant FPGAs For High-speed Signal (2015.04.07) Microsemi Corporation announced availability of its RTG4 high-speed signal processing radiation-tolerant FPGA family. The RTG4's reprogrammable flash technology offers complete immunity to radiation-induced configuration upsets in the harshest radiation environments, requiring no configuration scrubbing, unlike SRAM FPGA technology |
|
Acer and ASUS Eye on Smart Home (2015.04.07) TAIPEI, Taiwan — The Smart Home industry has really been heating up lately. Two Taiwanese brands Acer and ASUS eye on Smart Home market and rolled out related products.
ASUS has announced the Asus Smart Home System, comprising a range of shiny blue-black and chrome devices with a curved edge design |
|
Samsung Reportedly Take Over TSMC to Supply Next iPhone’s A9 Chip (2015.04.07) TAIPEI, Taiwan — Samsung will replace Taiwan Semiconductor Manufacturing Company (TSMC) in manufacturing of Apple’s future A9 chip, expected to be launched alongside new iPhone models later this year. Both companies withheld comment on it, allegedly |
|
ASUS, AT&T and Intel Unveil ASUS MeMO Pad 7 LTE (2015.04.07) ASUS, AT&T and Intel introduced the ASUS MeMO Pad 7 LTE, an affordable Android tablet with 7-inch Full HD IPS+ display powered by a quad-core Intel Atom processor and paired with the LTE Advanced Intel XMMTM 7260 modem.
The ASUS MeMO Pad 7 LTE provides extensive battery life and enables users to quickly and seamlessly access apps, browse the Internet and enjoy quality entertainment and gaming |
|
Industry's First Cable Driver to Support SDI- and IP-Based 4K Video (2015.04.06) Texas Instruments (TI) introduced the industry's first cable driver to support uncompressed 4K ultra high definition (UHD) video transmission using serial digital interface (SDI) and 10 gigabit Ethernet (GbE) protocols. The LMH1218 gives engineers the flexibility to design video infrastructure equipment for SDI or Internet protocol (IP) formats with a single component |
|
ASE to Expand Production Capacity for The Rasing Demands of Wearables (2015.04.06) TAIPEI, Taiwan - According to Taiwan media reported, Advanced Semiconductor Engineering Inc. (ASE) decided to expand its System in Package (SiP) production capacity of Kaohsiung and Chungli plants to cope with the rapid growth needs of wearable devices |
|
IBM and China Telecom Partner to Accelerate Mobile Enterprise Adoption in China (2015.04.06) China Telecom and IBM announced a partnership to accelerate mobile enterprise adoption for Chinese organizations. Joint clients will benefit from the IBM MobileFirst Platform for iOS to build, integrate and secure made-for-business enterprise apps which will be hosted on China Telecom’s cloud |
|
HOLTEK HT82V48 High-speed Duplex CIS Analog Signal Processor (2015.04.06) Aimed firmly at the duplex scanning application area, Holtek is pleased to announce the release of its special integrated high-speed CIS analog signal processor device, the HT82V48. Also known as an Analog Front-End or AFE, this new device is especially suitable for applications which require Currency Serial Number Reading, such as Currency Counters & Detectors, Currency Sorters, ATMs etc |
|
Dual Synchronous Step-Down DC/DC Controller with Digital Power System Management (2015.04.06) Linear Technology Corporation announces the LTC3887, a dual output synchronous step-down DC/DC controller with I²C-based PMBus interface for digital power system management. The LTC3887 differs from the previously released LTC3880 with an enhanced feature set that includes a faster 70ms power-up time, higher output voltage capability and a fast ADC mode that provides an 8ms update rate for one parameter |
|
Acer CEO Joins Sean Maloney on the Inaugural “Heart Across America” Ride (2015.04.03) TAIPEI, Taiwan - Acer CEO Jason Chen joined Sean Maloney, former Intel executive, on the inaugural bicycle ride across America for stroke and heart disease awareness.
Heart Across America, initiated by Maloney, is a 5,000 mile bicycle ride from Palo Alto to New York to raise awareness and prevention of cardiovascular diseases, the world’s number one cause of death |
|
Alliance Memory Introduces New High-Speed CMOS DDR SDRAMs (2015.04.03) Alliance Memory introduced new high-speed CMOS double data rate synchronous DRAMs (DDR SDRAM) with densities of 256 Mb (AS4C32M8D1), 512 Mb (AS4C64M8D1), and 1 Gb (AS4C64M16D1) in the 60-ball 8-mm by 13-mm by 1.2 mm TFBGA package and the 66-pin TSOP II package with a 0 |