Microchip Technology today announced its next-generation Bluetooth Low Energy (LE) solutions. Qualified to the latest Bluetooth 4.2 standard, the IS1870 and IS1871 Bluetooth LE RF ICs, along with the BM70 module, expand Microchip’s existing Bluetooth portfolio and carry both worldwide regulatory and Bluetooth Special Interest Group (SIG) certifications.
Microchip’s new Bluetooth LE devices include an integrated, certified Bluetooth 4.2 firmware stack. Developers can expect up to 2.5 times faster data transfer speeds and greater connection security, with government-grade (FIPS-based) secure connection support. Data is sent and received over the Bluetooth link using Transparent UART mode, making it easy to integrate with any processor or the hundreds of Microchip’s PIC microcontrollers that have a UART interface. The module also supports standalone “hostless” operation for beacon applications.
The optimized power profile of these new devices minimizes current consumption for extended battery life, in compact form factors as small as 4x4 mm for the RF ICs and 15x12 mm for the module. The module options include RF regulatory certifications, or non-certified (unshielded/antenna-less) for smaller and more remote antenna designs that will undergo end-product emission certifications.
Microchip’s Bluetooth LE modules include all of the hardware, software and certifications that designers need. Developers can leverage Microchip’s Bluetooth Qualified Design ID (QDID) to easily list their products with the Bluetooth SIG. Embedded Bluetooth stack profiles include GAP, GATT, ATT, SMP and L2CAP, as well as proprietary services for Transparent UART. All modules are configurable using Microchip’s Windows OS-based tools.
