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CTIMES / Electronics industry
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P2P-file exchange

"P2P", it simply is peer-to-peer-to peer-to-peer connection software ", which means" the use of the end "" Using end "(Client to Client) communications technology that allows all devices without going through the centralserver, will be able to directly Unicom spread information.
Global OSAT Market Shows Signs of Recovery in 2H19, But Yearly Revenue to Decline Slightly (2019.11.20)
According to the latest research from TrendForce, the decline in the global OSAT industry showed signs of a gradual halt in 3Q19, since the drop in memory prices began to slow down, and smartphone sales steadily recovered. The top ten OSAT providers posted a total revenue of US$6 billion in 3Q19, a 10
Toshiba Releases Its First eFuse, an Electronic Fuse That Can Be Repeatedly Used (2019.11.20)
Toshiba has launched the “TCKE8xx series,” its first-ever eFuse ICs, a lineup of six products that support various functions needed for circuit protection in power supply lines. Shipments of two products in the lineup start today
Keysight Technologies Unveils Industry 4.0-ready In-Circuit Test (ICT) Suite (2019.11.20)
Keysight Technologies today announced the i3070 Series 6 In-Circuit Test (ICT) suite of solutions which enables electronics manufacturers to improve test throughput and the operational efficiency of their printed circuit board assembly (PCBA) manufacturing
Fingerprint Cards Unveils New Slim Side-mounted Capacitive Sensor for Mobile Devices (2019.11.20)
Fingerprint Cards today announces the launch of a new side-mounted capacitive touch sensor for biometric authentication. Responding to customer demand, the slim FPC1540 sensor enables a range of the latest smartphone designs including borderless and foldable phones
Cree and STMicroelectronics Expand and Extend Existing Silicon Carbide Wafer Supply Agreement (2019.11.20)
Cree and STMicroelectronics announced today the expansion and extension of an existing multi-year, long-term silicon carbide (SiC) wafer supply agreement to more than $500 million. The extended agreement is a doubling in value of the original agreement for the supply of Cree’s advanced 150mm silicon carbide bare and epitaxial wafers to STMicroelectronics over the next several years
Asia/Pacific Spending on Security Solutions Projected to Reach 16.4 Billion in 2019 (2019.11.19)
According to the latest IDC Worldwide Semiannual Security Spending Guide, spending on security hardware, services, and software in Asia/Pacific is expected to reach USD 16.4 billion in 2019, an increase of 20.01% over previous year
Chen Liang-gee Meets NVIDIA Chief Scientist William J. Dally to Deepen AI Cooperation (2019.11.19)
TAIPEI, Taiwan - Taiwan’s Ministry of Science and Technology (MOST) has teamed up with NVIDIA once again following NVIDIA's response to MOST’s AI research strategy, and after jointly proposing five major directions for cooperation, MOST invited NVIDIA Senior Vice President and Chief Scientist William J
Faraday and UMC Collaborate to Launch a Complete Set of 22nm Fundamental IP (2019.11.18)
HSINCHU, Taiwan - Faraday Technology and United Microelectronics Corporation, today announced the availability of Faraday’s fundamental IP on UMC’s 22nm ultra-low-power (ULP) and ultra-low-leakage (ULL) processes. The silicon-proven 22ULP/ULL fundamental IP, including multi-Vt standard cell libraries, ECO libraries, IO libraries, PowerSlash kit, and memory compilers, offers significant power reduction for the next level of SoC design
Demand for Preemptive 3Q19 DRAM Shipment Rises, Pushing Global DRAM Revenue Up by 4% (2019.11.18)
According to the DRAMeXchange research division of TrendForce, demand-side inventory in 2H19 has returned to relatively healthy levels. Furthermore, some vendors pulled their quarterly product shipment forward in an effort to avoid potential negative impacts from Trump’s impending tariffs; this shift skyrocketed DRAM suppliers’ sales bits in 3Q19
HOLTEK HT79171/HT79181 – High-Efficiency 5A/6A Peak Current Synchronous Step-Up Converter (2019.11.18)
Holtek has released new high-efficiency synchronous step-up converters, the HT79171 and HT79181, capable of driving peak currents of up to 5A/6A respectively. These devices have extremely low RDSON values of only 25mΩ/45mΩ for the HT79171 and 20mΩ/40mΩ for the HT79181
TSIA Q3 2019 Statistics on Taiwan IC Industry (2019.11.18)
The TSIA survey showed that Q3 2019 Taiwan IC revenue as a whole (including design, manufacturing, packaging and testing) totaled NT$721.7 billion(US$23.9B) (15.4% growth on-quarter and up 4.4% on-year). With NT$186.0B in design(US$6
Aetina Provides Rich Develop Choice of Embedded Equipment Based on GPU (2019.11.15)
TAIPEI, Taiwan - Since AI rules the generation now, the amount of smart applications had requested higher and higher, which also provide the AI embedded system and application developers a various choice to start their project
KIOXIA Introduces Industry’s First 512GB Automotive UFS (2019.11.14)
KIOXIA Corporation today announced that it has begun sampling the industry’s first 512 gigabyte (GB) Automotive Universal Flash Storage (UFS) JEDEC Version 2.1 embedded memory solution. KIOXIA’s Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade2 requirements and offers the extended reliability required by various automotive applications
US and Israel Masters join the Revelation of M&A forum in Meet Taipei 2019 (2019.11.14)
TAIPEI, Taiwan - According to the “Survey among CEOs in Taiwan 2019” released by KPMG Taiwan, corporate have to change their mindset from “efficiency-driven” to “innovation-driven” in order to pursue sustainable growth
Vishay Intertechnology Introduces New Commercial Inductors in Compact 1212 Case Size (2019.11.14)
Vishay Intertechnology, Inc. introduced three new commercial IHLP low profile, high current inductors in the 3.3 mm by 3.3 mm 1212 case size — the company's smallest to date. Designed to save space in computer and telecom applications, the Vishay Dale IHLP-1212AZ-01, IHLP-1212AB-01, and IHLP-1212BZ-01 offer extremely low profiles down to 1
NexCOBOT Introduces the AI-enabled Smart Robot Box Series to Revolutionize Smart Manufacturing (2019.11.14)
NexCOBOT announced the new Smart Robot Box (SRB) Series that operates as a robot commander to connect to all major industrial robots and simplifies the process of developing, testing, and deploying robotic applications. Leveraging a powerful combination of Amazon Web Services (AWS) IoT Greengrass and AWS RoboMaker
Keysight Enables the Global Certification Forum to Certify 5G New Radio Mobile Devices (2019.11.13)
Keysight Technologies announced the company's 5G Protocol and RF/RRM & DVT conformance toolsets were used to submit 5G new radio (NR) non-standalone (NSA) and standalone (SA) test cases to the Global Certification Forum (GCF)
New Non-Invasive PPG Sensor for Detecting Physiological Data Based Smart AI Algorithm (2019.11.13)
Supported by Ministry of Science and Technology (MOST), Taiwan, the Sensors IC Lab, leady by Distinguished Professor Paul Chao at National Chiao Tung Uni-versity (NCTU), have developed successfully the technologies that makes possible the world-first hand-held blood flow volume (BFV) sensor
Imec.istart Recognized as World's Top Business Accelerator in 2019 (2019.11.13)
Imec's accelerator program, imec.istart, was ranked in the top 5 in the 'World Top Business Accelerator - Linked to University' category and No.1 in Europe. UBI Global unveiled its biannual ranking of top university incubators and accelerators at the World Incubation Summit in Doha, Qatar
Six O-S-D Product Categories Will Hit Record Sales in 2019 (2019.11.13)
Despite a slowdown, combined revenues for optoelectronics, sensors/actuators, and discrete semiconductors are expected to barely set a 10th consecutive record high in 2019, followed by gradual strengthening in 2020 and 2021, says IC Insights

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