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. AOPEN Partners With Intel To Unveil Visual Data Reference Design Device (2017.02.09)
  AOPEN announced its Intel Xeon processor-based DE7400XE Visual Data Reference digital engine. This collaboration and partnership with Intel defines standard ways of consolidating workload of IoT applications and brings greater capabilities to the edge between cloud and client architecture...
. Almost 3 Million Drones Will Be Shipped in 2017 (2017.02.09)
  Production of drones for personal and commercial use is growing rapidly, with global market revenue expected to increase 34 percent to reach more than $6 billion in 2017 and grow to more than $11.2 billion by 2020, according to a new forecast from Gartner, Inc...
. Toshiba Starts Construction of Fab 6 and Memory R&D Center at Yokkaichi, Japan (2017.02.09)
  Toshiba Corporation today announced that it has started construction of a new state-of-the-art semiconductor fabrication facility, Fab 6, and a new R&D center, the Memory R&D Center, at Yokkaichi Operations in Mie prefecture, Japan, the company’s main memory production base...
. Winbond's 3x-nm DRAM to Begin Mass Deliveries in Q3 2017 (2017.02.08)
  TAIPEI, Taiwan - Taiwanese memory manufacturer Winbond yesterday at a corporate briefing session announced that Windbond has completed client authentication for 3x nanometer DRAM that they developed themselves, and they expect to begin mass deliveries in the third quarter of this year...
. AMOLED Production Equipment Purchases to Reach Record High in 2017 (2017.02.08)
  The flat-panel display (FPD) industry is in the midst of a historic wave of building new factories to manufacture active matrix organic light emitting diode (AMOLED) displays. This will drive $9.5 billion worth of AMOLED-specific production equipment purchases in 2017, according to IHS Markit...
. Imec, Holst Centre and Cartamundi Introduce Plastic NFC Tag Communicating with Smartphones (2017.02.08)
  Today, at the 2017 International Solid-State Circuits Conference in San Francisco, imec and Holst Centre and Cartamundi demonstrate a world first thin-film tag on plastic, compatible with the near field communication (NFC) Barcode protocol, a subset of ISO14443-A, which is available as standard in many commercial smartphones...
. eMemory Qualified NeoFuse in TSMC 16FFC Process (2017.02.08)
  HSINCHU, Taiwan – Taiwanese NVM IP provider eMemory announces the availability of NeoFuse technology, qualified in TSMC’s 16nm FinFET Compact (16FFC) process. Customers have already embedded the NeoFuse IP for product tape-out...
. 8.4 Billion Connected "Things" Will Be in Use in 2017 (2017.02.07)
  Gartner, Inc. forecasts that 8.4 billion connected things will be in use worldwide in 2017, up 31 percent from 2016, and will reach 20.4 billion by 2020. Total spending on endpoints and services will reach almost $2 trillion in 2017...
. POCT Market to Expand Rapidly at a CAGR of 9.7% From 2015 to 2020, TrendForce Reports (2017.02.07)
  The aging of the world's population has led to steady annual increases in the number of patients suffering chronic diseases. With demand for long-term care of chronic diseases on the rise, the point-of-care testing (POCT) market has also experienced a boom...
. Sony Develops 3-Layer Stacked CMOS Image Sensor with DRAM for Smartphones (2017.02.07)
  Sony Corporation today announced the development of the industry's first 3-layer stacked CMOS image sensor with DRAM for smartphones. The new image sensor consists of a DRAM layer added to the conventional 2-layer stacked CMOS image sensor with a layer of back-illuminated structure pixels and a chip affixed with mounted circuits for signal processing...
. Panasonic, UMC to Develop Mass Production Process for New ReRAM (2017.02.06)
  Panasonic Semiconductor Solutions has reached an agreement with United Microelectronics Corporation (UMC) on the joint development of mass production process for next generation 40nm ReRAM. The agreed cooperative project will enable the integration of 40nm ReRAM process technologies developed by PSCS with UMC's high-reliability CMOS process technologies...
. OPPO, Huawei, and vivo Lead Other Smartphone Brands in China in 2016 (2017.02.06)
  According to IDC, the smartphone market in China saw a 19% YoY growth and 17% QoQ growth in 2016Q4. For the full year of 2016, the market grew by 9% with top Chinese smartphone vendors taking up a larger share of the market. The 4 Chinese vendors in the top five were the same in 2015, and their share grew from 46% in 2015 to 57% in 2016...
. COMPUTEX's InnoVEX 2017 to Focus on AI and IoT (2017.02.06)
  TAIPEI, Taiwan- Taipei Computer Association (TCA), one of organizers of COMPUTEX, said that the InnoVEX 2017 startup exhibition will start from May 30 to June 1 at COMPUTEX at the Taipei World Trade Center (TWTC) for a period of three days...
. In-store Shopping Is Still Mainstream for Buying Apparel in APAC, YouGov Says (2017.02.06)
  For consumers across the Asia Pacific, shopping in-store is still the dominant means of purchasing apparel; more than three-quarters of those polled (79%) have shopped in-store in the past year. Shopping in-store is particularly prevalent for shoppers in Hong Kong, Australia, and Malaysia, where 88%, 85% and 84% have done so, according to YouGov...
. Qualcomm and TDK Announce Launch of Joint Venture (2017.02.06)
  Qualcomm Incorporated and TDK Corporation announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings). The joint venture will enable Qualcomm’s RFFE Business Unit to deliver RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments...
. LCD TV Shipments Grew 1.6% Annually in 2016 (2017.02.02)
  Global shipments of LCD TV sets for 2016 increased 1.6% annually to reach 219.2 million units, according to WitsView, a division of TrendForce. Shipment growth was attributed to the strong sales in North America’s distribution channels during the busy season, the increasing affordability of large-size TVs and the robust housing market in China...
. GUC Unveils SSD ASIC Capabilities targeting TSMC 28nm Process Technologies (2017.02.02)
  HSINCHU, Taiwan - Global Unichip Corp. (GUC) today rolled out its complete portfolio of solid state drive (SSD) ASIC capabilities. The company's SSD solution covers application-specific front end design capabilities, advanced node design flow experience, robust manufacturing management, and a production-proven IP set targeting TSMC 28HPC+ process technologies...
. Samsung and Apple Continued to as Top Semiconductor Customers in 2016, Gartner Says (2017.02.02)
  Samsung Electronics and Apple remained the top two semiconductor chip buyers in 2016, representing 18.2 percent of the total worldwide market, according to Gartner, Inc. Samsung and Apple together consumed $61.7 billion of semiconductors in 2016, an increase of $0...
. JGC, NEC Cooperate in the Data Analysis Services for Plant Operations Using AI and IoT (2017.02.02)
  JGC Corporation and NEC Corporation today announced their cooperation in the provision of data analysis services for plant operations using AI (Artificial Intelligence) and IoT (Internet of Things) technologies. The data analysis services for plant operations provided jointly by JGC and NEC analyze a broader scope of operating data...
. China’s Role in Supply Chains Continues to Grow (2017.02.01)
  Commodity prices, supplier viability, and geopolitical concerns top the list of risks sourcing professionals face in 2017, according to survey from IHS Markit. And IHS Markit indicate that support for China as a low-cost sourcing destination is waning...
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