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North American Semiconductor Equipment Industry Posts $2.18B in Billings in August (2017.09.25) |
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North American Semiconductor Equipment Industry Posts $2.18B in Billings in August
North America-based manufacturers of semiconductor equipment posted $2.18 billion in billings worldwide in August 2017 (three-month average basis), according to the August Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI... |
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ASUS Announces ZenFone 4 Family in Europe (2017.09.22) |
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Today, in Rome, ASUS CEO Jerry Shen unveiled the ZenFone 4 smartphones — ZenFone 4 Pro with gigabit connectivity, ZenFone 4, ZenFone 4 Selfie Pro, ZenFone 4 Selfie and ZenFone 4 Max — during the We Love Photo press event. ZenFone 4 is the first family of smartphones to all feature dual rear or dual front cameras, enabling users to capture the best photos in any scenario, at any distance, and in any lighting conditions... |
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Mitsubishi Electric Develops SiC Power Device with Record Power Efficienc (2017.09.22) |
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Mitsubishi Electric Corporation announced that it has developed a silicon carbide (SiC) power device with what is believed to be the world’s highest power efficiency in a device of its type.
The newly-developed unit is designed to be installed in power modules, and does not require a high-speed protection circuit to interrupt supply when excess current is detected... |
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New Camera and Display Mirrors Enhance Vehicle Safety and Fuel Efficiency, IHS Markit Says (2017.09.21) |
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Rear-view and side-view mirrors on new vehicles will begin to see major changes over the next decade, according to new analysis from business information provider IHS Markit. Combining high-definition cameras and displays in place of – or to complement – traditional mirror designs offers a compelling case for automakers to improve on fuel efficiency and battery range... |
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APeJ 3D Printer Market Jumped to 106% Growth in 2016, IDC Says (2017.09.21) |
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The latest results from the Asia/Pacific (Excluding Japan) 3D Printer Forecast, 2017–2021 reveals 3D printer shipments in the Asia/Pacific excluding Japan (APeJ) grew by almost 106% in 2016 compared to 2015. China remains the major growth driver in the region after hitting 122% shipment growth rate in 2016... |
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Global SME Smart Phone OEMs to Experience Further Business Hardships (2017.09.20) |
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TAIPEI, Taiwan - According to the findings of a recent study conducted by IDC, during the second quarter of 2017, due to weakening market demand coupled with the postponement of new products, although the global smart phone industry's manufacturing output experienced a slight increase of 1... |
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GIS to Showcase Its Full-size Smart Touch Display Application at the Touch Taiwan (2017.09.20) |
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GIS announced today that the company will showcase its full-size smart touch display application at the Touch Taiwan, 2017 from September 20 to 22, including high screen to body ratio of curved, thin, narrower border and flexible smart phone, automotive and 3D curved lamination, large-size electronic whiteboard products, metal touch, and a number of advanced special application technology... |
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Intel Invests $1 Billion in the AI Ecosystem (2017.09.20) |
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Intel announced that it has invested in startups like Mighty AI, Data Robot and Lumiata through its Intel Capital portfolio and have invested more than $1 billion in companies that are helping to advance artificial intelligence... |
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AUO Presents World’s Largest 8K4K Bezel-less TV Display (2017.09.19) |
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HSINCHU, Taiwan – AU Optronics Corp. (AUO) announced today that it will participate in Touch Taiwan 2017 at Taipei Nangang Exhibition Center from September 20 to 22 to showcase a full lineup of advanced large-sized display technologies and products... |
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Intel Showcases Industry’s First 64-Layer 3D NAND for Data Center, Updates for 10nm in China (2017.09.19) |
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Intel delivered key updates at its Technology and Manufacturing Day held in Beijing, China, on Sept. 19. Disclosures included power and performance updates for Intel’s 10 nm process, high-level plans for Intel’s first 10 nm FPGA, and an announcement that the company is shipping the industry’s first commercially available 64-layer 3D NAND for data center applications... |
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Seagate and Baidu Sign Strategic Cooperation Agreement for Big Data Analysis (2017.09.18) |
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Seagate Technology plc today announced the signing of a strategic cooperation agreement with Baidu covering the fields of information technology, big data analysis and advanced storage system development and implementation.
The pact renews an existing agreement between the two firms signed in September 2014... |
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Telink Semiconductor to Demonstrate Its Smart Solutions at Bluetooth Asia 2017 in Shenzhen (2017.09.18) |
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Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for internet of things (IoT) applications, will be demonstrating a number of applications for smart lighting, smart home, retail and logistics based on its devices at the Bluetooth Asia 2017 conference taking place in Shenzhen, China on 26-27 September 2017... |
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