Indium Corporation introduced Flip-Chip Flux NC-26-A product to semiconductor manufacture industry, which is a halogen-free, no-clean flip-chip dipping flux which is designed to leave a completely benign, clear residue. The reduction in residue optimizes underfill adhesion and decreases possible outgassing during underfill cure.
Flip-Chip Flux NC-26-A is intended to be used in a nitrogen reflow environment of 100ppm oxygen or less. Some applications can utilize this material in an air environment, although best results will be obtained in an inert atmosphere.
Flip-Chip Flux NC-26-A can be used on many surface finishes including immersion Ag, Cu, and AuNi. These surfaces can be soldered with SnPb or Pb-free alloys, but require nitrogen if reflow temperatures exceed 240°C.
It will have strong adhesion to epoxy-based underfill materials, especially epoxy-amine and epoxy-acid based chemistries, should also be suitable for use with many epoxy-anhydride systems.
Flip-Chip Flux NC-26-A is designed for no-clean applications. If necessary, the flux can be removed by using a commercially available flux cleaner. Please contact an Indium Corporation Technical Service Engineer for recommendations of cleaners to suit your process needs.
Features:
－ Designed for flip-chip dipping applications
－ Tackiness suitable for holding die during assembly
－ Bubble-free airless packaging
－ Ultra-low residue
－ Halogen-free
－ No-clean
