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The World’s First and Only Mini-ITX Sized X99 Motherboard (2015.03.26)
ASRock’s research and development team has worked out a way to defy logics, and have built an incredibly small mini-ITX form factor motherboard with Intel X99 chipset’s extremely huge performance. Hence the world’s first and only mini-ITX X99 chipset motherboard – ASRock X99E-ITX/ac is born!
Regardless of its tiny size, X99E-ITX/ac is built around an X99 chipset and an X Series OC Socket |
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Intel Unveils Next-Gen Industrial Solutions System Consolidation Series (2015.03.26)
Intel today announced the next generation of the Intel Industrial Solutions System Consolidation Series, offering OEMs, machine builders and system integrators an expanded set of software configurations to simplify the development of industrial solutions using 4th generation Intel Core vPro processor-based platforms |
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Hon Hai and SK C&C Signes A Global IT services collaboration Agreement (2015.03.26)
TAIPEI, Taiwan － Hon Hai / Foxconn Technology Group today announced the signing of a strategic cooperation agreement with the Korean company SK C&C, the two sides will jointly manage the joint venture company, to expand IT services in China |
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HTC to Feature Wireless Charging in The Next Flagship Model (2015.03.26)
TAIPEI, Taiwan — In response to its rival Samsung’s Galaxy S6 and S6 Edge have featured the wireless charging function, Taiwanese handset maker HTC forecast that soonest they will feature the same function in its next flagship model |
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HGST Helium-Filled HDDs Achieve Milestone in Field Reliability of 2.5 Million Hours (2015.03.26)
HGST, a Western Digital company announced it has achieved a new milestone in reliability as the only manufacturer with drives field-proven and rated for two and a half (2.5) million hours mean time between failure (MTBF).
With strong market acceptance from the largest cloud service providers |
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QuickLogic Adds New Smartphone and Wearable Algorithms to Its SenseMe Software Library (2015.03.26)
QuickLogic Corporation announced the addition of two new algorithms and an expanded algorithm to its rapidly growing SenseMe Sensor Algorithm Library. This library represents an exceptional set of algorithms designed to support QuickLogic's ArcticLink 3 S2 ultra-low power sensor hub silicon platform which enables rapid development of advanced transportation |
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Integrated IO-Link Temperature Sensor Lowers Cost and Power (2015.03.26)
Designers can save power, cost, and space with the MAXREFDES42# IO-Link temperature sensor reference design (RD) from Maxim Integrated Products, Inc.
The new MAXREFDES42# IO-Link resistance temperature detector (RTD) joins the company's portfolio of other IO-Link reference designs for industrial control and automation |
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SUNIX DevicePort Solution Supports Banking Application (2015.03.26)
SUNIX announces DevicePort (Advanced mode) that support banking industry applications. As the banking industry needs better service quality and enhances client's experience, there are more and more banks are exploring the future IT structure to speed up some complicated steps |
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Optoelectronics, Sensors, Actuators, and Discrete Semiconductors Increases 9% in 2014 (2015.03.26)
Following two lethargic years of low growth and some setbacks, worldwide sales of optoelectronics, sensors, actuators, and discrete semiconductors regained strength in 2014 and collectively increased 9% to reach an all-time high of $63 |
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New CXA2 LED Arrays Enable System Cost Savings of up to 60 Percent (2015.03.26)
Cree, Inc. introduces a new addition to its industry leading CXA LED array family, CXA2 LED arrays, delivering up to 33 percent higher efficacy in the same form factors. Utilizing elements of the Cree SC5 Technology Platform, this improvement in lumen density enables better performance and radically reduces system size and cost |
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Broadcom Launches First HD Satellite Set-top Box SoC for China (2015.03.25)
Broadcom Corporation announced a new high definition (HD) set-top box (STB) system-on-chip (SoC) for China's free-to-air (FTA) satellite market. As the momentum to deploy HD programming in China increases, Broadcom's BCM7228 chip enables satellite TV operators to roll out more advanced services and additional HD satellite broadcast transmissions through the integration of Audio Video Coding Standard (AVS+) decompression |
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The NAND Flash Industry Advances with TLC Products Taking Charge of the Market Drive (2015.03.25)
The newest report from DRAMeXchange, a division of TrendForce, indicates that TLC NAND flash will account for nearly half of the total NAND flash output in 4Q15. With TLC NAND applications shifting from memory card and USB drive to OEM storage devices such as eMMC/eMCP and SSD, manufacturers will in turn launch their TLC-based storage solutions this year |
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MOST150 Enable Cost-Effective Smart Antenna Module Coaxial Connectivity (2015.03.25)
Microchip Technology announced that the MOST® Cooperation released its MOST150 technology coaxial physical layer specification. This new industry-standard specification enables Microchip to support smart antenna module connectivity to in-vehicle MOST150 advanced driver assistance system (ADAS) and infotainment networks, via its OS81118AF Intelligent Network Interface Controller (INIC) with integrated coax transceiver |
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Inventec Eyes on Handheld and Servers; India Factory to Activate in Q3 (2015.03.25)
TAIPEI, Taiwan － Inventec yesterday at a corporate presentation announced that smart handheld devices and servers will be Inventec’s main products this year. Currently the growth ratio for handheld devices is already in the double digits, and it will continue to increase this year |
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The WPC Chairman: This is the Year of Qi (2015.03.25)
TAIPEI, Taiwan — “” Will wireless charging change the way of our charging habit? The Wireless Power Consortium (WPC) Chairman Menno Treffers suggested the answer is positive. Since both the Samsung Galaxy S6 and S6 edge feature built-in, industry-standard wireless charging capabilities, which are under the Qi/WPC standard |
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GUC Relocates North America with Good Business Shape (2015.03.25)
HSIHCHU, Taiwa - Global Unichip Corp. (GUC) today relocated its North American Office to 2851 Junction Ave. Suite 101, San Jose, California.
The new office accommodates a growing engineering staff and expanded technical capabilities demanded by a robust US market |
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Industry's First Online Classroom for Analog Design (2015.03.24)
Texas Instruments (TI) unveiled TI Precision Labs, the electronics industry's first comprehensive online classroom for analog engineers. The on-demand courses pair theory and applied lab exercises to deepen the technical expertise of experienced engineers and accelerate the development of those early in their careers |
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Pepper the Robot to Bring Forth a Craze in AI and App Development (2015.03.24)
Harrison Po, consultant of Topology, a division of TrendForce, said SoftBank’s Pepper has opened another window of opportunity in the market for smart service robots. In the future, the market size of this kind of robots will grow with new and diverse applications |
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Industry's Lowest Power EDC PHY Delivers 30% Power Reduction to Enterprise and Carrier Systems (2015.03.24)
Broadcom Corporation announced the industry's first 28 nanometer (nm) electronic dispersion compensation (EDC) physical layer transceiver (PHY) with support for long reach multimode (LRM). This latest addition to Broadcom's portfolio of 1/10/40GbE physical layer devices delivers significant power savings while boosting performance |
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NARlabs Launches the World’s First Multi-sensor Integrated MCU (2015.03.24)
TAIPEI, Taiwan — The National Applied Research Laboratories (NARLabs) lauched the world’s first multi-sensor integrated single-chip microcomputer (MCU) technology on March 24, the idea is combining micro-mechanism structure and IC chips that allows different kinds of sensors can be embedded along with processors, and communication circuits altogether in one chip |
