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. Microsemi Announces the Engineering Samples of its PolarFire FPGAs (2017.07.03)
  Microsemi Corporation, today announced its PolarFire field programmable gate array (FPGA) engineering samples (ES) are available for ordering. The PolarFire FPGA family provides the lowest power, cost-optimized mid-range devices spanning from 100K logic elements (LEs) to 500K LEs...
. Micro LED to Become Mainstream for Mobile Display Panels (2017.06.29)
  TAIPEI, Taiwan - Taiwan's Photonics Industry & Technology Development Association (PIDA) pointed out that because Micro LED display technologies led by Japanese manufacturers are gradually being used in small and medium-sized display panels, they will become another next generation mobile phone display panel solution other than AMOLED...
. Taiwanese Server Shipment Volume Expected to Grow 10% YoY in 2H (2017.06.29)
  Shipment volume of the Taiwanese server system industry at full system and /barebone and board levels is forecast to reach 2.11 million and 2.69 million units, respectively, in second half of 2017, growing 10% year-on-year, according to Taipei-based research institute MIC (Market Intelligence and Consulting Institute)...
. Winbond Introduces First Very-Low-Voltage Flash Memories (2017.06.29)
  TAICHUNG, Taiwan - Winbond Electronics Corporation today announced a dramatic expansion of its flash product portfolio with the introduction of its lowest-voltage SpiFlash memories to date. At 1.2 and 1.5V – the industry’s lowest NOR Flash voltages – and in 8-pin packages...
. Chinese TV Makers’ Panel Demand Expected to Raise in Q3 (2017.06.28)
  Panel demand from South Korean and Chinese TV makers is expected to pick up in the third quarter of 2017, after recording lower-than-planned panel purchases in the second quarter, according to IHS Markit. According to the latest report from IHS Markit...
. Toshiba Memory to Invest in Manufacturing Facilities for Fab 6 at Yokkaichi Operations (2017.06.28)
  Toshiba Corporation today announced that its board of directors, meeting today, has agreed upon a FY2017 investment program for its wholly owned subsidiary, Toshiba Memory Corporation (TMC), that will channel approximately 180 billion yen into Fab 6 at Yokkaichi Operations, TMC’s Flash memory facility...
. Seoul Semiconductor and Toshiba Materials Develop Natural Spectrum LED (2017.06.28)
  Seoul Semiconductor announced at a press conference in Frankfurt, Germany on June 26, 2017, the new SunLike Series natural spectrum LED technology was co-developed by Seoul Semiconductor and Toshiba Materials. The SunLike Series LED technology closely matches the spectrum of natural sunlight that human have enjoyed for thousands of years...
. Chinese ODMs Have Rapidly Risen to Prominence as Competition for Panel Supply Becomes Critical (2017.06.27)
  This year's top four LCD TV ODMs by their target shipments in order will be TCL, TPV, Foxconn and BOE Vision-Electronic Technology (BOEVT), according to the preliminary estimation by WitsView, a division of TrendForce. The fourth-place BOEVT in particular has emerged as a major pure ODM by taking advantage of the vast panel supply provided by its group company BOE Technology (BOE)...
. China Mobile and NTT DOCOMO Develop World's First Multi-Vendor eSIM System for IoT (2017.06.27)
  China Mobile Communications Corporation and NTT DOCOMO, INC. announced today that they have jointly developed the world's first multi-vendor embedded subscriber identity module (eSIM) system within their commercial environments based on the GSMA's Remote Provisioning Architecture for Embedded UICC3...
. ZF, HELLA, NVIDIA Partner to Increase Safety of Self-Driving Vehicles (2017.06.27)
  NVIDIA today announced it has formed a strategic partnership with ZF and HELLA to deliver AI technology with the New Car Assessment Program (NCAP) safety certification for the mass deployment of self-driving vehicles. The agreement is non-exclusive...
. Innolux and NEXT Biometrics Produce the World's First Thermal-Inductive Flexible Fingerprint Sensor (2017.06.27)
  TAIPEI, Taiwan - Taiwanese LCD manufacturer Innolux Corporation in cooperation with NEXT Biometrics ASA is producing the world's first thermal-inductive flexible fingerprint sensor in the third quarter of this year. With the increasing risk of security issues there has been a corresponding increase in demand for biometric identification technology...
. Overall ASP of DRAM Products to Go Up by 5% Sequentially in Q3, TrendForce Reports (2017.06.26)
  DRAMeXchange, a division of TrendForce, reports that DRAM suppliers are now negotiating with their clients over the third-quarter contracts during this latter half of June. As there is no easing of undersupply in the DRAM market, prices continue to climb...
. ITRI Hosts Symposium on Trends of AI Technologies and Applications (2017.06.26)
  TAIPEI, Taiwan - The Industrial Economics and Knowledge Center (IEK) of ITRI hosted a symposium on Trends of AI Technologies and Applications in Taipei on June 26, inviting AI experts from Stanford University and Silicon Valley to share their experiences on AI research and new business creation...
. Gaming Notebook PC Enjoys Booming Growth in China (2017.06.26)
  The market size for the global digital games market is approximately USD 99.4 billion in 2016, and is expected to exceed USD 100 billion in 2017, according to Taipei-based IT research institute MIC (Market Intelligence & Consulting Institute)...
. Prices of NOR Flash Products to Go Up by 20% Sequentially for Q3, TrendForce Says (2017.06.22)
  Increasing demand for AMOLED panels from smartphone brands and the rising production of ICs for Touch with Display Driver Integration (TDDI) has propelled the growth of the NOR Flash market in the recent period, according to DRAMeXchange, a division of TrendForce...
. Cellphone IC Sales Will Top Total Personal Computing in 2017 (2017.06.22)
  The ongoing slump in shipments of standard personal computers along with the drop-off in tablets are setting the stage for cellphone IC sales to finally surpass integrated circuit revenues in total personal computing systems this year, based on new forecasts in the recently released update of IC Insights’ 2017 IC Market Drivers Report...
. Samsung Begins Mass Production of First Exynos-branded IoT Solution (2017.06.22)
  Samsung Electronics today announced the start of mass production of its first Exynos-branded Internet of Things (IoT) solution, the Exynos i T200. Built on a low-power 28-nanometer (nm) High-K Metal Gate (HKMG) process and featuring high processing capabilities along with Wi-Fi connectivity, the Exynos i T200 is an optimum IoT solution to deliver the performance needed for upcoming IoT use cases...
. Powerchip Reboots NOR Flash Production Capacity (2017.06.21)
  TAIPEI, Taiwan - Taiwanese IC foundry Powerchip Technology Corporation yesterday announced that they are reestablishing their NOR Flash memory production capacity in order to provide their flagship customers with NOR Flash memory manufacturing and alleviate the current problem of tight supply and demand...
. Sprint and Samsung Test Massive MIMO Technology in South Korea (2017.06.21)
  On the streets of Suwon, South Korea, Sprint and Samsung Electronics America, Inc. recently tested Massive MIMO (multiple input, multiple output) on 2.5 GHz spectrum. The Massive MIMO test represented a real-world application of the new technology, slated to help Sprint dramatically boost LTE Plus wireless capacity and coverage, and offer Gigabit LTE service to its customers...
. Acer Board Appoints Jason Chen as Chairman (2017.06.21)
  TAIPEI, Taiwan - Acer today announces the appointment of Jason Chen as Chairman in addition to his continuing role as CEO. With his appointment, George Huang steps down from the chairmanship but remains on the Board. The changes were approved by the newly elected Board of Directors which convened after the annual shareholders’ meeting earlier today, and take immediate effect...
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