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Innodisk Group Strengthens AIoT Vision with Sysinno Acquisition (2019.12.18)
TAIPEI, Taiwan - Innodisk is announcing the addition of Sysinno Technology to Innodisk Group. The acquisition strengthens Innodisk Group’s ambition to bring the future of Artificial Intelligence and the Internet of Things (AIoT) to customers around the world |
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Baidu and Samsung Ready for Production of New Edge AI Chip for Early Next Year (2019.12.18)
Baidu and Samsung Electronics today announced that Baidu’s first cloud-to-edge AI accelerator, Baidu KUNLUN, has completed its development and will be mass-produced early next year.
Baidu KUNLUN chip is built on the company’s advanced XPU, a home-grown neural processor architecture for cloud, edge, and AI, as well as Samsung’s 14-nanometer (nm) process technology with its I-Cube (Interposer-Cube) package solution |
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Renesas Electronics Collaborates With Xilinx on Versal ACAP Reference Designs (2019.12.18)
Renesas Electronics today announced that its power solutions, as well as timing solutions from IDT, a wholly-owned subsidiary of Renesas, support the Xilinx Versal adaptive compute acceleration platform (ACAP) devices featured on the Xilinx VCK190 evaluation kit and the Renesas VERSALDEMO1Z power reference board |
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Push Performance to the Edge with UP Xtreme from AAEON (2019.12.17)
AAEON announces the latest product in the UP line of products, the UP Xtreme board and UP Xtreme Edge embedded system, also called UPX Edge. With the power of the 8th Generation Intel Core processors, the UP Xtreme is built to power industrial automation, robotics, AI, and IoT applications |
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HOLTEK New HT45F0063 Multi-channel RGB LED MCU (2019.12.17)
Holtek announced the release of a new RGB LED Flash MCU, the HT45F0063, which is an extension device to the HT45F0062, and which provides an enhanced level of system resources.
The new device’s RGB LED driving circuitry supports both scanning and direct driving modes and can drive up to 48 dots allowing it to therefore accommodate 16 RGB LEDs |
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ASIX Launches a Small Package and Easy-design EtherCAT Slave Controller SoC Solution (2019.12.17)
HSINCHU, Taiwan – ASIX Electronics today announces a new generation EtherCAT Slave Controller SoC - "AX58200 2/3-Port EtherCAT Slave Controller SoC with 2 Embedded Ethernet PHYs" to provide designers a small package size (10x10 mm) and easy-design EtherCAT slave controller SoC solution |
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E Ink Announces Printed Color E-Paper Technology – Intends to Enter Education Market (2019.12.16)
TAIPE, Taiwan - E Ink has announced their latest piece of color e-paper technology – Print-Color E Ink. Together with their flagship color e-paper technology, E Ink intends to introduce this technology into the following two application sectors: smart education and new retail |
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SmartLabs Establishes First Overseas Office in Taiwan (2019.12.16)
TAIPEI, Taiwan - SmartLabs, the international biomedical accelerator with which the Ministry of Science and Technology (MOST) has been working to introduce in Taiwan, formally established a preparatory office today (December 16) in the Hsinchu Biomedical Science Park |
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1Q20 DRAM Contract Prices Stop Falling, Says TrendForce (2019.12.16)
According to the latest analysis of TrendForce’s DRAMeXchange research division, DRAM spot prices have begun to rebound, in turn improving the overall DRAM market sentiment, and memory component buyers in the contract market will be induced to raise their inventories as well |
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TDDI Manufacturing Moves to More Advanced Process Technologies, Says TrendForce (2019.12.13)
According to the latest analysis from the WitsView research division of TrendForce, as electronic device manufacturers start to develop product strategies for the 2020 market driven by the commercialization of 5G technology, foundries are likewise raising their capacity utilization rates |
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STMicroelectronics Closes Acquisition of SiC Wafer Specialist Norstel AB (2019.12.12)
STMicroelectronics today announced the closing of the full acquisition of Swedish silicon carbide (SiC) wafer manufacturer Norstel AB (“Norstel”). ST exercised its option to acquire the remaining 45% stake, following the initial transaction announced in February 2019 |
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HOLTEK New BS83A02L Ultra-Low Power I/O Touch MCU (2019.12.12)
Holtek announced the release of a new generation ultra-low power I/O type Touch Flash MCU, the BS83A02L. This device has ultra-low power characteristics giving it a single touch key standby current of less than 150nA at a voltage of 3V |
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ITRI Showcases AI and Robotics Technologies at CES 2020 (2019.12.12)
HSINCHU, Taiwan - The Industrial Technology Research Institute (ITRI), Taiwan's largest and one of the world's leading high-tech applied research institutions, today announced it will introduce and demonstrate AI and robotics technologies at its booth 25650, LVCC, South Hall 2 at CES 2020 |
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Low on Resistance, High Speed Switching Expanded Lineup of N-channel MOSFET for General Purpose (2019.12.12)
Torex Semiconductor Ltd. has launched new product XP231N0201TR(30V withstand voltage) for MOSEFET.
The product which released this time are general-purpose N-channel MOSFET with low on resistance and high speed switching. It can be used for various applications such as relay circuits and switching circuits |
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Advantech EIoT World Partner Conference Co-Creating AIoT Ecosystem (2019.12.12)
TAIPEI, Taiwan – Advantech is hosting the Embedded IoT World Partner Conference at its IoT Campus at Linkou. The conference theme is, Leading Embedded Innovation into an AIoT Future. It will showcase various IoT and AIoT related solutions co-created by Advantech, its partners, and customers from around the world |
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All M31 Automotive IP Products Received ISO 26262 Certifications (2019.12.12)
HSINCHU, Taiwan – M31 Technology announced today of their “PCIe PHY” and “MIPI D PHY” ISO 26262 Automotive Safety Integrity Level ASIL B Ready certification approved by German authority SGS-TÜV. This is following the prior ISO certifications received for high speed interface IP- “MIPI M PHY”, foundation IP- “GPIO” and “SRAM Compiler” |
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Acer Reports November Consolidated Revenues of NT$20.43 Billion, Up 14.6% MoM (2019.12.12)
TAIPEI, Taiwan – Acer announced its consolidated revenues for November at NT$20.43 billion, growing by 14.6% month-on-month (MoM); and its year-to-November revenues at NT$210.95 billion, down 4.4% year-on-year (YoY).
For year-to-November, Acer’s gaming line grew by 28% in unit shipments, and thin-and-light notebooks grew by 22% in unit shipments, YoY |
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Lattice Announces New Low Power FPGA Platform (2019.12.11)
Lattice Semiconductor announced its new low power FPGA platform, Lattice Nexus. The platform is architected to deliver power-efficient performance that will benefit developers of a wide range of applications, including AI for IoT, video, hardware security, embedded vision, 5G infrastructure and industrial/automotive automation |
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PIDA 4.0 – Optics League of Legends to Launch in January 2020 (2019.12.11)
TAIPEI, Taiwan - Committed to promoting the development of the photovoltaic industry in Taiwan, Photonics Industry & Technology Development Association (PIDA) on December 6 held a press briefing and pledged to actively engage in more collaborations with public associations to collectively promote the development of Taiwan's photovoltaic industry |
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Chinese 5G Smartphone Users Outperform Korean Users Following 5G Commercial Launch in November (2019.12.10)
‘Mobile and network communications applications, products, and services in 2020 and 2021 will be built mostly around 5G and, currently, over 50 telecoms in 27 countries around the world have started their 5G network deployments,” said Chien-Hsun Lee, senior industry analyst of MIC |
Overall, the number of times the Bus specification standard is rising between mainframe computers and peripherals, data transfer speed, capacity and quality of the application process. Let's Introduction to several important bus application specifications.