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CTIMES / Electronic Science and Technology
Science and Technology
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What is Hypertext (hypertext)? Hypertext brief his

The so-called hypertext (hypertext) is the decomposition of various types of information into meaningful information block stored in different nodes (node) and a distinct narrative style of a traditional print media. In 1965, Ted Nelson first Hypertext word, Andy van Dam et al in 1967 to establish the Hypertext editing system.
M31 Wins Customers’ Choice Award for Automotive IP Paper at TSMC OIP Ecosystem Forum (2020.01.14)
HSINCHU, Taiwan –M31 Technology announced that it has received a Customers’ Choice Award for a technical paper focused on IP for automotive applications at TSMC 2019 Open Innovation Platform Ecosystem Forum. The paper, titled “A New Era of MIPI D-PHY and C-PHY in Automotive Electronic Applications,” was developed and presented by Sanco Feng, Technical Manager at M31
IC Insights: China Only Region to Register Pure-Play Foundry Market Growth in 2019 (2020.01.13)
IC Insights said that the China market was the only major region that showed an increase in pure-play foundry sales last year. Moreover, the European and Japanese pure-play foundry markets each displayed a double-digit decline in 2019
Imec Demonstrates Scalable III-V and III-N Devices on Si Targeting beyond 5G RF Front-End Modules (2020.01.13)
Imec presents the first functional GaAs-based heterojunction bipolar transistor (HBT) devices on 300mm Si, and CMOS-compatible GaN-based devices on 200mm Si for mm-wave applications. The results demonstrate the potential of both III-V-on-Si and GaN-on-Si as CMOS-compatible technologies for enabling RF front-end modules for beyond 5G applications
Juniper Research: 5G Connections to Reach 1.5 Billion Globally by 2025 (2020.01.13)
A new study from Juniper Research found that the total number of 5G connections will reach 1.5 billion globally by 2025, rising from only 5 million in 2019. This is an annual average growth of 150% over the next 6 years. The new study
Asia-Pacific will Lead 5G Technology Adoption by 2024 (2020.01.13)
Asia-Pacific (APAC) will be the leading region in terms of 5G technology adoption with 1.14 billion subscribers, accounting for 65% of global 5G subscriptions by 2024, says GlobalData, a leading data and analytics company. An analysis of GlobalData’s Asia Pacific Mobile Broadband Forecast Pack reveals that APAC will be the largest region followed by North America, accounting for 44% and 32% share, respectively, in terms of revenue in 2024
Acer Reports December 2019 Consolidated Revenues of NT$23.27 Billion, Up 13.9% MoM and 8.1% YoY (2020.01.09)
TAIPEI, Taiwan- Acer announced its consolidated revenues for December 2019 at NT$23.27 billion, up 13.9% month-on-month and by 8.1% year-on-year. The fourth quarter revenues reached NT$61.52 billion, down 2.2% quarter-on-quarter and by 3
DRAM Contract Prices to Rise in 1Q20 as Power Outage at Samsung Fab Spurs Demand, Says TrendForce (2020.01.09)
According to the latest analysis from the DRAMeXchange research division of TrendForce, the consistent increase in DRAM spot prices since December and the power outage at Samsung’s Hwaseong fab on December 31, 2019 have not seriously impacted the supply side of the DRAM market
MediaTek Announces Dimensity 800 5G Series Chipsets for Mid-Range 5G Smartphones (2020.01.08)
MediaTek today introduced its Dimensity 800 Series 5G chipset family that will bring flagship features, power and performance to New Premium mid-range 5G smartphones. MediaTek’s Dimensity 5G chipset family offers powerful system-on-chips (SoCs) with integrated 5G modems
ITRI, Xplova, and Everest Textile Sign Cooperation Agreement on Digital Fitness Platform at CES 2020 (2020.01.08)
The Industrial Technology Research Institute (ITRI), Xplova, and Everest Textile signed an MoU (Memorandum of Understanding) today (Jan. 7) at the CES 2020 in Las Vegas to announce their cooperation on the development of a digital fitness platform
TDK Release New TDK RoboKit Supporting Qualcomm RB3 Platform and ROS (2020.01.08)
TDK Corporation announces RoboKit, a new development kit that enables seamless integration of solutions from TDK’s portfolio designed for the robotics market. RoboKit integrates key TDK offerings such as InvenSense ICM-42688-P 6-axis IMU
Taiwan Tech Arena Win 13 Innovation Awards at CES 2020 (2020.01.08)
TAIPEI, Taiwan - Under initiative of Ministry of Science and Technology (MOST) of Taiwan, Taiwan Tech Arena (TTA) organizes a delegation of startups for CES 2020 leaded by Deputy Minister Dr. Yu-Chin Hsu during Jan 7th to 10th (local time)
Fingerprints Expands Access Control Portfolio with Two Capacitive Touch Sensors (2020.01.07)
In order to meet the unique needs of the diverse and growing market for biometric access control, Fingerprint Cards AB today announces the expansion of its fingerprint authentication touch sensor portfolio, for physical and logical access devices and applications
Seoul Semiconductor and Seoul Viosys Showcase the World’s First One Pixel Micro LED for 4K TV (2020.01.07)
Seoul Semiconductor and Seoul Viosys announced the new concept display, ‘Micro Clean LED’ at CES 2020. The new concept of Micro Clean LED, which Seoul Viosys developed, is the technology that realizes 4K resolution TV sizes from 42 inch to 220 inch with 1 RGB LED per pixel and is ready for mass production
Value Added Has Fallen For Two Consecutive Years in Taiwanese Manufacturing (2020.01.07)
TAIPEI, Taiwan - According to the findings of a study conducted by the Chung-Hua Institution for Economic Research, since December 2018, the proportion of Taiwanese manufacturers affected by Sino-U.S. Trade disputes has yet to experience a significant increase
Taiwan Tech Arena Delegation of Startups Attracts Global VCs in Silicon Valley (2020.01.06)
TAIPEI, Taiwan - Under initiative of Ministry of Science and Technology (MOST) of Taiwan, Taiwan Tech Arena (TTA) organizes a delegation of startups for CES 2020. In order to warm up for the CES, TTA held “2020 Taiwan Demo Day” in Silicon Valley
Sharp at CES 2020: Realizing an 8K+5G Ecosystem (2020.01.06)
Sharp is set to return to CES 2020 with an exhibit showcasing the latest installments in its evolving ecosystem of products and services that leverage the benefits of Ultra-HD 8K video and advanced 5G wireless technology. Sharp’s 8K+5G Ecosystem comprises end-to-end solutions for the recording
New E-paper Displays Deliver Higher Resolutions in Larger formats for Demanding Applications (2020.01.06)
Pervasive Displays (PDi), a world leader in e-paper displays, announces the introduction of the E24581JS084 5.8-inch and E2969JS084 9.7-inch tri-color Electronic Paper Display (EPD) modules offering high bi-stable image resolution of 134 dpi and 121 dpi respectively
HOLTEK New HT45F5Q-1 Charger MCU (2020.01.06)
Within the charger product application area, Holtek announced the release of its new charger application specific Flash MCU, the HT45F5Q-1. When compared with the HT45F5Q-2/-3 previously released devices, this new device contains a simplified range of MCU resources offering the advantages of lower cost, fewer external components and enhanced charger functions over traditional solutions
AUO to Showcase Its New Mini LED Backlight Digital Cockpit Solutions for Smart Vehicle User Interfac (2020.01.06)
HSINCHU, Taiwan – AU Optronics Corp. (AUO) today announced its participation to CES 2020 from January 7 to 10, presenting its latest display technologies and applications that are transforming smart and connected vehicles, and facilitating ultimate user experience at home, at work and on the go
Acer Introduces New TravelMate P6 Notebook for Mobile Professionals (2020.01.06)
Acer today announced its latest TravelMate P6 and TravelMate P2 commercial notebooks for modern, mobile, security-conscious customers. The powerful and robust 14-inch and 15-inch notebooks feature up to 10th Gen Intel Core i7 processors, comply with MIL-STD-810G U

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4 u-blox Positioning Solutions Available on NVIDIA Jetson Edge AI and DRIVE Hyperion platforms
5 Grundfos and YCM Partner to Accelerate Smart and Energy-Efficient Machine Tool
6 NSTC Minister Meets with Czech Republic Minister of Science, Re-search and Innovation
7 ITRI to Cultivate Green Talents and Bridge Taiwan's Power Gap

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