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CTIMES / Electronic Science and Technology
Science and Technology
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Smooth flow of USB2.0--the computer interface devi

USB2.0 is a Universal Serial Bus standard PC and peripheral equipment is widely used to get rid of the application areas limited to the PC in the past, and more in-depth applications in the digital consumer electronics products which.
Offshore Wind Power Purchasing Rates Set this Week (2019.01.29)
TAIPEI, Taiwan - The Bureau of Energy, Ministry of Economic Affairs (MOEA) this week is expected to determine this year’s offshore wind power purchasing rates; furthermore, this year as the Bureau of Energy drafts the electrical fees, due to last year’s corrections from NT$5
KDDI, Obayashi, and NEC use 5G to Successfully Remotely Control Construction Machinery (2019.01.28)
NEC, KDDI and Obayashi today announced that they had successfully carried out an operation in which the next-generation mobile communication system 5G was used to remotely control two construction machines in a cooperative manner
Chunghwa Telecom MOD Partners with Netflix to Accelerate Growth of Taiwanese Entertainment (2019.01.25)
TAIPEI, Taiwan - Chunghwa Telecom (CHT), Taiwan’s largest telecommunication service provider, today announced an exclusive partnership with Netflix to promote domestic and international video content in superior 4K quality. The partnership is expected to create a wave of new user growth among younger generations
Mitsubishi Electric Develops Enhanced Tsunami Detection Technology (2019.01.25)
Mitsubishi Electric announced today that it has developed an high-frequency ocean surface radar technology that provides detailed measurement of tsunami sea levels, allowing more accurate and timely detection of the multiple wave-fronts of tsunamis
Semiconductor Unit Shipments Exceeded 1 Trillion Devices in 2018 (2019.01.25)
Annual semiconductor unit shipments, including integrated circuits and optoelectronics, sensors, and discrete (O-S-D) devices grew 10% in 2018 and surpassed the one trillion unit mark for the first time, based on data presented in the new, 2019 edition of IC Insights’ McClean Report—A Complete Analysis and Forecast of the Integrated Circuit Industry
Keysight Strengthens Support for Automotive Customers with New Facility in Nagoya, Japan (2019.01.25)
Keysight Technologies has opened a new automotive customer center in Nagoya, Japan. This is another in a series of automotive customer centers established by Keysight, including facilities in Michigan, United States, Boeblingen, Germany, and Shanghai, China
BIOSTAR Introduces Edge Computing Solution with SoC Motherboard -A10N-8800E (2019.01.24)
BIOSTAR introduces a solution for edge computing, the BIOSTAR A10N-8800E system-on-chip (SoC) mini-ITX motherboard, for faster data access and computing over traditional cloud solutions. The BIOSTAR A10N-8800E integrates the AMD FX-8800P processor, typically found in AMD mobile computing, for superb processing performance and power efficiency
IDC Expects Asia/Pacific excluding Japan Spending on Robotics to Reach US$129.4B in 2022 (2019.01.24)
The latest IDC Worldwide Semiannual Robotics and Drones Spending Guide forecasts Asia Pacific excluding Japan (APEJ) spending on robotics (including drones) and associated services to reach USD 129.4 billion by 2022, essentially three times the spending in 2018, with a five-year CAGR of 25
Intel Announces New Class of RealSense Stand-Alone Inside-Out Tracking Camera (2019.01.24)
Intel introduced the Intel RealSense Tracking Camera T265, a new class of stand-alone inside-out tracking device that will provide developers with a powerful building block for autonomous devices, delivering high-performance guidance and navigation
Revenue Growth in China's Semiconductor Industry Would Slow Down to 16.2% in 2019 due to Pessimistic (2019.01.24)
According to the latest report by TrendForce - Breakdown Analysis of China’s Semiconductor Industry, the outlook for China’s semiconductor industry has been tampered since the second half of 2018 due to pessimistic economy worldwide and uncertainties brought by the China-U
Mitsubishi Electric Establishes Factory Automation Service Center in Coimbatore, India (2019.01.23)
Mitsubishi Electric Corporation announced today that it will establish an "India Coimbatore FA Center" in Coimbatore, in India’s Tamil Nadu State. Scheduled to commence operations from February 1, the new facility will further strengthen the service network of the company’s factory automation (FA) products in India and facilitate expansion of its FA system business
Toshiba Memory Unveils Industry's First UFS Ver. 3.0 Embedded Flash Memory Devices (2019.01.23)
Toshiba Memory Corporation has started sampling the industry’s first Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. The new line-up utilizes the company’s cutting-edge, 96-layer BiCS FLASH 3D flash memory and is available in three capacities: 128GB, 256GB and 512GB
Nikon, ASML And Carl Zeiss Sign Agreement to Settle All Litigation (2019.01.23)
Nikon, ASML and Carl Zeiss have signed a Memorandum of Understanding relating to a comprehensive settlement of all legal proceedings over patents for lithography equipment and digital cameras. The Memorandum of Understanding is a binding agreement that concerns all pending disputes between Nikon, ASML and Zeiss in Europe, Japan and the United States, including at the U
Rohde & Schwarz Adds Emerging WireGuard VPN Protocol to Its DPI Software Library (2019.01.23)
ipoque GmbH, a Rohde & Schwarz company, today announced the addition of the innovative WireGuard VPN protocol to its R&S PACE 2 deep packet inspection (DPI) library. With this addition, ipoque enables network security vendors to detect the world’s fastest-growing VPN protocol and effectively manage VPN traffic built on it
Acer Launches Sturdy and Reliable TravelMate B114-21 for the Education Market (2019.01.23)
Acer announced the new Acer TravelMate B114-21 at the 2019 BETT Show in London, held from January 23 to 26. The latest notebook in its range for education customers, the powerful and robust 14-inch notebook features a larger screen size and sports a sturdy design to protect it from the knocks of school life, ideal for use both in-school and out-of-school
LED Packaging Companies Work on Niche Markets, Says TrendForce (2019.01.22)
Mainstream high- and mid-power LED package products in the Chinese market witnessed price declines in December, according to the latest report from LEDinside, a division of TrendForce. “LED manufacturers have continued to clear their inventories in December due to the weak demand at the year end, which lowered the prices in the general lighting market”, says LEDinside analyst Terri Wang
HOLTEK New BC2302A/B Sub-1GHz Superheterodyne OOK RF Receiver ICs (2019.01.22)
Holtek announced the release of its new Sub-1GHz Superheterodyne OOK high performance RF receiver ICs, the BC2302A and BC2302B. The BC2302A, which operates in the 300MHz~450MHz bands, and the BC2302B, which operates in the Sub-1GHz bands of 300MHz~935MHz, both operate within the ISM license-free frequency bands
Samsung Introduces New Ultra-Slim 20Mp ISOCELL Image Sensor for Full-Screen Display Smartphones (2019.01.22)
Samsung Electronics introduced its smallest high-resolution image sensor, the ISOCELL Slim 3T2. While being the industry’s most compact image sensor at 1/3.4 inches (approximately 5.1-millimeters diagonally), the 0.8μm-pixel ISOCELL Slim 3T2 delivers 20-megapixel (Mp) resolution for both front and back cameras in today’s sleekest mid-range smartphones
Toshiba Expands Ethernet Bridge IC Lineup for Automotive and Industrial Applications (2019.01.22)
Toshiba has expanded its lineup of automotive Ethernet bridge ICs with the new “TC9562 series”: TC9562AXBG, which offers more interfaces than Toshiba’s current bridge ICs, the TC9560 series; TC9562BXBG which supports Ethernet TSN and Ethernet AVB; and TC9562XBG, which offers simpler IC configuration than current products
MIX-H310A1: Powering Your Vision for Industry 4.0 (2019.01.22)
AAEON has announced its launch of MIX-H310A1, a next-generation industrial motherboard in mini-ITX form factor powered by 8th Generation Intel Core processor family (formerly Coffee Lake) for applications requiring high-performance computing and graphic-intensive systems

  Top Ten News
1 PICMG COM-HPC 1.2 Mini Brings PCIe 5.0, USB4 & 10 GbE to Far Edge
2 u-blox Introduces the Smallest Single-mode LTE Cat 1bis IoT Module
3 mechatronic systemtechnik GmbH Unveils Its New Technology Center in Fürnitz
4 u-blox Positioning Solutions Available on NVIDIA Jetson Edge AI and DRIVE Hyperion platforms
5 Grundfos and YCM Partner to Accelerate Smart and Energy-Efficient Machine Tool
6 NSTC Minister Meets with Czech Republic Minister of Science, Re-search and Innovation
7 ITRI to Cultivate Green Talents and Bridge Taiwan's Power Gap

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