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Lextar to Announce Mini LED Module for Automotive Tail Lamps (2018.11.01)
Lextar Electronics, the vertically integrated LED company is to announce its I-Mini Square module for automotive tail lamp application. The company applied its newest mini LED technology on automotive tail lamps which can display dynamic image smoothly |
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HOLTEK New HT66F2730 High Voltage and High Current MCU (2018.11.01)
Holtek announces the release of its new high voltage and high current Flash MCU, the HT66F2730. The device has an integrated 12V high voltage circuit, which can reduce the requirements for external high voltage driver components |
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Imec Releases Neuropixels Neural Probe to the Global Neuroscience Community (2018.11.01)
Imec released and is making available its state-of-the-art high-density neural probe, Neuropixels, to the global neuroscience research community. With almost a thousand electrodes, and 384 recording channels on a single shank, the Neuropixels probe provides an unprecedented resolution for mapping brain activity |
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AUO Reports NT$4.32 Billion Net Profit for Third Quarter 2018 (2018.10.31)
HSINCHU, Taiwan – AU Optronics Corp. (AUO) today held its investor conference and announced its consolidated financial results for the third quarter of 2018. Consolidated revenues for the third quarter of 2018 were NT$81.04 billion, up by 8 |
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Volkswagen, Mobileye and Champion Motors to Deploy First Autonomous EV Ride-Hailing Service in Israe (2018.10.31)
The Volkswagen Group, Mobileye, an Intel Company, and Champion Motors announced plans to deploy Israel’s first self-driving ride hailing service – or Mobility-as-a-Service (MaaS) – starting next year.
For this, the partners are planning to establish a joint venture |
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New TI Portfolio of Ready-to-use, 600-V GaN FET Power Stages Supports Applications up to 10 kW (2018.10.31)
Texas Instruments (TI) announced a new portfolio of ready-to-use, 600-V gallium nitride (GaN), 50-mΩ and 70-mΩ power stages to support applications up to 10 kW. The LMG341x family enables designers to create smaller, more efficient and higher-performing designs compared to silicon field-effect transistors (FETs) in AC/DC power supplies, robotics, renewable energy, grid infrastructure, telecom and personal electronics applications |
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Keysight, FormFactor, ITRI Collaborate to Deliver Silicon Photonics Test and Measurement Solution (2018.10.31)
Keysight Technologies announced a collaboration with FormFactor and the Industrial Technology Research Institute (ITRI) to accelerate integrated photonics innovation.
Silicon photonics enables the transfer of large amounts of data at high speeds using optical signals instead of electrical signals |
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Micron Opens Backend Factory in Taichung Aiming 3D memory Market (2018.10.31)
TAIPEI, Taiwan - Major memory manufacturer Micron on October 26 held an opening ceremony for their backend packaging and testing plant in Taichung. With the opening of this factory, Micron Taiwan will be the world’s only memory vertical integration production base with both manufacturing and testing, and the main target product will be 3D memory, which is currently in high demand |
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Toshiba Releases Bluetooth 5 IC for Automotive Applications (2018.10.30)
Toshiba Electronic Devices & Storage Corporation has added “TC35681IFTG”, a new IC for automotive applications, to its line-up of ICs compliant with Bluetooth low energy (LE)[1] core specification v5.0. The new device is suited to use in demanding automotive environments |
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Samsung Introduces Two New 0.8μm ISOCELL Image Sensors to the Smartphone Market (2018.10.30)
Samsung Electronics introduced two new 0.8-micrometer (μm) pixel image sensors – the 48-megapixel (Mp) Samsung ISOCELL Bright GM1 and the 32Mp ISOCELL Bright GD1.
“Demand for ultra-small, high-resolution image sensors are growing as smartphones evolve to deliver new and more exciting camera experiences for users,” said Ben K |
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Products with Mini LED Backlighting Expected a High Production in 2019 (2018.10.29)
According to the latest report - New Display Technology Cost Analysis - by WitsView, a division of TrendForce, Mini LED technology has made constant process over the past year, with a significant increase in production output (in unit per hour, UPH) and die bond accuracy |
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AUO Announces New Organizational Arrangement to Integrate Resources and Strengths (2018.10.29)
HSINCHU, Taiwan – AU Optronics Corp. (AUO) announced its new organizational arrangement. To continue to drive value transformation and enhance growth momentum, the Display Business Operation will be divided into Technology Group, Business Group, and Manufacturing Group |
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HOLTEK New HT45F6530 AC Voltage Regulator MCU (2018.10.29)
Holtek announced the release of its new AC Voltage Regulator (AVR) MCU, the HT45F6530. This new device can implement the measurement of AC input/output voltages as well as zero crossing detection, making it suitable for use in AC voltage regulator products |
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ABB to Build the World’s Most Advanced Robotics Factory in Shanghai (2018.10.29)
ABB announced a major, new US$150 million investment in Shanghai, China to build the world’s most advanced, automated and flexible robotics factory - a cutting-edge center where robots make robots. The new Kangqiao manufacturing center |
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New Alliance Memory High-Speed CMOS PSRAMs Offer 8Mb to 128Mb in 48/49-Ball FPBGA Packages (2018.10.25)
Alliance Memory introduced a new family of high-speed CMOS pseudo SRAMs (PSRAMs) with densities from 8Mb to 128Mb in 6.0 mm x 7.0 mm x 1.0 mm 48-ball FPBGA and 4.0 mm by 4.0 mm by 1.0 mm 49-ball FPBGA packages. The devices combine the most desirable features of SRAMs and DRAMs to provide designers with easy-to-use, low-power, and cost-effective memory solutions for wireless, automotive, networking, and industrial applications |
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Xiaomi's Smartphone Shipment to Exceed 100M Units by the End of October (2018.10.25)
Xiaomi Corporation today announced that the Group expects its shipment of smartphones to exceed 100 million units by the end of October, successfully reaching the full-year target set at its global core suppliers conference on 13 September, 2017 |
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AAEON Ｗins Two Taiwan Excellence Awards (2018.10.25)
TAIPEI, Taiwan –AAEON has received a pair of 2019 Taiwan Excellence Awards. The accolades recognize the “innovative value” of the BOXER-8120AI, an advanced box PC built for AI applications, and the AIOT-IP6801, a rugged IoT gateway device |
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Xin-Ye Gold Establishes World’s First Eco-Friendly Gold-Stripping Mass Production Facilities (2018.10.24)
From the standpoint of yields, the Philippines is currently the world’s biggest supplier of nickel ore, and it also a major country in the production of copper and gold. The overall export value of the mining industry is as high as US$4 billion, making the mining industry a source of major economic dependence |
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Broadcom Announces the World’s First xDSL CPE SoC with Integrated 802.11ax Wi-Fi 6 Technology (2018.10.24)
Broadcom today announced the availability of the industry’s first broadband SoC with integrated Wi-Fi 6 technology. The BCM63178 combines ADSL, 35b VDSL, and Wi-Fi 6 into a single integrated solution, enabling telecom service providers to effectively deploy copper services coupled with the benefits of 802 |
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Intepro’s Modular EV/HEV Battery Test System Utilizes Regenerative Technology (2018.10.24)
TIntepro Systems announces its advanced benchtop/rack mount Procyon Battery Test System for engineering design and production testing of high-performance electro mobility battery packs. The Procyon Battery Test System utilizes Intepro’s innovative bi-directional charge/discharge regenerative power stage that returns over 93 percent of the power back to the AC mains |
