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HTC’s A9, a Good Alternative or bad Copy to the iPhone? (2015.10.21) |
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TAIPEI, Taiwan — HTC wants to be successful again, Cher Wang, CEO of HTC, HTC’s CEO, has notably stepped up to the plate by telling her employees that the One A9 would be a good alternative to the iPhone 6, citing that it “strikes a balance between beauty, performance and simplicity... |
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HTC’s One A9 Smartphone in the Limelight (2015.10.21) |
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TAIPEI, Taiwan — The struggling HTC staged a press conference in Taipei on October 21 in a bid to promote it’s latest flagship HTC One A9. The company said that the A9 would be a good alternative to the iPhone, citing that it “strikes a balance between beauty, performance and simplicity... |
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Indium’s Hisert Explains How to Select the Proper Solder Preform (2015.10.21) |
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Indium Corporation announces the release of its newest informational video that guides the audience on the proper steps for selecting a solder preform. This brief video features Indium Corporation’s Jim Hisert, Manufacturing Engineer, and SMT expert Phil Zarrow, President and Principal Consultant for ITM Consulting, discussing the process of selecting the appropriate solder preform for various applications... |
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SEMI: Silicon Shipment Volumes Contine to Grow By 2017 (2015.10.21) |
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TAIPEI, Taiwan - SEMI forecasted that total wafer shipments this year are expected to exceed the market high set in 2014 and are forecast to continue shipping at record levels in 2016 and 2017.
SEMI recently completed its annual silicon shipment forecast for the semiconductor industry... |
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Toshiba, SanDisk Start Equipment Installation at Yokkaichi's New Fab 2 (2015.10.21) |
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Toshiba Corporation and SanDisk Corporation today announced the start of equipment installation in the New Fab 2 facility at Yokkaichi Operations. New Fab 2 is primarily intended to provide the clean room space necessary to transition a significant portion of the current Yokkaichi 2D NAND capacity to 3D flash memory... |
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Intel to Expand Production of 3D NAND in Dalian China (2015.10.21) |
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Intel announced plans to increase its investment in non-volatile memory technology to better serve customer needs and keep pace with the strong demand for Intel Solid State Drive solutions.
Projecting the SSD technology will become a main driving force of Intel’s core computing business, and a key part of Intel’s strategy to be a foundational supplier of the infrastructure that powers the smart, connected world... |
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Micron Announces New NOR Flash memory, Winbond Licensed First (2015.10.20) |
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Micron Technology today announced XTRMFlash memory, a faster NOR flash solution designed to revolutionize the way the electronics industry develops systems to meet the demand for "instant-on" performance and fast system responsiveness in automotive, industrial and consumer applications... |
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UL Establishes PCB Performance Testing services Lab in Taiwan (2015.10.20) |
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TAIPEI, Taiwan － UL today offically opened its printed circuit board performance testing services laboratory in Taipei. With the UL746 and UL796 safety certification, UL is going to provide a more complete product specification testing and inspection services for the local printed circuit board firms... |
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China and AMD Form Chips Assembly & Testing Joint Venture (2015.10.20) |
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TAIPEI, Taiwan － Chinese Nantong Fujitsu Microelectronics Co., Ltd. announced the acquisition of two Advanced Micro Devices（AMD）foundries located in Suzhou and Penang, Malaysia, paying for $370 million. They will finish the transaction in the first half of 2016 and create a joint venture of semiconductor assembly and test... |
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Mentor Graphics Veloce VirtuaLAB Adds Next-Generation Protocols (2015.10.20) |
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CALIFORNIA, USA — Mentor Graphics Corp., on Octorber 19 announced the Veloce VirtuaLAB Ethernet environment with support for 25G, 50G and 100G Ethernet. This support enables highly efficient, emulation-based verification for the massive Ethernet-based designs being created today... |
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200mm Wafer Fab Capacity Forecast to 5.4 Million wspm in 2018 (2015.10.20) |
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According to a lastest report, from SEMI, worldwide 200mm semiconductor wafer fab capacity is forecast at 5.2 million wafer starts per month (wspm) in 2015 and expanding to 5.4 million wspm in 2018.
Based on the rapidly increasing number of internet-enabled mobile devices and the emergence of the IoT (Internet of Things), demand for sensors, MEMS, analog, power and related semiconductor devices is growing... |
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TSMC: Fabless Inventory May Back to Seasonal Level in This Year (2015.10.20) |
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TAIPEI, Taiwan － Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) at an investor update announced that although global semiconductor inventory reserves in the third quarter remained higher than normal for about 10 days and the market is still digesting the inventory, it is possible that they will return to normal levels at the end of the year... |
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Groundbreaking for Powerchip 12-inch Fab In China Tomorrow (2015.10.19) |
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TAIPEI, Taiwan － Powerchip Technology Corporation and Hefei City government of Anhui Provence have sealed a joint venture to Jinghe IC 12-inch Fab, which is going to start building tomorrow and likely kick off massive production in 2017... |
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Taiwan D-School Opens to Educate Innovative Talents (2015.10.19) |
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TAIPEI, Taiwan － D-School, a new educational institution of National Taiwan University, last week was officially opened. The new institution will set up innovations related courses to educate Taiwan students to have the professional abilities of cooperation and implement... |
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ITU Approves Standards for Advanced Audio Broadcasting Technology (2015.10.19) |
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ITU membership unanimously approved open standards, Recommendation ITU-R BS.2088-0, aimed at delivering advanced sound for broadcasting services that will create a listening experience that is closer to real life.
The new global standards will facilitate the production and exchange of advanced audio files by allowing a single file to carry a complete audio programme containing audio samples as well as metadata for any combination of object... |
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