Flusso Launches FLS122 Sensor Evaluation Kit (2022.11.01)
Flusso has launched the FLS122 flow sensor evaluation kit to help engineers quickly evaluate its new air velocity sensor…
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Digi-Key與QuickLogic建立全球合作關係 (2021.10.13)
Digi-Key Electronics 宣布與 QuickLogic Corporation 建立全球合作夥伴關係，將透過 Digi-Key 商城提供其低功率、多核心 MCU、FPGA 與嵌入式 FPGA、語音與感測器處理產品。 無廠房半…
HSINCHU, Taiwan - Faraday Technology announced support for the TCFD (Task Force on Climate-related Financial Disclosures…
HSINCHU, Taiwan – AUO announced that it will showcase its premium 3D surgical display solutions at the Healthcare Expo T…
Mitsubishi Electric announced today that on May 21 it will launch its MELFA ASSISTA series of robots that work collabora…
Samsung Introduces 1.2μm 50Mp ISOCELL GN1 with Faster Auto-focusing and Brighter Images (2020.05.19)
Samsung Electronics today introduced Samsung ISOCELL GN1, a new 50-megapixel (Mp) image sensor with large 1.2μm-sized pi…
Broadband Forum Finalizes Two new 5G Standards (2020.02.27)
Broadband Forum announced the development of two new standards and delivers on its promise to rapidly support the 3GPP r…
Panel Prices May Crash Below Cash Costs, Pressuring Panel Manufacturers in 2H, Says TrendForce (2019.07.01)
According to Witsview, a division of TrendForce, despite the relaxation of the US-China trade dispute in the wake of G20…
SiFive宣布與QuickLogic合作 發表快速晶片設計SoC樣版 (2019.05.09)
SiFive日前宣布推出Freedom Aware (FA) 系列之 SoC 樣板 ，以及與QuickLogic的策略開發合作。 Freedom Aware系列SoC樣板(SoC Template)擴展了SiFive的晶片設計能力，從根本上…
HSINCHU, Taiwan –TSMC today announced its 6-nanometer (N6) process, which provides a significant enhancement of its indu…
MediaTek Collaborates with Device Makers and RF Leaders to Stimulate 5G Smartphone Innovation (2019.02.25)
Today at MWC 2019, MediaTek announced its collaboration with 5G component suppliers and device makers to deliver a compl…
Intel and Micron announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah.…
Toshiba Launches 10-terabyte Enterprise Capacity HDD (2017.09.26)
Toshiba Electronic Devices & Storage Corporation announced the addition of an 10-terabyte (TB) SATA model to its MG06 se…
Intel Showcases Industry’s First 64-Layer 3D NAND for Data Center, Updates for 10nm in China (2017.09.19)
Intel delivered key updates at its Technology and Manufacturing Day held in Beijing, China, on Sept. 19. Disclosures inc…
PC Shipments Declined 4.3% in Q2 of 2017 (2017.07.13)
Worldwide PC shipments totaled 61.1 million units in the second quarter of 2017, a 4.3 percent decline from the second q…
Type-C 2017行情看漲 (2017.01.11)
USB Type-C是新世代傳輸介面，集正反插、視訊傳輸、數據傳輸和充電於一身，其成長十分快速，預計2017年將有大幅成長。…
The global NAND Flash industry will see an annual increase of just 6% in its total wafer capacity in 2017, according to …
Major U.S. chip maker Qualcomm has finally acquired Holland-based NXP Semiconductors for US$47 billion. As the recent tr…
IBM today announced that startup Grush is leveraging IBM Cloud’s cognitive capabilities for its interactive gaming tooth…
Silicon Labs introduced a comprehensive reference design that reduces the cost and complexity of developing cables and c…