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SEMI Data Projects New Highs in Fab Equipment Spending; Samsung to Increase 128% (2018.01.03) |
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The year-end update to the SEMI World Fab Forecast report reveals 2017 spending on fab equipment investments will reach an all-time high of $57 billion. High chip demand, strong pricing for memory, and fierce competition are driving the high-level of fab investments, with many companies investing at previously unseen levels for new fab construction and fab equipment... |
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The Top 10 Key ICT Trends to Observe in 2018 (2018.01.02) |
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TAIPEI, Taiwan - While the ICT industry will move towards new aspects of intelligence, openness, service, and integration, 10 key trends are to reshape the landscape of the industry in 2018, according to Taipei-based and government-backed IT research institute MIC (Market Intelligence & Consulting Institute)... |
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ATOUN to Launch New Power Assist Suits with 40% Weight Reduction for the Hip, Suitable for Caregivin (2017.12.29) |
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In April 2018, ATOUN Inc. will begin selling the all new Power Assist Suit for the hip "ATOUN MODEL Y," which is 40% lighter in weight than the current model.
ATOUN developed the new "ATOUN MODEL Y" by reexamining the design and control from scratch based on user feedback of the current model, and also successfully reduced weight by 40% by replacing the metal frame with one made of resin, and making the motors and batteries more compact... |
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SEGA Entertainment and Acer’s StarVR Introduce Premium VR Arcade Experiences to Japan (2017.12.22) |
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SEGA Entertainment and premium Virtual Reality (VR) solutions provider StarVR today announced its collaboration to bring StarVR arcade experiences to existing SEGA Game Center locations throughout Japan.
StarVR will work with SEGA Entertainment to roll out its industry-leading headset and VR arcade experiences across the country, at three SEGA arcade locations by March 2018 and at more than ten locations by the end of the year... |
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China’s JHICC, Innotron Memory and Tsinghua Unigroup Emerge As Major Domestic Suppliers (2017.12.21) |
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TrendForce’s latest report outlines the landscape of China’s dynamic and fast-growing semiconductor industry, and reveals that the memory segment will be a focus for the industry, considering that China now heavily relies on imported semiconductor components, and that semiconductor is a sensitive sector which may have potential applications in national security... |
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Global Mobile Industry Ready to Start Full-Scale Development of 5G NR (2017.12.21) |
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Today the 3GPP TSG RAN Plenary Meeting in Lisbon successfully completed the first implementable 5G NR specification. AT&T, BT, China Mobile, China Telecom, China Unicom, Deutsche Telekom, Ericsson, Fujitsu, Huawei, Intel, KT Corporation, LG Electronics, LG Uplus, MediaTek, NEC, Nokia, NTT DOCOMO, Orange, Qualcomm Technologies, Inc... |
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Broadcom Announces Industry’s First Silicon-Proven 7nm IP for ASICs in Deep Learning and Networking (2017.12.21) |
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Broadcom today announced the industry’s first silicon-proven 7nm intellectual property (IP) for an ASIC platform targeting deep learning and networking applications. Based on TSMC 7nm process technology, the platform offers best-in-class IP cores which include high speed SerDes, HBM PHY, Die2Die PHY, mixed-signal IP, and foundation IP such as standard cells, SRAM, TCAM memory, and I/O cells... |
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UMC Announces Availability of 40nm SST Embedded Flash Process, Toshiba Expected to Utilize (2017.12.21) |
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HSINCHU, Taiwan - United Microelectronics Corporation today announced the availability of the company’s 40nm process platform that incorporates Silicon Storage Technology’s (SST) embedded SuperFlash non-volatile memory. The newly available 40nm SST process features a 20% reduction in eFlash cell size and 20-30% macro area over UMC’s mass production 55nm SST technology... |
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Samsung Mass Producing Industry’s First 2nd-Gen, 10-Nanometer Class DRAM (2017.12.20) |
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Samsung Electronics announced today that it has begun mass producing the industry’s first 2nd-generation of 10-nanometer class (1y-nm), 8-gigabit (Gb) DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions... |
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TrendForce Expects LED Chip Market to Achieve Supply-Demand Balance in 2018 (2017.12.20) |
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Major Chinese LED chip suppliers including San’an Optoelectronics and HC SemiTek have lowered their product prices recently, indicating the end of LED chip price hike that had lasted for one and a half year. According to LEDinside, a division of TrendForce, the recent price drop signals the end of LED chip undersupply, and the next year will witness a balance in LED chip supply and demand... |
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Allion Labs Establishes IoT Innovation Center in Nantou, Taiwan (2017.12.20) |
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NANTOU, Taiwan - Standard certification and testing company Allion Labs Inc. formally opened an “IoT Innovation Center” in Zhongxing New Village, Nantou which will provide comprehensive IoT testing and certification and assist manufacturers in understanding usage scenarios in the future IoT era... |
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X-FAB Introduces New Low-Power eFlash Block for Energy Harvesting & IoT Devices (2017.12.19) |
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X-FAB today announced the availability of two new Non-Volatile Memory (NVM) IP solutions - a low power embedded Flash (eFlash) IP block and a NVRAM compiler. Both are based on the company’s proprietary 180 nm XH018 mixed-signal CMOS technology and are targeted at applications requiring high reliability and field re-programmability while operating at low power and in harsh environments... |
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Intel Unveils Industry’s First FPGA Integrated with HBM2 (2017.12.19) |
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Intel today announced the availability of the Intel Stratix 10 MX FPGA, the industry’s first field programmable gate array (FPGA) with integrated High Bandwidth Memory DRAM (HBM2).
By integrating the FPGA and the HBM2, Intel Stratix 10 MX FPGAs offer up to 10 times the memory bandwidth when compared with standalone DDR memory solutions... |
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Public LPWA Connections to Grow at a 206% CAGR to 2021, IHS Markit Says (2017.12.19) |
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Globally, public low power wide area (LPWA) connections are anticipated to reach over 1 billion by 2021, according to a new report by business information provider IHS Markit. This represents a 206 percent compound annual growth rate (CAGR) from 2014 to 2021, spurred by the need for low-power wireless network technology in Internet of Things (IoT) devices... |
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