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92 IC Wafer Fabs Closed or Repurposed From 2009-2017 (2018.03.02) |
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Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. The spree of merger and acquisition activity and the migration to producing IC devices using sub-20nm process technology has also led suppliers to eliminate inefficient wafer fabs... |
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Foxconn Returns to the First Place of TV OEM (2018.03.02) |
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TAIPEI, Taiwan - According to a survey conducted by Chinese market research institute Sigmaintell, in January 2018, the thirteen largest global television OEM manufacturers shipped out 8.02 million units, which was a yearly increase of 68... |
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Intel Introduces ‘Intel AI: In Production’ Program with AAEON (2018.03.01) |
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Intel unveiled “Intel AI: In Production,” a new program that makes it easier for developers to bring their artificial intelligence prototypes to market. Since its introduction last July, the Intel Movidius Neural Compute Stick (NCS) has gained a developer base in the tens of thousands... |
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Mobile DRAM Revenues Grow Slower in 1Q18, Says TrendForce (2018.02.26) |
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Global mobile DRAM revenue hit a new high of US$8 billion in 4Q17, a robust sequential growth of 23.6%, says DRAMeXchange, a division of TrendForce. In 4Q17, the major suppliers raised their prices by 10-15% on average, driven by expected strong demand from the smartphone market during the traditional busy season, and continuing brisk demands from North American datacenters... |
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NEC and KT demonstrate 5G potential in PyeongChang (2018.02.26) |
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NEC today announced the successful conclusion of demonstration tests of safety-related services for the 5G era in PyeongChang together with KT Corporation (KT), a leading South Korea-based communications carrier. This initiative was carried out in February 2018 based on an agreement concluded by the two companies in August 2015 to collaborate in the field of 5G networks... |
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Samsung Announces New 3-Stack ISOCELL Image Sensor with Integrated DRAM (2018.02.26) |
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Samsung Electronics today introduced the newest addition to its ISOCELL image sensor family, the 3-stack ISOCELL Fast 2L3. The 1.4-micrometer (μm) 12-megapixel (Mp) image sensor with integrated dynamic random access memory (DRAM) delivers fast data readout speeds to capture both rapid movements in super-slow motion and sharper still photographs with less noise and distortion... |
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MediaTek Joins ONNX Along with Facebook, Microsoft and Amazon to Promote AI Technologies (2018.02.26) |
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TAIPEI, Taiwan - MediaTek announced that they have joined “Open Neural Network Exchange (ONNX) to promote Artificial Intelligence (AI) technological innovation and the development of terminal AI platforms.
ONNX was jointly created by Amazon, Facebook, and Microsoft, all of which have shifted in the direction of creating interoperability standards for different frameworks of deep learning models... |
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Samsung Electronics Breaks Ground on New EUV Line in Hwaseong (2018.02.26) |
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Samsung Electronics announced that it broke ground on a new EUV (extreme ultraviolet) line in Hwaseong, Korea, aiming to maintain its leadership in state-of-the-art semiconductor technology.
With this new EUV line, Samsung will be able to strengthen its leadership in the single nanometer process technology by responding to market demand from various applications... |
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AAEON to Present Its AI Edge Technology at Embedded World 2018 (2018.02.23) |
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AAEON will be taking part at this year’s Embedded World trade fair in Nuremburg, Germany.
The fair, which is now in its 16th year, is widely regarded as being one of the world’s most important embedded systems events. As part of its involvement at Embedded World, AAEON will showcase a number of products including Box and Panel PCs, a range of motherboards, and the UP Squared industrial innovators’ board... |
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Intel and Unigroup Spreadtrum & RDA Announce 5G Strategic Collaboration (2018.02.23) |
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As a core subsidiary of Tsinghua Unigroup, Unigroup Spreadtrum & RDA, and Intel Corporation officially announced a long-term strategic collaboration on 5G. The companies plan to develop a 5G smartphone platform for the China market that will feature an Intel 5G modem and will be targeted to coincide with 5G network deployments in 2019... |
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Fingerprint Cards Launches The Third-generation Fingerprint Sensor (2018.02.22) |
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Fingerprint Cards Launches FPC1291, the first commercial third-generation fingerprint sensor.
The new FPC1291 is a single-chip, single-die solution, removing the need for a companion chip while maintaining and even exceeding the performance benefits of the dual-chip solution... |
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Toshiba Machine's New THE400 SCARA Robot Launches in Chinese Market (2018.02.22) |
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Toshiba Machine has launched sales of its new THE400 (arm length: 400 mm) for the Chinese market. The THE400 model is a THL series SCARA robot combining high cost performance with easy operation.
For more than 30 years, Toshiba Machine has provided industrial robots in a wide range of variations being used by numerous customers around the world... |
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Clientron to Present Its POS Innovation at EuroCIS 2018 (2018.02.22) |
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TAIPEI, Taiwan - Clientron will display its latest POS solutions for the retail market at the world’s leading retail show, EuroCIS 2018, from February 27 to March 1, 2018 in Dusseldorf, Germany. At its Booth (Hall 10, Booth E73), Clientron will introduce its innovative POS terminals and various built-in POS peripherals available on the market today in order to meet the demands of omnicommerce experience... |
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AAEON Launches Its eShop, a New Online Store (2018.02.22) |
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AAEON announced the launch of its online store, the AAEON eShop – https://eshop.aaeon.com/.
The website is targeted towards customers who want to buy and quickly take delivery of products for testing purposes. AAEON is therefore committed to shipping any eShop order for five units or fewer within three to five working days... |
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Integrated Circuit Technology Advances Continue to Amaze (2018.02.22) |
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The success and proliferation of integrated circuits has largely hinged on the ability of IC manufacturers to continue offering more performance and functionality for the money. Driving down the cost of ICs (on a per-function or per-performance basis) is inescapably tied to a growing arsenal of technologies and wafer-fab manufacturing disciplines as mainstream CMOS processes reach their theoretical, practical, and economic limits... |
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Hon Hai to Develop Big Data, AI, and the IIoT in the Next Three Years (2018.02.21) |
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TAIPEI, Taipei - Foxconn Chairman Terry Guo recently stated at a Valentine's Day event that from this year to 2020, the Hon Hai Group will move in the direction of big data, artificial intelligence, and the industrial Internet as the foundations of their manufacturing industries... |
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Seoul Semiconductor Successfully Invalidates Everlight’s Patent in the United Kingdom (2018.02.21) |
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On February 20, 2018, Seoul Semiconductor announced that Seoul has won the patent invalidity litigation action that was filed against Everlight Electronics Co., Ltd. (Everlight) in the United Kingdom.
Everlight’s patent, EP (UK) 1169735, which was invalidated as a result of Seoul’s suit, relates to an LED package structure for thermal dissipation... |
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