 |
Global PC Supply to be Affected by Coronavirus Outbreak (2020.02.11)
A new type of pneumonia outbreak, now known as Wuhan coronavirus, has taken place in China since last year. The Chinese lunar new year travel rush in the early 2020 also deteriorated the situation by causing this coronavirus epidemic to spread faster across China and the world |
 |
HOLTEK New HT45B3305H CAN Bus Controller (2020.02.11)
Holtek announces the release of its new CAN Bus interface controller IC, the HT45B3305H. The CAN physical layer supports up to a 1 Mbit/s high speed network, supplying excellent performance to industrial communication applications, making the device suitable for use in automotive electronics such as body control modules, steering/window peripheral control, automotive lighting and air conditioning control |
|
STMicroelectronics Announces New STM32H7 Product Lines for Smart Devices (2020.02.11)
STMicroelectronics’ latest STM32H7A3, STM32H7B3, and STM32H7B0 Value Line microcontrollers (MCUs) combine 280MHz Arm Cortex-M7 core performance, high memory density, and power savings for future generations of smart objects |
|
PICO-WHU4: Compact Board Built for the Edge (2020.02.11)
AAEON announces the PICO-WHU4, the latest compact board designed for embedded artificial intelligence, and edge computing. Built on the PICO-ITX form factor and powered by 8th Generation Intel Core Processors, the PICO-WHU4 is a powerful and compact solution for a wide range of applications |
|
TSMC Announces January 2020 Revenue, Up 32.8% YoY (2020.02.10)
HSINCHU, Taiwan– TSMC today announced its net revenues for January 202. On a consolidated basis, revenues for January 2020 were approximately NT$103.68 billion, an increase of 0.4 percent from December 2019, and an increase of 32 |
|
AUO Reports January 2020 Consolidated Revenue of of NT$15.49 Billion (2020.02.10)
HSINCHU, Taiwan – AU Optronics Corp. (AUO) today announced its unaudited consolidated revenue of NT$15.49 billion for January 2020. With fewer working days due to the Chinese New Year holidays, revenue for the month of January fell by 25 |
|
STMicroelectronics and Fieldscale Bring Intuitive Touch Controls to STM32-Based Smart Devices (2020.02.10)
TAIPEI, Taiwan – STMicroelectronics and Fieldscale, an ST Authorized Partner and provider of simulation software, have joined forces to simplify development of touch-enabled user interfaces for smart devices containing ST’s STM32 microcontrollers (MCUs) |
|
Cincoze Fully Supports 9th Generation Intel Core and Xeon Processors (2020.02.10)
TAIPEI, Taiwan – Cincoze today announced upgraded rugged embedded computers with 9th generation Intel Core i7/i5/i3 and Xeon E processors. Supporting between 4 to 8 cores and the latest DDR4-2666 memory, the 9th generation processors take mainstream CPU performance to a whole new level and fulfill multiple workload requirements |
|
Japan’s NEDO and Panasonic Achieve the World’s Highest Conversion Efficiency Solar Cell (2020.02.07)
Panasonic Corporation has achieved the world's highest energy conversion efficiency of 16.09% for a perovskite solar module (Aperture area 802 cm2: 30 cm long x 30 cm wide x 2 mm thick) by developing lightweight technology using a glass substrate and a large-area coating method based on inkjet printing |
|
Acer Reports January 2020 Consolidated Revenues of NT$13.55 Billion, Down 18.6% YoY (2020.02.07)
TAIPEI, Taiwan - Acer announced its consolidated revenues for January 2020 at NT$13.55 billion, down 18.6% year-on-year and by 41.8% month-on-month. The January revenue reflected key component supply issues, compounded by market demand affected by the Chinese New Year holiday and the new coronavirus |
|
Aetina Join Embedded World 2020 with Vision-Critical GPGPU Solution (2020.02.07)
TAIPEI, Taiwan – Aetina Corporation announced that it will demonstrate AI related products in Embedded World 2020. Aetina aims to set a stable environment for multiple image-critical applications in vertical markets like medical, gaming, machine learning, and AI inference needed |
|
MIRDC Signs an MOU with Daye University for Wind Power Talents Cultivation (2020.02.07)
TAIPEI, Taiwan - To implement the cultivation of high-level talents and promote the development of the wind power industry, the Metal Industries Research & Development Centre(MIRDC) signed a memorandum of cooperation with Daye University |
|
STMicroelectronics Accelerates Innovation in Automotive Electronics with Powerful Development Tools (2020.02.06)
STMicroelectronics is helping the automotive industry deliver safer, greener, and smarter vehicles to market more quickly and cost effectively with new tools that assist the development of electronic control units (ECUs), the ‘mini-computers’ that manage the numerous electronic systems in today’s vehicles |
|
Toshiba Launches Compact, Low Power, High Resolution Micro-stepping Motor Driver IC (2020.02.06)
Toshiba has launched “TC78H670FTG,” the latest addition to its line-up of micro-stepping motor driver ICs. The new IC has a maximum rating of 18V/2.0A and can drive motors with a wide range of operating voltages. Mass production starts today |
|
Mitsubishi Develops New Antenna and RF-IC Enable Future High-speed Internet Access (2020.02.06)
Mitsubishi Electric announced today that in collaboration with Japan’s National Institute of Information and Communications Technology (NICT) it has developed technology for an extra-thin Ka-band (27 to 40 GHz) active electronically steered array antenna (AESA) featuring the world’s thinnest profile, less than three centimeters, to deliver high-speed inflight connectivity services via satellites at data rates beyond 100 Mbps |
|
AUO to Acquire Shares of ADLINK Through Tender Offer, Forging AIoT Strategic Partnership (2020.02.06)
HSINCHU, Taiwan – AU Optronics Corp. (AUO) announced that as part of the value transformation plan, AUO’s Board of Directors resolved to acquire 5% to 30% shares of ADLINK via tender offer. Through this tender offer, the two parties wish to form a strategic partnership for building an industrial and commercial AIoT ecosystem |
|
A Cornerstone For Storage: Design-Forward External Hard Drive (2020.02.05)
TAIPEI, Taiwan – Silicon Power’s newest 3.5” external hard drive, the Stream S07, blends design with function. Intended to be reminiscent of a stone and coming in capacities up to 8TB, the Stream S07 will truly become your cornerstone for storage |
|
UMC Leads all Semiconductor Foundries with CDP “Leadership Level” (2020.02.04)
HSINCHU, Taiwan - United Microelectronics Corporation today announced that for the fourth consecutive year, the company has achieved “Leadership Level” status in the annual global CDP (Carbon Disclosure Project) Climate Change Program |
|
Mitsubishi Electric’s New Technology Controls In-Building Mobilities and Facilities (2020.02.04)
Mitsubishi Electric announced today that it has developed a technology for controlling in-building mobile robots used for cleaning, security, delivery and guidance, as well as next-generation electric wheelchairs, using building dynamic maps* to achieve cooperative interaction between the robots, etc |
|
Samsung Launches the 'Flashbolt', Industry's First 3rd-generation (16GB) HBM2E (2020.02.04)
Samsung Electronics today announced the market launch of 'Flashbolt', its third-generation High Bandwidth Memory 2E (HBM2E). The new 16-gigabyte (GB) HBM2E is uniquely suited to maximize high performance computing (HPC) systems and help system manufacturers to advance their supercomputers, AI-driven data analytics and state-of-the-art graphics systems in a timely manner |
USB2.0 is a Universal Serial Bus standard PC and peripheral equipment is widely used to get rid of the application areas limited to the PC in the past, and more in-depth applications in the digital consumer electronics products which.