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M31 Technology’s Diversified TSMC 28HPC+ ULL Memory Compilers (2018.10.02)
HSINCHU, Taiwan - M31 Technology today announced that it has developed a diversified TSMC 28HPC + Ultra-Low Power (ULL) Memory Compiler IP portfolio that provides customers with more flexibility in their SoC design.
“TSMC’s 28HPC+ ULL memory bit-cell provides further leakage reduction for mainstream smart phones |
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Micron and ATP to Collaborate on DDR2 Continuity Program (2018.10.01)
TAIPEI, Taiwan - Recognizing the importance of obsolescence mitigation in embedded and industrial systems, two of the biggest names in advanced storage, memory and semiconductor technologies have teamed up to ensure the continuous supply of legacy DDR2 memory modules in the market |
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Acer Unveils Self-driving Concept Car (2018.10.01)
TAIPEI, Taiwan - Acer unveiled its self-driving concept car at the Taiwan Automotive Technology Innovation Summit 2018, in collaboration with Yulon Group, one of Taiwan’s top automakers and its subsidiaries automotive electronics provider HAITEC and car brand Luxgen |
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Taiwanese Blockchain Startup ioeX Provides Solution to Decrease IoT Data Transfer Costs by 70% (2018.09.27)
TAIPEI, Taiwan - Taiwanese blockchain startup ioeX has released the ioeX agreement as a solution to reduce the high data transfer costs of software update and maintenance for IoT device manufacturers. “ioeX agreement – decentralized peer-to-peer networking” combines distributed node networking and blockchain technology to provide a network transfer consensus mechanism solution |
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China Forecast to Account for 90% of Pure-Play Foundry Market Growth in 2018 (2018.09.27)
IC Insights’ September Update to The McClean Report shows that as a result of a 51% forecasted increase in the China pure-play foundry market this year, China’s total share of the 2018 pure-play foundry market is expected to jump by five percentage points to 19%, exceeding the share held by the rest of the Asia-Pacific region |
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M31 MIPI M-PHY Certified with ASIL-B Safety Level of ISO 26262 (2018.09.27)
TAIWAN, Hsinchu – M31 Technology Corporation announced today that its MIPI M-PHY Gear3 IP has been certified with the ASIL B safety level of ISO 26262 and will be used by international first-class automotive electronics manufacturers to provide safe and reliable automotive SoC design |
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DRAM Products May Experience Steeper Price Decline of 5% QoQ in 4Q18, Says TrendForce (2018.09.26)
DRAMeXchange, a division of TrendForce, reports that DRAM suppliers have been negotiating with their clients over the 4Q18 contracts towards the end of September. Looking ahead to the next quarter, DRAMeXchange expects that the quotations of DRAM products to decline by 5% QoQ, higher than the previous forecast of 1~3% |
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NEC Launches A New Innovation Centre in Singapore (2018.09.26)
NEC today announced the opening of the NEC Open Innovation Centre (OIC) in Singapore, which forms a part of the wider NEC innovation eco-system, and reaffirms NEC's commitment to foster open innovation and partnerships with the private and public sectors |
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Sensors for Smart Technology Applications Reaching 8 Billion Units in 2020 (2018.09.26)
Sensors, microcontrollers, and wireless transducers are key factors in Smart Technology success. The overall market for sensors will exhibit a Compound Annual Growth Rate (CAGR) of 26.8% between 2014 and 2020, according to the Information Network |
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Toshiba Releases DC Brushed Motor Driver IC with Current Limiter Detection (2018.09.26)
Toshiba Electronic Devices & Storage Corporation launches an integrated dual H-bridge DC brushed motor driver IC that includes an output current limiter function rated at 50V / 3.0A. The new TB67H401FTG device can handle applications where monitoring and feedback of the motor state is necessary |
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Taiwan, USA, and Philippines Jointly Hold E-waste Recycling Management Network Conference (2018.09.26)
MANILA, Philippines - A trilateral cooperation between Taiwan, the United States, and the Philippines Department of Environment and Natural Resources held a five-day International E-waste Management Network Workshop from September 24 to 28 in Manila, the Philippines |
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Escalating Trade War May Aggravate Oversupply Situation in LED Industry, Says TrendForce (2018.09.25)
According to LED Industry Demand and Supply Data Base, the latest report by LEDinside, a division of TrendForce, the global LED industry is projected to reach a market value of US$ 18.796 billion in 2018, with an increase of 4% YoY, lower than LEDinside’s earlier forecast of 11% |
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Intel and Industry Partners Accelerate 5G in China (2018.09.25)
Today at the Intel 5G Network Summit in Beijing, China, Sandra Rivera, senior vice president of Intel’s Network Platforms Group, unveiled new developments across the 5G value chain alongside a powerful ecosystem of industry leaders, including Baidu, China Mobile, China Telecom, China Unicom, H3C, Huawei, Tencent, Unisoc and ZTE |
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Littelfuse Announces 1700V, 1 Ohm SiC MOSFET (2018.09.25)
Littelfuse introduced its first 1700V SiC MOSFET, the LSIC1MO170E1000, expanding its portfolio of SiC MOSFET devices. An important addition to the Littelfuse SiC MOSFET product offering, the LSIC1MO170E1000 is a powerful addition to the company’s 1200V SiC MOSFETs and Schottky diodes already released |
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Toshiba Launches Power Amplifier for Car Audio with Strong Resistance to Power Surges (2018.09.25)
Toshiba Electronic Devices & Storage Corporation has launched a new 4-channel power amplifier for car audio, "TCB503HQ” that delivers strong resistance to power surges. Sample shipments start today with mass production scheduled to begin in the first quarter of 2019 |
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Work Faster, Work Smarter, Work Safer with the BOXER-6405 Edge AI Smart Factory System (2018.09.25)
AAEON releases the BOXER-6405, an ultra-compact edge AI system for smart factory applications. Fitted with four USB3.0 ports and three COM ports, this versatile device can easily be connected to a range of factory equipment.
Measuring just 166mm x 106 |
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STMicroelectronics and Leti Develop GaN-on-Silicon Technology for Power Conversion Applications (2018.09.25)
STMicroelectronics and Leti, a research institute of CEA Tech, today announced their cooperation to industrialize GaN (Gallium Nitride)-on-Silicon technologies for power switching devices. This power GaN-on-Si technology will enable ST to address high-efficiency, high-power applications, including automotive on-board chargers for hybrid and electric vehicles, wireless charging, and servers |
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HOLTEK New BH66F5252 24-bit A/D MCU (2018.09.20)
Holtek announced the release of a new addition to its 24-bit Delta Sigma A/D Flash MCU range, the BH66F5252. The device has the advantage of excellent anti-RF interference, making it very suitable for 24-bit A/D measurement applications that operate in poor electrical environments |
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Imec Taiwan and ITRC-NARLabs to Collaborate on Advanced Imaging and Optics Applications (2018.09.20)
TAIPEI, Taiwan — Imec Taiwan, subsidiary of imec today announced that it has signed a memorandum of understanding with Taiwan’s Instrument Technology Research Center of National Applied Research Laboratories (ITRC-NARLabs) |
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NTU and Stanford Collaborate on Developing AI Medical Treatment (2018.09.20)
TAIPEI, Taiwan - Taiwan National University (NTU) and Stanford University have signed a Memorandum of Cooperation (MOU) to jointly promote medical treatment which utilizes Artificial Intelligence (AI) smart biotech.
The conference where the MOU between Taiwan and the United States was signed was actively oriented towards the development of applications which integrate medical treatment and big data |
USB2.0 is a Universal Serial Bus standard PC and peripheral equipment is widely used to get rid of the application areas limited to the PC in the past, and more in-depth applications in the digital consumer electronics products which.