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Overall ASP of DRAM Products to Go Up by 5% Sequentially in Q3, TrendForce Reports (2017.06.26)
DRAMeXchange, a division of TrendForce, reports that DRAM suppliers are now negotiating with their clients over the third-quarter contracts during this latter half of June. As there is no easing of undersupply in the DRAM market, prices continue to climb |
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ITRI Hosts Symposium on Trends of AI Technologies and Applications (2017.06.26)
TAIPEI, Taiwan - The Industrial Economics and Knowledge Center (IEK) of ITRI hosted a symposium on Trends of AI Technologies and Applications in Taipei on June 26, inviting AI experts from Stanford University and Silicon Valley to share their experiences on AI research and new business creation |
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Gaming Notebook PC Enjoys Booming Growth in China (2017.06.26)
The market size for the global digital games market is approximately USD 99.4 billion in 2016, and is expected to exceed USD 100 billion in 2017, according to Taipei-based IT research institute MIC (Market Intelligence & Consulting Institute) |
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Toshiba's New Three-phase Brushless Motor Drivers (2017.06.22)
Toshiba Corporation's Storage & Electronic Devices Solutions Company today announced the launch of the three-phase brushless motor drivers “TC78B015FTG” for 12V power supply and “TC78B015AFTG” for 24V power supply. The new ICs support high speed rotation of small fan motors suited to home appliances and industrial equipment |
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Prices of NOR Flash Products to Go Up by 20% Sequentially for Q3, TrendForce Says (2017.06.22)
Increasing demand for AMOLED panels from smartphone brands and the rising production of ICs for Touch with Display Driver Integration (TDDI) has propelled the growth of the NOR Flash market in the recent period, according to DRAMeXchange, a division of TrendForce |
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Cellphone IC Sales Will Top Total Personal Computing in 2017 (2017.06.22)
The ongoing slump in shipments of standard personal computers along with the drop-off in tablets are setting the stage for cellphone IC sales to finally surpass integrated circuit revenues in total personal computing systems this year, based on new forecasts in the recently released update of IC Insights’ 2017 IC Market Drivers Report |
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True Green LEDs in Tiny SMD 0603 ChipLED Package (2017.06.22)
The Optoelectronics group of Vishay Intertechnology, Inc. introduced a new series of true green LEDs in a compact surface-mount 0603 ChipLED package. Measuring 1.6 mm by 0.8 mm with an ultra thin 0.55 mm profile, the VLMTG1400 series devices utilize the most recent ultrabright InGaN chip technology to achieve industry-high luminous intensity up to 2,800 mcd |
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Samsung Begins Mass Production of First Exynos-branded IoT Solution (2017.06.22)
Samsung Electronics today announced the start of mass production of its first Exynos-branded Internet of Things (IoT) solution, the Exynos i T200. Built on a low-power 28-nanometer (nm) High-K Metal Gate (HKMG) process and featuring high processing capabilities along with Wi-Fi connectivity, the Exynos i T200 is an optimum IoT solution to deliver the performance needed for upcoming IoT use cases |
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New MOST Technology Intelligent Network Interface Controller (2017.06.21)
The newest MOST150 Intelligent Network Interface Controller (INIC) from Microchip Technology Inc. enables automotive manufacturers and tier one suppliers to incorporate Media Oriented Systems Transport (MOST) networks in a daisy-chain configuration on coaxial physical layer with the support of full-duplex communication, in addition to a ring topology |
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TYAN Launches AMD EPYC Processor-Based Server Platform (2017.06.21)
TYAN, an industry-leading server platform design manufacturer and subsidiary of MITAC Computing Technology Corporation, today introduced new AMD EPYC processor-based server solutions featuring large memory capacity and NVMe connectivity for high performance storage applications |
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DELO's New Acrylate, a True Allrounder for Sealbonding (2017.06.21)
DELO Industrial Adhesives has developed a light-curing acrylate with excellent peel resistance for seal-bonding. DELO PHOTOBOND GB4033 has features that make it suitable for universal use, for example, in electronic applications |
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Powerchip Reboots NOR Flash Production Capacity (2017.06.21)
TAIPEI, Taiwan - Taiwanese IC foundry Powerchip Technology Corporation yesterday announced that they are reestablishing their NOR Flash memory production capacity in order to provide their flagship customers with NOR Flash memory manufacturing and alleviate the current problem of tight supply and demand |
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Sprint and Samsung Test Massive MIMO Technology in South Korea (2017.06.21)
On the streets of Suwon, South Korea, Sprint and Samsung Electronics America, Inc. recently tested Massive MIMO (multiple input, multiple output) on 2.5 GHz spectrum. The Massive MIMO test represented a real-world application of the new technology, slated to help Sprint dramatically boost LTE Plus wireless capacity and coverage, and offer Gigabit LTE service to its customers |
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Acer Board Appoints Jason Chen as Chairman (2017.06.21)
TAIPEI, Taiwan - Acer today announces the appointment of Jason Chen as Chairman in addition to his continuing role as CEO. With his appointment, George Huang steps down from the chairmanship but remains on the Board. The changes were approved by the newly elected Board of Directors which convened after the annual shareholders’ meeting earlier today, and take immediate effect |
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Taiwanese Electronics Brands Aggressively Promote HDR, TrendForce Reports (2017.06.20)
According to WitsView, a division of TrendForce, HDR as a feature is now spreading into the PC market following its widespread adoption in the TV market last year. Demand growth of HDR-capable monitors for gaming is especially robust, and correspondingly Taiwan-based electronics brands are actively developing this market segment |
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Clientron Introduces Multi-Display Thin Client R800 and Q800 for VDI Solutions (2017.06.20)
TAIPEI, Taiwan - Clientron Corp., a provider of thin clients, POS and embedded systems, has unveiled its innovative R800 and Q800 for streamlined thin client applications. The innovative R800 and Q800 both feature a durable fanless design and a reliable embedded platform in an eco-friendly form factor compliant with Energy Star 6 |
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Fujitsu to Build Taiwan's Top-Performing Supercomputer for the National Research Lab (2017.06.20)
Fujitsu Limited and Fujitsu Taiwan Limited today announced that they will build a new supercomputer system for Taiwan's National Center for High-performance Computing, National Applied Research Laboratories (NCHC) that will have the highest performance in the country at the time it commences operations, scheduled for May 2018 |
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Metanoia's Gfast Products Certified by Broadband Forum & UNH-IOL (2017.06.19)
HSINSHU, Taipei - Metanoia Communications Inc. (Metanoia), a leading developer of very high-speed xDSL and Gfast PHY chipsets for the wireline broadband market, announced the successful completion of two important milestones today in its Gfast product strategy:
a) Being part of a real product deployment with its Gfast chip embedded into an SFP (Small Form-factor Pluggable) solution provided by Swisscom |
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GUC Successfully Rolls out HBM2 Total Solution (2017.06.19)
HISNCHU, Taiwan – Global Unichip, the custom ASIC company, has successful taped out a 16nm, second-generation High Bandwidth Memory (HBM) PHY and controller with verified interposer design and CoWoS Package. The innovative ultra-high capacity memory ASIC solution will meet the demanding requirements of artificial intelligence (AI), deep learning (DL), and a variety of high performance computing (HPC) applications |
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NAND Flash Controller Supplier Phison Opens Phase Three Plant in Zhunan (2017.06.19)
TAIPEI, Taiwan - Taiwanese NAND Flash controller and NAND solutions supplier Phison Electronics Corp. last week held an opening ceremony for their phase three chip plant in Zhunan. Following the completion of factory construction, Phison is expanding their workforce and strengthening their R&D and will continue to further enhance their Flash memory technology |
