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First congatec SMARC 2.0 Module with NXP i.MX8 Processor (2018.07.31)
congatec announces the conga-SMX8, the company's first SMARC 2.0 Computer-on-Module based on the 64-bit NXP i.MX8 multi-core ARM processor family. The ARM Cortex-A53/A72 based conga-SMX8 represents the new flagship module for ultra-low-power embedded computer designs, offering the recent best-in-class ARM processor with excellent performance, flexible graphics and numerous embedded features for all kind of IIoT applications |
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eMemory’s Reprogrammable eNVM Solution Available on TowerJazz BCD Platform (2018.07.31)
HSIHCHU, Taiwan – eMemory today announced its reprogrammable eNVM IP NeoMTP is qualified and now available for TowerJazz 0.18um BCD process, amid an increasing demand for the cost-effective memory solution from wireless charging and USB Type C customers |
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Sales Revenue of DRAM Modules for 2017 Recorded a Significant Growth of 69%, Says TrendForce (2018.07.30)
DRAMeXchange, a division of TrendForce, reports that the global sales revenue of DRAM modules for 2017 totaled US$11.7 billion, amounting to a significant growth of 69% compared with the result of the previous year. The high revenue is due to the nearly 50% YoY growth of DRAM ASP, although the contribution of the spot market to the total DRAM revenue is getting smaller |
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Toshiba Launches High Current Photorelays in DIP4 Package (2018.07.30)
Toshiba has launched two new high current photorelays that are fabricated using the latest U-MOS IX semiconductor process. Both devices are now shipping in production quantities.
The new “TLP3553A” and “TLP3555A” devices feature OFF-state output terminal voltage ratings of 30V and 60V, and ON-state continuous current ratings of 4A and 3A—higher than previous generation products |
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Bridgetek Helps Bring 3.5” HMI Display Shield Venture to Life (2018.07.30)
Bridgetek’s multi-award winning Embedded Video Engine (EVE) technology continues to gain traction within the global open source community, as well as with larger OEMs. The highly integrated graphics controller devices - which are able to take care of the display, touch and audio aspects of modern human machine interfaces (HMIs) - are featuring in a growing number of products being developed by small start-ups |
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ASE to Seize Opportunities in the Memory Market in China (2018.07.30)
TAIPEI, Taiwan - Taiwanese semiconductor testing and packaging company, ASE Technology Holding Co., Ltd. yesterday stated that they would increase the scale of their semiconductor development in Mainland China, and in addition to their factory in Fujian Province they would also be open to investment from Tsinghua Holdings to expand their production capacity |
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Edge Computing Will Drive the Growth of Micro Server and Server DRAM, Says TrendForce (2018.07.25)
DRAMeXchange, a division of TrendForce, estimates that x86-based solutions will continue to be the market mainstream in 2018, with a global shipment share of 97%. Intel and AMD will continue to lead the development of server. Particularly, in the sector of Internet Datacenter, solutions based on the x86 architecture will still dominate the market due to its wide product range |
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Toshiba Releases Compact Power MOSFET Gate Driver Intelligent Power Device (2018.07.25)
Toshiba Electronic Devices & Storage Corporation announces the availability of a new compact power MOSFET gate driver intelligent power device (IPD) for automotive 3-phase brushless motors. The device is intended for use in automotive motor drive applications, such as 12V electronic power steering (EPS), oil/ water pumps, fan motors and electric turbochargers |
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NVIDIA to Collaborate with DARPA to Develop Systems for Post-Moore’s Law Era (2018.07.25)
NVIDIA has been selected by the Defense Advanced Research Projects Agency (DARPA) to work with a team of university and industry researchers to enable near application-specific integrated circuit performance without sacrificing programmability for data-intensive algorithms |
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Intel to Collaborate with SiTime on MEMS Timing for 5G Modems (2018.07.25)
Intel and SiTime have announced that they will work together on robust, tiny and low-power microelectromechanical (MEMS) timing solutions for Intel’s 5G modem platforms.
SiTime’s MEMS solutions provide enhanced reliability and withstand environmental stressors |
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Intel looks to capitalize on future demand for IoTs and 5G, says GlobalData (2018.07.25)
Intel has been an integral part of telco networks seemingly since the beginning of time. However, changes in how networks are being built are creating new vulnerabilities for the American multinational tech giant as it looks to capitalize on future demand for Internet of Things (IoT) and 5G services, says GlobalData |
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Toshiba Unveils Industry's First SSDs Utilizing 96-Layer, 3D Flash Memory (2018.07.24)
Toshiba Memory Corporation today announced the launch of the industry’s first SSDs utilizing 96-layer, 3D flash memory. Sample shipments to OEM customers start today in limited quantities, and Toshiba Memory Corporation will gradually increase shipments from the fourth calendar quarter of 2018 |
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TSMC 7-nm Process Experiencing Heavy Market Demand (2018.07.24)
TAIPEI, Taiwan - Taiwan Semiconductor Manufacturing Company, Limited (TSMC) last Thursday at a legal briefing stated that their 7-nm chip process has already gone into mass production. They estimate that during the third quarter it will account for 10% of their revenue and then increase to account for 20% of their revenue in the fourth quarter |
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Toshiba Memory Starts Construction of the First Fabrication Facility in Kitakami City, Iwate Prefect (2018.07.24)
Toshiba Memory Corporation today held a groundbreaking ceremony for the first semiconductor fabrication facility (fab), called K1, in Kitakami, Iwate prefecture, in northeastern Japan. On its completion in autumn 2019, the facility will be one of the most advanced manufacturing operations in the world, dedicated to production of 3D flash memory |
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Cloud Service Providers to Put More Emphasis on Edge Computing, Says TrendForce (2018.07.23)
Cloud computing platforms have fueled the digital transformation of enterprises in recent years. Public cloud has been playing a key role during the process. While applications of IoT and AI grow increasingly popular, the ecosystem of cloud services and the integration of cloud and edge have emerged as weak points of the market, says TrendForce |
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NEC Provides Demo System Utilizing MEC to DOCOMO 5G Open Lab Yotsuya (2018.07.23)
NEC Corporation announced the provision of a demo system for intrusion detection solutions utilizing Multi-access Edge Computing (MEC), a network architecture concept for next-generation communications, to DOCOMO 5G Open Lab Yotsuya, a 5G technology verification center run by NTT DOCOMO, INC |
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Sony Releases Stacked CMOS Image Sensor for Smartphones with 48 Effective Megapixels (2018.07.23)
Sony Corporation today announced the upcoming release of the IMX586 stacked CMOS image sensor for smartphone cameras. The new sensor features 48 effective megapixels, the industry’s highest pixel count.
The new product achieved a world-first ultra-compact pixel size of 0 |
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Cloud-to-edge AI Chip Kunlun Repositions Baidu in AI Market, says GlobalData (2018.07.23)
Search engine giant Baidu has recently unveiled China’s first cloud-to-edge artificial intelligence (AI) chip—Kunlun—at Baidu Create 2018. The move repositions the company in not only the Chinese market but also globally, says GlobalData |
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Chinese Maintains Lead in Global Solar Investment (2018.07.19)
TAIPEI, Taiwan - The Photonics Industry & Technology Development Association (PIDA) yesterday pointed out that demand in the global solar energy market is continually increasing. In 2017 nearly 100GW of solar energy equipment was installed globally; however, the primary market is still in Mainland China |
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Long-Term Oversupply of Large TFT LCD Panels to Prompt Restructuring of Older Fabs, IHS Markit Says (2018.07.19)
Large thin-film transistor liquid crystal display (TFT LCD) panel makers are expected to reduce production of comparatively smaller sized 32-, 40- and 43-inch panels, helping to stabilize panel prices in the third quarter of 2018 |
The highly integrated chipset, but only in recent years happened, if the CPU is the brain of the computer, Chipsets can be regarded as the heart of the computer.