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AVX Reeleases Unique Three-Piece STRIPT Contact System for Linear LED & Coplanar PCB Connections (2018.07.12)
AVX Corporation developed a cost-effective, ultra-high-reliability, three-piece STRIPT contact system for linear LED and coplanar PCB connections in off-road vehicle lighting applications. Designed to absorb broad end-to-end mating tolerances |
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Siemens Assists Taoyuan City in Creating an Advanced Smart MRT System (2018.07.11)
TAIPEI, Taiwan - A construction team consisting of Siemens Limited Taiwan, Hyundai Rotem Company, and BES Engineering Corporation has successfully been awarded a contract for the Taoyuan MRT EMS System and will assist Taoyuan City Government in creating the most advanced smart MRT system in Taiwan |
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Industry Overshooting Capital Spending Needs for NAND Flash Memory (2018.07.11)
IC Insights compares the estimated required capex needed to increase NAND flash bit volume shipments 40% per year, sourced from a chart from Micron’s 2018 Analyst and Investor Event in May of this year, versus the annual capex targeting the NAND flash market segment using IC Insights’ data |
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New DLP Pico Controllers Enable Precision Light Control and High Image Quality (2018.07.11)
Texas Instruments (TI) announced new DLP Pico controllers that deliver advanced light control capabilities in smaller form factors for mass-market 3D scanners and 3D printers. DLPC347x controllers offer the micron-to-sub-millimeter resolution typically found in high-performance, industrial-grade applications in a smaller form factor for desktop 3D printers and portable 3D scanners |
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Synopsys and IMECAS Collaborate to Offer Silicon Photonics in China (2018.07.11)
Synopsys and the Institute of Microelectronics of Chinese Academy of Sciences (IMECAS) announced that a new, production-ready silicon photonics process design kit (PDK) based on IMECAS' 8-inch CMOS process is now available in the Synopsys PhoeniX OptoDesigner photonic integrated circuit (PIC) layout software |
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Samsung Electronics Starts Mass Production of Fifth-Generation V-NAND (2018.07.10)
Samsung Electronics announced that it has begun mass producing its fifth-generation V-NAND memory chips with the fastest data transfers now available. In the industry’s first use of the ‘Toggle DDR 4.0’ interface, the speed for transmitting data between storage and memory over Samsung’s new 256-gigabit (Gb) V-NAND has reached 1 |
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Siemens and Alibaba Cloud Partner to Power IIoT in China (2018.07.10)
Siemens and Alibaba Cloud, the cloud computing arm of Alibaba Group, signed a Memorandum of Understanding (MoU) today to partner to foster the industrial Internet of Things (IoT) in China.
The two companies will leverage each other’s technology and industry resources to build a unique IoT solution to support Industrie 4 |
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Toshiba Develops Low Reverse-Current Schottky Diode with Improved Thermal Performance (2018.07.10)
Toshiba Electronic Devices & Storage Corporation announces the launch of a new Schottky barrier diode product “CUHS10F60.” The device is targeted at applications such as rectification and backflow prevention in power supply circuits |
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All the Power of a Mini-ITX SBC on a 4” Board – the AAEON EPIC-KBS8 (2018.07.10)
AAEON releases the EPIC-KBS8, a powerful and expandable embedded controller purpose-built for retail and fintech applications.
The EPIC-KBS8 features a 6th/7th Generation Intel Core i socket-type processor and up to 16GB DDR4 SODIMM memory |
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NEC to Build the Bay to Bay Express Cable System (2018.07.09)
The Bay to Bay Express Cable System (BtoBE) consortium, composed of China Mobile International, Facebook and Amazon Web Services, signed an agreement with NEC Corporation to build a high performance submarine cable connecting Singapore, Hong Kong and the United States |
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Global Electric Vehicle Market Continues to Expand as Power Battery Prices Decrease, Says TrendForce (2018.07.09)
The global electric vehicle market continues to expand while the oil prices increase, power battery prices decrease, and countries have been proposing stricter CO2 emission targets for vehicles. EnergyTrend, a division of TrendForce, forecasts that the market share of electric vehicles will reach 5% in 2020 and 8~9% in 2023 |
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HOLTEK New HT68F2422 IR Driver MCU (2018.07.09)
Holtek announced the release of its new IR driver MCU, the HT68F2422, especially designed for use in IR remote controller and IR transmission related product applications. This new device includes an integrated high precision oscillation circuit with a frequency tolerance of ±0 |
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CTIMES Explores the Current State of Industry 4.0 in Taiwan (2018.07.09)
TAIPEI, Taiwan - CTIMES held the “Smart Manufacturing of Electronic Components Forum” in which specialists in related industries were invited to Industrial Technology Research Industry (ITRI) to share their thoughts and explain the current state of entering technology 4 |
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New Current Sense Transformers Now Available at Wurth Electronics Midcom (2018.07.05)
Wurth Electronics Midcom announced the release of additional Current Sense transformers to the MID-SNS family.
“These surface mount transformers are designed to operate between 50khz to 500khz and sense up to 40A of current |
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Unleash Maximum Airflow with Lian Li PC-011 Air Chassis (2018.07.05)
Lian Li Industrial announced its ultimate platform for cooling with the Lian Li PC-O11 Air high-airflow chassis. Bearing the same multi-chamber design as the PC-O11 Dynamic, the PC-O11 Air takes that design and maximizes it for the best amount of airflow and cooling ever |
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Toshiba Announces New Analog Output IC Photocoupler for Automotive Applications (2018.07.05)
Toshiba Electronic Devices & Storage Corporation announces the launch of a new analog output IC photocoupler that enables high-speed communications in automotive applications – especially electric vehicles (EV) and hybrid electric vehicles (HEV) |
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Trigence Introduces Full Digital Driver DN3013 for High-Res Audio (2018.07.04)
Trigence Semiconductor Inc., the revolutionary digital audio IC and solution provider, today introduced the latest full digital driver IC, DN3013, for high-resolution audio, suitable for USB powered headsets, wireless speakers, sound bars and headphones for personal computers |
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Chinese Suppliers May Start Selloff of Modules Due to the Oversupply, Says TrendForce (2018.07.04)
According to the latest research of EnergyTrend, a division of TrendForce, Chinese domestic solar market has been shirking after the release of new PV policy. Faced with the oversupply, Chinese module makers will seek ways to export the excessive products, or even sell off the products to overseas markets |
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Synopsys and Siemens Team Up to Expand and Extend Electronic Design Automation Collaboration (2018.07.04)
Synopsys and Siemens PLM Software today announced that they have agreed to collaborate on a wide range of electronic design automation (EDA) product interoperability projects for the benefit of their mutual customers. The collaboration spans a number of EDA domains from design to verification |
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Baidu to Integrate Mobileye’s Responsibility Sensitive Safety Model Into Apollo Program (2018.07.04)
Baidu today announced that it plans to work with Mobileye to integrate and commercially deploy Mobileye’s Responsibility Sensitive Safety (RSS) model in both the open source Project Apollo and commercial Apollo Pilot programs |
The ACPI specification enables the operating system, the central processing unit and peripheral equipment to integrate and exchange power usage message, simple and more effective co-management power.