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Attendance at MWC Shanghai 2018 Tops 60,000 Visitors (2018.07.02)
The GSMA today reported that more than 60,000 unique visitors1 from 112 countries and territories attended the 2018 GSMA Mobile World Congress Shanghai, held 27-29 June in Shanghai. In addition to this business-to-business audience |
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UNITED GRINDING Group Add a New Owner (2018.07.02)
The UNITED GRINDING Group, a leading machine tool manufacturer, announced that the company has a new owner. The new owner structure comprises a strategically aligned pool of investors organized by the Swiss BZ Bank Aktiengesellschaft |
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Microsoft and Chung Hua University Establish Taiwan’s First AI+ Experience Center (2018.07.02)
TAIPEI, Taiwan - Microsoft Taiwan announced that they have joined forces with Chung Hwa University to establish the first AI+ experience center in all of Taiwan, where they will set up context experiences for smart access, smart hotels, and smart retail |
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UMC Board Approves 100% Acquisition of MIFS Fab from Fujitsu (2018.07.02)
HSINCHU, Taiwan - United Microelectronics Corporation announced that its Board of Directors has approved for the company to fully acquire Mie Fujitsu Semiconductor Limited (MIFS), a 12-inch wafer foundry based in Mie, Japan, from Fujitsu Semiconductor Limited (Fujitsu Semiconductor) |
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Panasonic’s PLC Technology Approved as Baseline Specification by IEEE P1901.3 Working Group (2018.07.02)
Panasonic Corporation announced that it has presented its fourth-generation scalable HD-PLC technology to IEEE Standardization Working Group. This technology enables communications over longer distances and improves communication speeds by controlling the range of frequencies in use |
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UMC Acquires 100% Ownership of Mie Fujitsu Semiconductor (2018.07.02)
HSINCHU, Taiwan - Fujitsu Semiconductor and United Microelectronics Corporation ("UMC") announced that UMC will acquire all of the shares of Mie Fujitsu Semiconductor Limited (MIFS), a 300mm wafer foundry joint venture between both companies |
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Portwell Anniunces New COM Express 3.0 Evaluation Board with 10GbE Solutions (2018.06.28)
Portwell announces the launch of PCOM-C700, Type 7 COM Express carrier board in its COM Express portfolio. At a mere 304.8mm x 243.8mm (12˝ x 9.6˝), the carrier board-compliant PICMG COM Express 3.0 integrates the new Type 7 pinout type for a new generation design based on ATX form factor |
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Price Decline Will Continue in NAND Flash Market in 2H18, Says TrendForce (2018.06.28)
The growth momentum for 2H18 NAND Flash market is expected to be weak, according to the latest report of DRAMeXchange, a division of TrendForce. Coupled with continuous improvements in yield rate and output of 64/72-layer 3D NAND Flash, DRAMeXchange expects the market to approach a balance between supply and demand, the contract prices of NAND Flash products are expected to decline further |
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Xiaomi Launches Its Mi Laptop Air in Spain (2018.06.28)
Xiaomi, a Chinese brand for electronic products, released its Mi Laptop Air 13.3” at Palacio Neptuno in Madrid of Spain.
Mi Air 13.3” is a combination of light and performance. The laptop comes with all-metal body which merely weighs 1 |
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The Global Semiconductor Industry Reached $115.8 Billion in Q1 2018 (2018.06.28)
Global semiconductor industry revenue declined 3.4 percent in the first quarter of 2018 falling to $115.8 billion. Semiconductor industry performance was negatively affected by the declining sales and first-quarter seasonality in the wireless communications market |
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5G to Come with Its Own Problems to Indoor Coverage Challenge, Says GlobalData (2018.06.28)
The fourth-generation (4G) LTE mobile service has had trouble penetrating some indoor office environ-ments. Unfortunately, fifth-generation (5G) comes along with its own complications to this coverage chal-lenge, says GlobalData |
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Epistar to Divide Up Semiconductor Operations: Become Fully Devoted to Micro LED (2018.06.28)
TAIPEI, Taiwan - Taiwanese LED manufacturer Epistar Corporation announced that they will divide up their semiconductor OEM operations and establish a spin-off 100%-shareholding subsidiary: Jingcheng Semiconductor. Jingcheng Semiconductor will then be fully devoted to the rapid development of Mini LED and Micro LED |
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Samsung Brings Enhanced Color Accuracy and Sharpness to Mobile Photos With ISOCELL Plus Technology (2018.06.27)
Samsung Electronics today introduced its new 'ISOCELL Plus' technology, which allows CMOS image sensors to capture more light, significantly increasing light sensitivity and color fidelity. Smartphone consumers can now expect even more accurate and clearer photos in challenging light environments |
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Major TV Brands to Increase Panel Purchases by up to 15% QoQ in 3Q18, Says TrendForce (2018.06.26)
The stock up for the World Cup has come to an end in 1Q18, earlier than expected. The market grows weak in 2Q18 with no particular demand for TV panels. WitsView, a division of TrendForce, estimates that the major branded TV makers will reduce their panel purchases by 4% quarterly in 2Q18 |
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First 32-bit MCU to Feature Robust, Chip-level Security and Arm TrustZone Technology (2018.06.26)
With the booming growth of Internet of Things (IoT) endpoints, security is sometimes an afterthought for many designers, increasing the risk of exposing intellectual property (IP) and sensitive information. To address the growing need for security, the new SAM L10 and SAM L11 MCU families are now available from Microchip Technology |
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BIOSTAR Unveils M500 M.2 2280 PCI-Express NVMe SSD (2018.06.26)
BIOSTAR unveils its newest solid-state drive featuring 3D TLC NAND flash – the M500 M.2 PCIe NVMe SSD. The BIOSTAR M500 uses the compact M.2 2280 form factor that is compatible with latest-generation motherboards, laptops, and mini PCs |
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Demand for 3D Sensors Expected to Rise Thanks to ADAS, MIC Says (2018.06.26)
3D sensing technology mimics the human-visual system using optical technology, which allows products integrated with AI (Artificial Intelligence) and IoT (Internet of Things) technologies to have 3D computer vision, according to Taipei-based, government-backed IT research institute MIC (Market Intelligence & Consulting Institute) |
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HOLTEK New Higher Noise Immunity A/D Touch MCU BS86xxxC Series (2018.06.26)
Holtek announces the release of its new generation of Touch Key Flash MCU series with integrated 12-bit A/D converter, the BS86xxxC family. This new series includes the BS86C08C, BS86D12C and BS86E16C devices. One feature which sets this new device series apart from its predecessors is its comprehensive enhanced noisy immunity |
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3Q18 Contract Price Hike for Server DRAM Limited Due to Improved Supply, Says TrendForce (2018.06.25)
The shortfall in the supply of server DRAM may ease in the second half, as evidenced by the increasing average shipment fulfillment rate in the past several quarters, according to DRAMeXchange, a division of TrendForce.
As a result |
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Preparations for Mass Production of E Ink’s ACeP Technology to be Completed this Year (2018.06.25)
TAIPEI, Taiwan - E Ink at a shareholders’ meeting stated that they are continually investing in the research and development of products and technologies in order to to consolidate their global leading position in the e-paper market |
ITU's main job is to develop a wireless transmission equipment specification, winged communications, maritime communications, such as cell phones, satellite communication systems, wireless transmission equipment, such as radio and television,