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CTIMES / Electronics industry
Science and Technology
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Top up transmission-highlighting several digital d

Transmission technology into the digital era, users and manufacturers are increasingly focusing on the quality requirements of the digital display, digital display interface standard combination of hardware graphics card, and therefore more subject to the attention of the progress of its development.
Macronix Introduces New Ultra-High Performance OctaFlash Memory and Services (2017.08.08)
Macronix International announced the new Ultra-OctaFlash, following its initial launch in 2015. The new ultra-high performance OctaFlash Memory can perform at an operational frequency of 250MHz with 500MB/s read throughput, the fastest in the industry
Intel, Microsoft, Ericsson and Huawei to Deliver Keynotes at ECOC Exhibition (2017.08.08)
Some of the world’s leading technology companies will discuss the key issues and trends affecting the fibreoptics industry during this year’s European Conference on Optical Communications (ECOC) Exhibition’sMarket Focus
4.6% Sequential Monthly Gain for Average Contract Price of PC DRAM Modules in July (2017.08.07)
The average contract price of PC DRAM modules rose by nearly 40% sequentially in the first quarter to US$24 and then by more than 10% sequentially in the second quarter to US$27. Furthermore, the average contract price of PC DRAM modules increased by about 4
NEC, SMUD and SpaceTime Partner to Deliver Smart Energy Solutions for Electric Power Companies (2017.08.07)
NEC Corporation , SMUD and SpaceTime Insight (SpaceTime) have announced a new co-innovation business model and started offering smart energy solutions for electric power companies. NEC, SMUD and SpaceTime began their partnership (note 1) in 2015
CHPT Next Year to Launch 7-nm Test Product (2017.08.07)
TAIPEI, Taiwan - Taiwanese semiconductor testing services provider Chunghwa Precision Test Tech. Co. (CHPT) yesterday announced that next year they well launch a 7-nm testing product and also develop a PCB testing product for specialized applications in satellite and communications industries
Survey Finds Varied Autonomy and Safety Technology Preferences for New Vehicles, IHS Markit Says (2017.08.07)
According to IHS Markit research, on consumer preferences for full autonomy in new vehicles finds the technology is not yet popular among a broad audience. Ironically, the same audience ranked it among the very features they would be willing to pay the most for in their next new vehicle purchase
Microsemi Announces New Switchtec PAX Advanced Fabric PCIe Switch (2017.08.07)
Microsemi announced the availability of its Switchtec PAX advanced fabric Gen3 PCIe switch providing fabric connectivity for scalable, multi-host systems and just a bunch of flash (JBOF) supporting single root input/output (I/O) virtualization (SR-IOV), NVMe and multi-function endpoints
Clientron to Display POS Terminals with NFC Multi-Payment Solution at RetailNOW 2017 (2017.08.04)
TAIPEI, Taiwan - Clientron Corp., announced it will be displaying its full range of POS product innovations to comply with multi-payment solutions and various POS peripherals at RetailNOW 2017, which will take place on Aug. 7-8
New Flagship Launches in 2017H2 will Drive Growth in the PRC Smartphone Market, says IDC (2017.08.04)
According to the IDC Quarterly Mobile Phone Tracker reveals, 111.8 million smartphones were shipped to China in 2017Q2, and the year-on-year (YoY) growth was flat this quarter. After the extremely high 2016Q4 which saw OPPO, vivo and Huawei launching popular flagships that helped to drive replacement growth, the market has started to slow down
Broadcom Announces High-Performance Data Center SoC with Integrated NetXtreme Ethernet Controller (2017.08.04)
The Broadcom NetXtreme S-Series BCM58800 family of data center System-on-Chip (SoC) devices are purpose-built to enable solutions in the evolving data center. The devices integrate networking and processing subsystems for a wide range of data center applications including programmable NIC (or Smart NIC) for data plane acceleration and high-performance Flash storage disaggregation using NVMe-over-Fabrics (NVMe-oF)
Global Smartphone Production Volume Reached 324 Million Units in Q3, TrendForce Reports (2017.08.03)
The global smartphone production volume reached 324 million units in the second quarter, according to TrendForce. Samsung, Apple and Huawei retained first, second and third place, respectively, in the worldwide production volume ranking for the period
Panasonic Develops Drowsiness-Control Technology by Detecting and Predicting Driver's Level of Drows (2017.08.03)
Panasonic Corporation announced today that it has developed a drowsiness-control technology for detecting and predicting a person's level of drowsiness and allowing to stay comfortably awake. This technology, which can help prevent drowsy driving, detects a driver's shallow drowsiness at the initial state by accurately measuring the driver's states without physical contact, including blinking features and facial expressions, etc
Toshiba Memory Unveils 64-Layer, 3D Flash Memory, Single Package NVMe Client SSD (2017.08.03)
Toshiba Memory Corporation today announced the launch of the BG3 series, a new line-up of single package NVM Express (NVMe) client SSDs integrating Toshiba Memory Corporation’s cutting-edge 64-layer, 3-bit-per-cell (TLC) BiCS FLASH and controller in a ball grid array (BGA) package
ASUSTOR and NAKIVO Launch Comprehensive Virtual Machine Backup Solution (2017.08.03)
ASUSTOR has announced that it has partnered with world renowned virtual backup company NAKIVO to provide a data protection solution for virtual machines. Users can now install the NAKIVO Backup & Replication App on their NAS to leverage its hardware and storage and turn it into a virtual machine backup center
Latest Fab Plans in China Need Government Subsidies to Minimize Risks of Losses in Short/Medium Term (2017.08.03)
According to TrendForce’s research on semiconductor fab plans in China after 2016 finds that a total 17 new fabs are slated for construction so far. Five of these plants will be for processing 8-inch wafers and the remaining 12 plants will be for processing 12-inch wafers
TI Introduces 0.2-inch DLP2000 Chipset and $99 DLP LightCrafter EVM (2017.08.02)
Texas Instruments (TI) introduced new 0.2-inch DLP2000 chipset and $99 DLP LightCrafter Display 2000 evaluation module (EVM) now make it more affordable to leverage DLP technology and design on-demand, free-form display applications such as mobile smart TVs; pico projectors; digital signage; projection displays for smart homes
Semiconductor Capital Spending Is Forecast to Grow 10.2% in 2017, Gartner Says (2017.08.02)
Worldwide semiconductor capital spending is projected to increase 10.2 percent in 2017, to $77.7 billion, according to Gartner, Inc. This growth rate is up from the previous quarter's forecast of 1.4 percent, due to continued aggressive investment in memory and leading-edge logic which is driving spending in wafer-level equipment
Global Unichip Achieves SGS-TUV ISO26262 Certification (2017.08.02)
HISNCHU, Taiwan - Global Unichip Corp. (GUC), announced that the company acquired its recent designation as an ISO26262-certified supplier. GUC Functional Safety Design Flow recently earned ISO 26262 ASIL-D certification from Germany SGS-TUV and now provides a complete, certified automotive safety design service
Littelfuse Compact Auto-Grade ESD Suppressors Protects Against Transients up to 30kV (2017.08.02)
Littelfuse announced a surface-mount, polymer automotive-grade electrostatic discharge suppressors capable of protecting sensitive devices from contact/air discharges as high as 30kV. The AXGD Series XTREME-GUARD ESD Suppressors are specifically designed for high-frequency, high-speed applications with high voltage ratings (up to 32VDC) and extreme ESD protection requirements
DRAM, NAND Flash Memory Markets Drive the First Annual Double-digit Upturn since 2010 (2017.08.02)
Entering the second half of the year, it is clear the IC industry is on course for a much stronger upturn than was initially forecast in January. According to IC Insights’ reports, the IC market to increase 16% in 2017 due to exceptional growth in the DRAM and NAND flash memory markets

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4 u-blox Positioning Solutions Available on NVIDIA Jetson Edge AI and DRIVE Hyperion platforms
5 Grundfos and YCM Partner to Accelerate Smart and Energy-Efficient Machine Tool
6 NSTC Minister Meets with Czech Republic Minister of Science, Re-search and Innovation
7 ITRI to Cultivate Green Talents and Bridge Taiwan's Power Gap

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