TAIPEI, Taiwan — Taiwan Semiconductor Manufacturing Co. (TSMC) on April 7 announced the first UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology with Altera Co. that provides enhanced quality, reliability and integration for Altera’s MAX10 FPGA products.
According to an earlier report, the advantages of the technology include an extremely thin package height of less than 0.5mm (including solder ball), the packaging technology is aimed at applications where space is at a premium, such as sensor applications, small form-factor industrial equipment, and portable electronics.
“Altera’s work with TSMC has produced a very advanced and integrated packaging solution for MAX 10 devices,” said Bill Mazotti, Vice President of worldwide operations and engineering at Altera, in the press statement. “Leveraging this innovative technology to improve integration, quality and reliability makes MAX 10 FPGA products more versatile and useful for our customers.”
The announcement follows press reports at the end of March that Intel was in talks to acquire Altera, potentially weakening Altera’s relationship with TSMC.
TSMC emphasized that it has been collaborating with Altera for years, they work quite well in design, manufacturing, and packaging fields.
