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Seoul Semiconductor Wins Patent Litigation against Everlight in Germany (2018.12.12)
Seoul Semiconductor announced that it won a patent litigation against Everlight Electronics Co., Ltd. (“Everlight”) in Germany.
The patent involved in this litigation relates to an LED package structure for thermal dissipation |
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ASIX EtherCAT P One Cable Solution (2018.12.12)
ASIX Electronics announces a new AX58100 EtherCAT Slave Controller solution in March, 2018. The AX58100 integrates two embedded Fast Ethernet PHYs, SPI Master, PWM/ABZ/Hall Encoder, Digital I/O, etc. interfaces to provide a simple design and cost effective EtherCAT slave controller solution |
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TrendForce Forecasts Global VR Device Shipments at 6 Million Units in 2019 (2018.12.11)
TrendForce expects the global shipments of VR devices to reach 4.65 million units in 2018, and 6 million units in 2019, a YoY growth of 29%. Oculus’s strategy of price cut has successfully boosted sales since the release of Oculus Quest at the beginning of this year |
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AppNeta and AAEON Partner on Network Monitoring Platform at 100 Gbps Speeds (2018.12.11)
AppNeta and AAEON today announced that the two companies have partnered to offer new product enhancements to AppNeta’s performance monitoring platform, built for the cloud and SaaS-focused modern enterprise.
AAEON is a prominent global manufacturer of computer hardware systems and a subsidiary of ASUS |
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Faraday Reveals Its Multi-protocol Video Interface IP on UMC 28HPC (2018.12.11)
HSINCHU, Taiwan - Faraday Technology today announced the availability of its multi-protocol video interface IP on UMC 28nm HPC. The solution supports both transmitter (TX) and receiver (RX) featuring a reduced silicon footprint ideal for state-of-the-art panel and sensor interfaces, projectors, MFP, DSC, surveillance, AR and VR, and AI applications |
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Over 80% of Amazon's AI Patents Concentrate on Natural Language Processing Technology (2018.12.10)
Amazon's annual reports between 2012 and 2016 show an upward trend in revenue which rose from US$61.093 billion in 2012 to US$135.987 billion in 2016 with a CAGR (Compound Annual Growth Rate) of 22.1%, according to the Taipei-based government-backed IT research institute MIC (Market Intelligence & Consulting Institute) |
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HOLTEK New HT66F2560 Ultra-Low Power A/D MCU (2018.12.10)
Holtek announced the release of its new HT66F2560 Flash MCU, which has the special characteristics of ultra-low power and an integrated A/D converter circuit. This new device provides an excellent MCU solution for those applications which require ultra-low power consumption in the standby mode when the LXT oscillator remains enabled, such as portable consumer products which require prolonged battery lifetime |
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MediaTek Adopts Qualtera’s Silicondash Platform to Enhance Semiconductor Yield and Quality (2018.12.10)
Qualtera today announced that MediaTek’s deployment of Qualtera’s Silicondash Smart Manufacturing Platform has gone live in June 2018 and is now handling the manufacturing operations. Silicondash is used as MediaTek’s primary corporate data analytics solution with data integration across the global supply chain of worldwide manufacturing and test suppliers |
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Survey: Taiwan’s Mobile Addiction to Viewing Maximum Information Surpasses 70% (2018.12.10)
TAIPEI, Taiwan - A Taiwanese market research organization conducted a “mobile phone use behavior” survey of Taiwanese netizens. In a survey of selected markets, it was discovered that 72.7% of people self-identified as mobile phone addicts; furthermore, the addiction rate was higher for people with lower ages with the addiction rate decreasing with age |
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Taiwan’s Resources Recycling Achievement Highly Appreciated – Invited to Europe for Publicity (2018.12.07)
TAIPEI, Taiwan - The Recycling Found Management Board of Taiwan Environmental Protection Administration’s 20th anniversary results exhibition “2018 Taiwan Recycling Tour – Recycling Foundation 20th Anniversary” drew a successful close on August 25 |
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TSMC to Build a New 200mm Fab for Customized Design; 5-nm to Enter Trial Production Next Year (2018.12.07)
TAIPEI, Taiwan - C.C. Wei, CEO and vice chairman of TSMC, said at its supply chain management forum held in Hsinchu, Taiwan, that TSMC's 5nm process is expected to enter trial production in the second quarter of next year. In addition, TSMC will establish a new 8-inch(200mm) fab to meet the requirements of the customized design |
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DSP and Language Libraries are the Keys to Smart Voice (2018.12.06)
The success of the Amazon Echo has changed the entire style of the smart voice application market, and now when people discuss smart voice, Siri is not what comes to mind; instead people think of Alexa. Furthermore, in terms of application scenarios, households rather than mobile apps are the priority |
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Demand for Top Chinese Brands Drove Worldwide Smartphone Sales in Q318, Gartner Says (2018.12.06)
In the third quarter of 2018, Chinese brands Huawei and Xiaomi, helped drive global smartphone sales, according to Gartner, Inc. Overall, sales of smartphones to end users grew 1.4 percent in the third quarter of 2018 to reach 389 million units |
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MediaTek Debutes Its First Multi-mode 5G Baseband Chipset Helio M70 (2018.12.06)
Today at the China Mobile Global Partner Conference in Guangzhou, MediaTek’s first 5G baseband chipset Helio M70 was unveiled to the domestic market following its initial launch mid-year. The Helio M70 is among the industry’s first wave of 5G multi-mode integrated baseband chipsets, cementing MediaTek’s status as a leader in the 5G era |
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Toyoda Gosei Develops Air Conditioner Register with LED Illumination (2018.12.06)
Toyoda Gosei has developed an air conditioner register with LED illumination that uses wireless power transfer technology based on magnetic resonant coupling, the first such application in an automotive part.
The new vent register, used on the LEXUS UX, has LED illumination to improve the night visibility of the knob that adjusts the direction and strength of air flow |
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Renesas Electronics Announces Industry’s First USB-C Combo Buck-Boost Battery Charger (2018.12.06)
Renesas Electronics Corporation introduced the industry’s first USB-C buck-boost battery charger to support both Narrow Voltage Direct Charging (NVDC) and Hybrid Power Buck-Boost (HPBB) charging for notebooks, ultrabooks, tablets, and power banks using the reversible USB Type-C connector cable |
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Clientron Debuts Valued Endpoint S-Cube Thin Client Running on Raspberry Pi 3 B+ (2018.12.06)
Clientron unveiled its brand new economic thin client S-Cube Pi 3 B+, running on the latest Raspberry Pi 3 B+ platform, specifically designed for high performance and economic desktop virtualization solution for the education, SMB, finance, healthcare and enterprise markets |
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Toshiba Adds New 12TB/14TB Helium-Sealed Models to Both the N300 NAS and X300 HDD Line (2018.12.06)
Toshiba Electronic Devices & Storage Corporation is today adding 12TB and 14TB models to both its N300 NAS Hard Drive and X300 Performance Hard Drive series.
The new 12TB and 14TB models use a helium-sealed design, enabling the 3 |
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UWin Nanotech and Philippine Xin-Ye Sign Eco-friendly Gold Mining Technology Agreement (2018.12.06)
TUCHENG, Taiwan - Uwin Nanotech, at its Taipei Tucheng headquarters, held a signing ceremony for the eco-friendly gold mining technology authorizing agreement with the Philippines Xin-Ye Industry. Under the agreement, Uwin nanotech will authorize its patented eco-friendly gold stripping solution GP-860 to Xinye to raise a revolutionary green gold mining process in the Philippines |
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Mitsubishi, the University of Tokyo Reveal New Mechanism for Enhancing Reliability of SiC Power ICs (2018.12.04)
Mitsubishi Electric and the University of Tokyo announced today what they believe to be an all-new mechanism for enhancing the reliability of silicon carbide (SiC) power semiconductor devices in power electronics systems. The new mechanism was realized as a result of confirming that sulfur beneath the interface of gate oxide and SiC captures some of the electrons conducting in the device’s current path |
