Advantech announced the release of its new COM Express Basic Module–the SOM-5991. Advantech SOM-5991, designed around the Intel Xeon Processor D-1500 family, is the world’s first COM Express powered by a server-grade processor that boasts up to 16-core scalability; with integrated 10GBase-KR, it provides high bandwidth interfaces for data transmission-reception, and all within a basic form-factor of 125 x 95 mm with a Type 6 compliant pin-out. The outstanding computing capability and low thermal design power deliver better power efficiency and make it very suitable for microservers, networking, and cloud storage.
The Intel Xeon processor D-1500 product family brings the performance and advanced intelligence of Intel Xeon processors into a dense, low-power system-on-a-chip. With enhanced reliability, availability, and serviceability features; platform storage extensions; and built-in hardware virtualization; the Intel Xeon processor D-1500 product family offers new options for optimizing a variety of workloads and infrastructure for midrange routers, network appliances, security appliances, wireless base stations, embedded midrange IoT devices, entry networking, midrange storage area networks (SANs), network attached storage (NAS) appliances, warm cloud storage, and more.
The SOM-5991 incorporates two 10GBase-KR interfaces, which should help fulfill the ever-increasing service application demands in the area of COM Express. Users can take advantage of SOM-5991's native 10GBase-KR interfaces to design in 10GbE carrier boards, and it becomeseasy that SOM-5991 and its development board are ready for customer as reference design.
Moreover, PCIe x16 and 8 PCIe x1 support Non-Transparent Bridge (NTB), which allows redundancy via PCIe. This helps reduce data loss, allowing a secondary system to take over PCIe storage devices once CPU failed, and provides high availability for applications providing continuous service.
SOM-5991 has four screw holes near the CPU, positioned in compliance with the IntelR standard thermal design guide. The thermal module is attached to the CPU using the design of balanced torque, and it is the first COM Express added a backplane to increase rigidity like single board, so the thermal module makes tight contact with the CPU and no board bending. This results in highly efficient heat dissipationwith resulting outstanding computing performance. Advantech also offers an SOM-5991-thermal-solution preassembly service that canmake system-level assembly attractively easy.
SOM-DB5900 is a new Type 6 compliant development board, which was created especially for server grade applications. To implement the remote management user scenario, a BMC controller is integrated on the carrier board, and it also supports graphics with a VGA interface, KVM redirection, storage redirection, IPMI2.0/1.1 though a dedicated NIC (Network Interface Controller) or shared NIC, SOL (serial-over-LAN), remote system BIOS update, etc.
